Abstract: An information processing apparatus includes: a deterioration degree calculation unit that calculates a deterioration degree in quality of an image; a deterioration factor classification unit that classifies a deterioration factor that is a factor of deterioration in the quality of the image; and a quality score calculation unit that calculates a quality score indicating the quality of the image, on the basis of the deterioration degree and the deterioration factor. According to such an information processing apparatus, the quality of the image can be properly evaluated.

Abstract: An information processing apparatus includes: a guide generation unit that generates guide information about capturing a target image on the basis of the target image; a guide output unit that outputs the guide information; and a guide evaluation unit that evaluates the guide information on the basis of the target image captured before and after an output of the guide information. According to the information processing apparatus, the guide information may be properly evaluated.

Abstract: A semiconductor-chip-encapsulating resin composition according to the present disclosure contains: an epoxy resin; a curing agent; and a low-valent titanium oxide, of which a titanium atom has an oxidation number less than +IV. A semiconductor package according to the present disclosure includes: a semiconductor chip; and an encapsulation resin which covers the semiconductor chip and which is a cured product of the semiconductor-chip-encapsulating resin composition.

Abstract: An epoxy resin composition contains an epoxy resin and a curing agent. The epoxy resin includes an epoxy resin expressed by the following Formula (1), where R1 represents a divalent organic group having a carbon number of two or more. Content of the epoxy resin expressed by Formula (1) with respect to a total mass of the epoxy resin is 50% by mass or more. The curing agent contains a phenolic resin expressed by the following Formula (2): where R2 represents a divalent organic group having a carbon number of one or more and R3-R10 each independently represent a hydrogen atom, a hydroxyl group, or an allyl group.

Abstract: A semiconductor-chip-encapsulating resin composition according to the present disclosure contains: an epoxy resin; a curing agent; and a low-valent titanium oxide, of which a titanium atom has an oxidation number less than +IV. A semiconductor package according to the present disclosure includes: a semiconductor chip; and an encapsulation resin which covers the semiconductor chip and which is a cured product of the semiconductor-chip-encapsulating resin composition.

Abstract: The present invention provides a film including, in at least a part thereof, a layer comprising an ethylene-based resin, which is a copolymer of ethylene and an ?-olefin of 4 to 10 carbon atoms, and satisfies the following requirements (1) to (5) at the same time or an ethylene-based resin composition containing the resin; (I) the melt flow rate at 190° C. under a load of 2.16 kg is in the range of 0.1 to 50 g/10 min, (II) the density is in the range of 875 to 970 kg/m3, (III) the ratio of a melt tension at 190° C. to a shear viscosity at 200° C. and an angular velocity of 1.0 rad/sec is in the range of 1.00×10?4 to 9.00×10?4, (IV) the sum of the number of methyl branches and the number of ethyl branches, each number being based on 1000 carbon atoms and measured by 13C-NMR, is not more than 1.8, and (V) the zero shear viscosity [?0(P)] at 200° C. and the weight-average molecular weight (Mw) as measured by a GPC-viscosity detector method (GPC-VISCO) satisfy the following relational formula (Eq-1): 0.

Abstract: The present invention provides an ethylene polymer that has excellent fluidity and moldability as well as gives a molded product having excellent mechanical strength. The ethylene polymer of the present invention contains 0.02 to 1.50 mol % of a constitutional unit derived from ?-olefin having 6 to 10 carbon atoms, and has the density of 945 to 975 kg/m3, which satisfies both of the following requirements [1] and [2] simultaneously: [1] in CFC, all the components having a molecular weight of 100,000 or more are eluted at a temperature of 85° C. or higher; and [2] the components eluted at a temperature of 80° C. or lower account for up to 5% of all the components eluted in CFC.

Abstract: An ethylene polymer containing 0.01 to 1.20 mol % of a constitutional unit derived from ?-olefin having 6 to 10 carbon atoms, wherein with respect to cross fractionation chromatography (CFC), either (1) the weight average molecular weight (Mw) of the components eluted at 73 to 76° C. does not exceed 4,000, or (2) the ethylene polymer satisfies the following relationship (Eq-1), provides a molded product having excellent moldability and therefore excellent mechanical strength and appearance: Sx/Stotal?0.1??(Eq-1) wherein Sx is the sum of the total peak areas related to the components eluted at 70 to 85° C., and Stotal is the sum of the total peak areas related to the components eluted at 0 to 145° C.

