Patents by Inventor Takahiro Asano

Takahiro Asano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6409562
    Abstract: The invention relates to a method of disassembling a plasma display panel (“PDP”) for reutilization. A first method uses a component, which is thermally not contractible at a softening temperature of bonding material used for hermetically bonding a front and back plates, and positioned between the plates. The above component maintains or widens a space provided between the two plates when the PDP is heated, thereby facilitating disassembly of the PDP. The invention also provides a groove on a surface of either or both plates for communicating the bonding material to an exterior of the PDP. Softened bonding material can be drawn out or absorbed through the groove. Heating and cooling of the PDP may be made through a laminated graphite sheet placed on a surface of the PDP for uniformalizing thermal distribution. A second method separates a PDP into two plates by immersing the PDP in etching solution capable of selectively dissolving only lead glass, and melting the bonding material.
    Type: Grant
    Filed: July 12, 2000
    Date of Patent: June 25, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takahiro Asano, Narito Shibaike, Yoshio Watanabe, Tetsuya Kato
  • Patent number: 6396665
    Abstract: A plurality of connecting pads are provided at an extended end portion of a main FPC, and a solder bump is formed on each connecting pad. A plurality of openings corresponding to the solder bumps are formed on a connecting end portion of a relay FPC. Second electrode pads of the connecting end portion project into the respective openings so as to close a part of each opening. Each of the second electrode pads contacts with the corresponding bump through the opening. By directly heating the second electrode pad through the opening, so that the solder bump is melted and each electrode pad is soldered to the corresponding connecting pad.
    Type: Grant
    Filed: January 14, 2000
    Date of Patent: May 28, 2002
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Takahiro Asano
  • Patent number: 6353288
    Abstract: The invention relates to a method of disassembling a plasma display panel (“PDP”) for reutilization. A first method uses a component, which is thermally not contractible at a softening temperature of bonding material used for hermetically bonding a front and back plates, and positioned between the plates. The above component maintains or widens a space provided between the two plates when the PDP is heated, thereby facilitating disassembly of the PDP. The invention also provides a groove on a surface of either or both plates for communicating the bonding material to an exterior of the PDP. Softened bonding material can be drawn out or absorbed through the groove. Heating and cooling of the PDP may be made through a laminated graphite sheet placed on a surface of the PDP for uniformalizing thermal distribution. A second method separates a PDP into two plates by immersing the PDP in etching solution capable of selectively dissolving only lead glass, and melting the bonding material.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: March 5, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takahiro Asano, Narito Shibaike, Yoshio Watanabe, Tetsuya Kato
  • Patent number: 5838519
    Abstract: A bump of an electrically conductive metal protrudes from an electrode pad of a junction FPC. The bump includes a lead portion that penetrates a conductor pattern and a base layer of the junction FPC and projects on the back side of the base layer. A spare solder layer is formed on the surface of the bump. In soldering the electrode pad of the junction FPC to a connecting pad of a main FPC, the bump and the connecting pad are opposed to each other, and a heat source is pressed against the lead portion of the bump from the side of the base layer of the junction FPC. Heat is transmitted to the spare solder layer through the lead portion and the bump, whereupon the spare solder layer is melted for soldering.
    Type: Grant
    Filed: September 12, 1997
    Date of Patent: November 17, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Toshimitsu Takizawa, Takahiro Asano, Nobuyuki Tanaka
  • Patent number: 5758402
    Abstract: The wire handling apparatus of the present invention comprises a length measuring unit, a first clamp mechanism and a second clamp mechanism, a cutter mechanism, a first terminal pressing mechanism and a second terminal pressing mechanism, a first carrier mechanism and a second carrier mechanism, and a wire discharge mechanism, and synchronous moving means for upwardly/downwardly moving a receiving clamp part of the wire discharge mechanism in synchronization with upward/downward movement of a clamp part of the said second clamp mechanism in a terminal pressing operation of the said second terminal pressing mechanism is provided while the position of the said receiving clamp part is coincided with the position of a coated wire so that grasping of the coated wire by the receiving clamp part is enabled in the terminal pressing operation of the second terminal pressing mechanism.
