Patents by Inventor Takahiro Amamiya

Takahiro Amamiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10030085
    Abstract: A resin composition for a solar cell encapsulant containing an ethylene.?-olefin copolymer and an organic peroxide or a silane coupling agent or the like, and having superior heat resistance, transparency, flexibility and adhesion property to a glass substrate, as well as good balance between rigidity and cross-linking efficiency, the solar cell encapsulant and a solar cell module using the same. It is provided by a resin composition for the solar cell encapsulant characterized by containing the ethylene.?-olefin copolymer (A) having the characteristics of the following (a1) to (a5), and the organic peroxide (B) and/or the silane coupling agent (C). (a1) a density of 0.860 to 0.920 g/cm3 (a2) a ratio, (Mz/Mn), of Z average molecular weight (Mz) and number average molecular weight (Mn) determined by a gel permeation chromatography (GPC), of 8.0 or less (a3) a melt viscosity (?*1) measured at 100° C. under a shear rate of 2.43×10 s?1 of 1.2×105 poise or more (a4) a melt viscosity (?*2) measured at 100° C.
    Type: Grant
    Filed: June 23, 2011
    Date of Patent: July 24, 2018
    Assignee: Japan Polyethylene Corporation
    Inventors: Takahiro Amamiya, Tamami Onaka
  • Patent number: 8697984
    Abstract: A resin composition for a solar cell encapsulant is provided, containing an ethylene•?-olefin copolymer and an organic peroxide or a silane coupling agent or the like, and having superior heat resistance, transparency, flexibility and adhesion property to a glass substrate, as well as good balance between rigidity and cross-linking efficiency, as well as a solar cell encapsulant, and a solar cell module using the same. The resin composition has an ethylene•?-olefin copolymer (A), having the characteristics (a1) to (a4), along with characteristics (a5) or (a6), and an organic peroxide (B) and/or a silane coupling agent (C).
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: April 15, 2014
    Assignee: Japan Polyethylene Corporation
    Inventors: Takahiro Amamiya, Tamami Onaka
  • Publication number: 20130167909
    Abstract: A solar cell encapsulant used the resin component containing an ethylene.?-olefin copolymer and a copolymer of ethylene-a functional group-containing monomer, having good productivity, superior transparency, and also superior modulus of elasticity in tension, heat resistance, adhesive property and steam transmittance resistance, and the solar cell module using the same. It is provided by the solar cell encapsulant, characterized by using a resin composition comprising a component (A) and a component (B), satisfying the following formula (x), as resin components, or the like: (a1) a density of 0.860 to 0.920 g/cm3 ?480×[d]+425?[CM]??480×[d]+433??Expression (x) (wherein [d] represents density of the component (A); and [CM] represents comonomer content (mol %) of the component (B)).
    Type: Application
    Filed: June 24, 2011
    Publication date: July 4, 2013
    Applicant: JAPAN POLYETHYLENE CORPORATION
    Inventors: Takahiro Amamiya, Tamami Onaka, Tomoaki Maeyama, Takuya Matsumoto
  • Publication number: 20130137833
    Abstract: A resin composition for a solar cell encapsulant containing an ethylene.?-olefin copolymer and an organic peroxide or a silane coupling agent or the like, and having superior heat resistance, transparency, flexibility and adhesion property to a glass substrate, as well as good balance between rigidity and cross-linking efficiency, the solar cell encapsulant and a solar cell module using the same. It is provided by a resin composition for the solar cell encapsulant characterized by containing the ethylene.?-olefin copolymer (A) having the characteristics of the following (a1) to (a5), and the organic peroxide (B) and/or the silane coupling agent (C). (a1) a density of 0.860 to 0.920 g/cm3 (a2) a ratio, (Mz/Mn), of Z average molecular weight (Mz) and number average molecular weight (Mn) determined by a gel permeation chromatography (GPC), of 8.0 or less (a3) a melt viscosity (?*1) measured at 100° C. under a shear rate of 2.43×10 s?1 of 1.2×105 poise or more (a4) a melt viscosity (?*2) measured at 100° C.
    Type: Application
    Filed: June 23, 2011
    Publication date: May 30, 2013
    Applicant: JAPAN POLYETHYLENE CORPORATION
    Inventors: Takahiro Amamiya, Tamami Onaka
  • Publication number: 20120000514
    Abstract: A resin composition for a solar cell encapsulant is provided, containing an ethylene•?-olefin copolymer and an organic peroxide or a silane coupling agent or the like, and having superior heat resistance, transparency, flexibility and adhesion property to a glass substrate, as well as good balance between rigidity and cross-linking efficiency, as well as a solar cell encapsulant, and a solar cell module using the same. The resin composition has an ethylene•?-olefin copolymer (A), having the characteristics (a1) to (a4), along with characteristics (a5) or (a6), and an organic peroxide (B) and/or a silane coupling agent (C).
    Type: Application
    Filed: March 31, 2010
    Publication date: January 5, 2012
    Applicant: Japan Polyethylene Corporation
    Inventors: Takahiro Amamiya, Tamami Onaka
  • Publication number: 20050271851
    Abstract: A release agent for forming a release layer contacting with an adhesive layer, comprising (A) a polyolefin having a weight-average molecular weight of not less than 1×104, which may contain a functional group, and (B) a hydrocarbon having a viscosity of 1 to 1×104 cP as measured at 23° C. according to JIS K-7117, a weight ratio of the polyolefin (A) to the hydrocarbon (B) being 97:3 to 60:40. Such a release agent provides a novel release agent that is usable as an alternative material of a silicone-based and fluororesin-based release agents.
    Type: Application
    Filed: May 25, 2005
    Publication date: December 8, 2005
    Applicant: Mitsubishi Chemical Corporation
    Inventors: Keisuke Shibatou, Satoru Yamamoto, Motohiro Seki, Koutarou Nozawa, Etsushi Akashige, Takahiro Amamiya