Abstract: The present invention provides a film including, in at least a part thereof, a layer comprising an ethylene-based resin, which is a copolymer of ethylene and an ?-olefin of 4 to 10 carbon atoms, and satisfies the following requirements (1) to (5) at the same time or an ethylene-based resin composition containing the resin; (I) the melt flow rate at 190° C. under a load of 2.16 kg is in the range of 0.1 to 50 g/10 min, (II) the density is in the range of 875 to 970 kg/m3, (III) the ratio of a melt tension at 190° C. to a shear viscosity at 200° C. and an angular velocity of 1.0 rad/sec is in the range of 1.00×10?4 to 9.00×10?4, (IV) the sum of the number of methyl branches and the number of ethyl branches, each number being based on 1000 carbon atoms and measured by 13C-NMR, is not more than 1.8, and (V) the zero shear viscosity [?0(P)] at 200° C. and the weight-average molecular weight (Mw) as measured by a GPC-viscosity detector method (GPC-VISCO) satisfy the following relational formula (Eq-1): 0.

Abstract: Provided is an ethylene polymer of the present invention, which is a copolymer of ethylene and an ?-olefin having 4 to 10 carbon atoms, and satisfies the following conditions [1] to [4] simultaneously: [1] an MFR is in the range of 0.10 to 100 g/10 min, [2] a density (D) is in the range of 860 to 930 kg/m3, [3] a ratio (Mw/Mn) of the weight average molecular weight to the number average molecular weight is in the range of 1.50 or more and 3.00 or less, and [4] it satisfies a specific relationship, in accordance with the MFR value of the condition [1], between the ratio (H/W) of the height (H) of a peak having a highest peak intensity to the width (W) at a half of the height of the peak having the highest peak intensity for an elution curve obtained by a temperature rising elution fractionation, and the density (D).

Abstract: An ethylene-?-olefin copolymer for a film or sheet satisfying the following requirements [1] to [5] simultaneously is excellent in transparency and moldability and is suitably used for a film or sheet excellent in mechanical strength. [1] The density (d) is in the range of 890 to 980 kg/m3. [2] The intrinsic viscosity ([?]) measured at 135° C. in decalin is in the range of 0.5 to 10 dl/g. [3] The ratio of weight average molecular weight (Mw) to number average molecular weight (Mn) (Mw/Mn) measured by GPC is in the range of 2.0 to 50. [4] In an elution temperature-elution amount curve given by cross fractionation chromatography (CFC), the difference between a temperature at which the integrated elution amount is 1% by mass and a temperature at which the integrated elution amount is 40% by mass is 12° C. or less, wherein the total elution amount is 100% by mass. [5] The amount of a component soluble in decane is 0.5% by mass or less.

Abstract: The present invention provides an ethylene polymer that has excellent fluidity and moldability as well as gives a molded product having excellent mechanical strength. The ethylene polymer of the present invention contains 0.02 to 1.50 mol % of a constitutional unit derived from ?-olefin having 6 to 10 carbon atoms, and has the density of 945 to 975 kg/m3, which satisfies both of the following requirements [1] and [2] simultaneously: [1] in CFC, all the components having a molecular weight of 100,000 or more are eluted at a temperature of 85° C. or higher; and [2] the components eluted at a temperature of 80° C. or lower account for up to 5% of all the components eluted in CFC.

Abstract: An ethylene polymer containing 0.01 to 1.20 mol % of a constitutional unit derived from ?-olefin having 6 to 10 carbon atoms, wherein with respect to cross fractionation chromatography (CFC), either (1) the weight average molecular weight (Mw) of the components eluted at 73 to 76° C. does not exceed 4,000, or (2) the ethylene polymer satisfies the following relationship (Eq-1), provides a molded product having excellent moldability and therefore excellent mechanical strength and appearance: Sx/Stotal?0.1??(Eq-1) wherein Sx is the sum of the total peak areas related to the components eluted at 70 to 85° C., and Stotal is the sum of the total peak areas related to the components eluted at 0 to 145° C.