    Type: Grant
    Filed: December 12, 1996
    Date of Patent: June 2, 1998
    Assignee: ShinMaywa Industries, Ltd.
    Inventors: Takahiro Asano, Masahiro Ikeji, Nobuo Sato, Tetsuya Yano, Daisuke Morimoto
  • Patent number: 5636091
    Abstract: A hard disk drive includes a casing and a cover closing a top opening of the casing. In the casing are arranged a magnetic disk, magnetic heads for recording and reproducing information on and from the disk, a carriage supporting the magnetic heads, and a voice coil motor having a magnet, for driving the carriage. The cover is formed of a material with a high magnetic permeability and constitutes a magnetically permeable section which faces the magnet and allows a magnetic flux from the magnet to flow in the permeable section.
    Type: Grant
    Filed: December 23, 1994
    Date of Patent: June 3, 1997
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Takahiro Asano
  • Patent number: 5389477
    Abstract: A photosensitive material for electrophotography comprises a conductive support and a photosensitive layer formed on the conductive support, the photosensitive layer being made of X-type metal-free phthalocyanine, a resin binder, and an essential additive effective for improving electrophotographic or photosensitive characteristics or durability in repeated use wherein the X-type metal-free phthalocyanine is dispersed in the resin binder partly in a molecular state and partly in a particulate state. The essential additive includes electrolytically polymerized products, certain kinds of dyes, silane or polysilane compounds, hole and electron transport substances, titanyl or vanadyl phthalocyanine, electron acceptors, perylene compounds, amine derivatives, amino compounds, zinc oxide or the like.
    Type: Grant
    Filed: September 10, 1992
    Date of Patent: February 14, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Sohji Tsuchiya, Atsushi Omote, Hiroki Kusayanagi, Yoshimasa Itoh, Takahiro Asano
  • Patent number: 5364059
    Abstract: An equipment support structure capable of permitting the vertical arrangement or orientation of a damper spring to be readily carried out irrespective of the posture of setting of an equipment, A damper link which is pivotally moved depending upon the position of setting of an equipment is pivotally mounted at the proximal end thereof on one of the equipment and mount for supporting the equipment through dampers and a damper spring is provided between the damper link and the other of the mount and equipment for offsetting load applied from the equipment to the dampers and operatively connected to the damper ling so as to be pivotally moved in association with the damper link.
    Type: Grant
    Filed: November 8, 1990
    Date of Patent: November 15, 1994
    Assignee: Clarion Co., Ltd.
    Inventors: Shigeo Kinoshita, Takahiro Asano, Sadamu Matsuda, Wataru Watanabe
  • Patent number: 5321687
    Abstract: A drive arrangement effects movement of a disk conveying portion to a plurality of first positions and to a second position relative to a case and a rotatable turntable. The drive arrangement includes a driving gear, a slide member having a gear portion engaging the driving gear, and a movable slide plate engaged by the slide member, the slide plate having a stepwise cam portion which effects movement of the disk conveying portion between its positions. The disk conveying portion has two rotatable rollers which can engage an edge of a disk in the case when the disk conveying portion is in one of its first positions, and which rotate in order to extract the disk. As the disk conveying portion moves to its second position, the disk supported by the rollers moves to the turntable, and a clamp member is moved from a retracted position to a clamping position to hold the disk against the turntable, after which the rollers are disengaged from the disk.
    Type: Grant
    Filed: June 30, 1993
    Date of Patent: June 14, 1994
    Assignee: Clarion Co., Ltd.
    Inventors: Shigeo Kinoshita, Shigeru Tsuda, Takahiro Asano, Sadamu Matsuda
  • Patent number: 5276668
    Abstract: A disk selecting mechanism is disclosed, in which a slide plate is moved forward and backward by driving a slide link by means of a driving gear and a disk conveying portion is moved according thereto in the up and downward direction by a stepwise cam portion disposed on the slide link so as to set it at an arbitrary position in the up and downward direction, in order to select an arbitrary disk from a magazine.
    Type: Grant
    Filed: January 24, 1991
    Date of Patent: January 4, 1994
    Assignee: Clarion Co., Ltd.
    Inventors: Shigeo Kinoshita, Shigeru Tsuda, Takahiro Asano, Sadamu Matsuda
  • Patent number: 5226224
    Abstract: The points of second cutters (153) are disposed within a gap (E) generated by moving an electric wire (600a) longitudinally after the formation of a first slit (610), and subsequently the electric wire (600a) is moved longitudinally to form a split slit (620) for removing sheath in an intermediate region. The first slit (610) and a second slit (630) are formed at positions deviated in one direction respectively from both ends of the intermediate region (600S), and the electric wire is moved longitudinally with first cutters (103) remaining stuck in the sheath at one end thereof, so that waste strip is removed.
    Type: Grant
    Filed: May 20, 1991
    Date of Patent: July 13, 1993
    Assignee: Shin Meiwa Industry Co., Ltd.
    Inventors: Yasumasa Ishizuka, Etsushi Shigetomo, Takahiro Asano
  • Patent number: 5173330
    Abstract: A patterning composition is prepared by mixing a metallic salt of organic acid which separates a metal when reduced (e.g. copper (II) heptanoate), a reducing agent (e.g., 4-methoxy-1-naphthol), which shows reducing activity by being heated and loses the reducing activity by being irradiated by UV light, visible light or infrared light, gelatin and water, the composition is applied on a substrate, and the coating is irradiated by UV or visible infrared light through a mask and then heated, thereby to deposit metal in a pattern.
    Type: Grant
    Filed: April 3, 1990
    Date of Patent: December 22, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takahiro Asano, Shinichi Mizuguchi, Toshio Ishikawa
  • Patent number: 5145715
    Abstract: Light transmission paste and a metallic copper deposition method of the present invention can educe metallic copper in the desired portion by applying or contacting light transmission paste on cuprous oxide and applying light upon the desired portion. Also, the light is applied through a mask corresponding to the pattern to be obtained, so that desired circuit pattern may be easily obtained. Further, metallic copper of high density may be educed by the contacting or applying metal deposition paste upon metal of a substrate.
    Type: Grant
    Filed: August 17, 1990
    Date of Patent: September 8, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takahiro Asano, Shinichi Mizuguchi
  • Patent number: 5031475
    Abstract: A power mechanism used in a tape recorder for mode changes, etc. does not use a solenoid plunger, but uses a simple arrangement which includes a select plate having a swing portion which swings between a shift position for shifting an operated member and a release position for releasing the operated member when the select plate advances with a rotating force of a power cam and includes a guide mechanism for guiding the swing portion toward the shift and release positions.
    Type: Grant
    Filed: January 26, 1990
    Date of Patent: July 16, 1991
    Assignee: Clarion Co., Ltd.
    Inventors: Kazuki Takai, Takahiro Asano, Wataru Watanabe
  • Patent number: 4689756
    Abstract: Velocity, at which a work point of a robot passes through respective reference points, has previously been given magnitude and directions dependent on a relative positional relation between a plurality of continuous reference points. The work point passes through the respective reference points. Between adjacent reference points, interpolation arithmetic is performed along the above condition, whereby the work point defines a smooth locus in accordance with the result of the arithmetic.
    Type: Grant
    Filed: June 14, 1985
    Date of Patent: August 25, 1987
    Assignee: Shin Meiwa Industry Co., Ltd.
    Inventors: Hideo Koyama, Takahiro Asano, Fumio Noguchi, Shigeki Fujinaga