Abstract: A steam generating container A heated by a heat source includes: a water evaporation chamber into which water is supplied by a water supply device; a leading opening to lead steam from the water evaporation chamber, and ejection openings ejecting steam led through the leading opening into a heating chamber containing food. A buffer chamber connecting through the leading opening and with the ejection openings is provided between the water evaporation chamber and the heating chamber. Even when bumping water enters the buffer chamber through the leading opening, the bumping water having entered flows inside the buffer chamber. Thus, the bumping water is hardly ejected into the heating chamber through the ejection openings.

Abstract: An optical semiconductor device package includes a circuit board in which a first metal, a second metal, and a third metal are sequentially stacked in an optical semiconductor element mounting region. The first metal has a first standard electrode potential. The second metal is disposed on a portion of an upper surface of the first metal and has a second standard electrode potential that is greater than the first standard electrode potential. The third metal is disposed on the upper surface of the first metal and an upper surface of the second metal and has a third standard electrode potential that is greater than the first standard electrode potential and less than the second standard electrode potential.

Abstract: An optical semiconductor device package includes a circuit board in which a first metal, a second metal, and a third metal are sequentially stacked in an optical semiconductor element mounting region. The first metal has a first standard electrode potential. The second metal is disposed on a portion of an upper surface of the first metal and has a second standard electrode potential that is greater than the first standard electrode potential. The third metal is disposed on the upper surface of the first metal and an upper surface of the second metal and has a third standard electrode potential that is greater than the first standard electrode potential and less than the second standard electrode potential.

Abstract: A steam generating container A heated by a heat source includes: a water evaporation chamber into which water is supplied by a water supply device; a leading opening to lead steam from the water evaporation chamber, and ejection openings ejecting steam led through the leading opening into a heating chamber containing food. A buffer chamber connecting through the leading opening and with the ejection openings is provided between the water evaporation chamber and the heating chamber. Even when bumping water enters the buffer chamber through the leading opening, the bumping water having entered flows inside the buffer chamber. Thus, the bumping water is hardly ejected into the heating chamber through the ejection openings.

Abstract: A semiconductor device and manufacturing method therefor, provided with the aims of constraining resin burr formation while having good electric connectivity and joining strength, and LED device, provided with the aim of improving adhesion between silicon resin and leads while having good luminescent characteristics. For these purposes, an organic film is formed through self-assembly by functional organic molecules at surface border regions of outer leads of a QFP. The functional organic molecules consist of a first functional group bonding with metals, a principal chain, and a second functional group inducing hardening in thermosetting resins. The principal chain consists of a glycol chain, or else of a glycol chain and one or more among methylene, fluoromethylene, or siloxane chains. The principal chain also preferably includes one or more among a hydroxyl radical, ketone, thioketone, primary amine, secondary amine, and aromatic compounds.

Abstract: A steam generating container A heated by a heat source includes: a water evaporation chamber into which water is supplied by a water supply device; a leading opening to lead steam from the water evaporation chamber, and ejection openings ejecting steam led through the leading opening into a heating chamber containing food. A buffer chamber connecting through the leading opening and with the ejection openings is provided between the water evaporation chamber and the heating chamber. Even when bumping water enters the buffer chamber through the leading opening, the bumping water having entered flows inside the buffer chamber. Thus, the bumping water is hardly ejected into the heating chamber through the ejection openings.

Abstract: There is provided a semiconductor device that suppresses the occurrence of resin burrs and has favorable electrical connectivity and bond strength, and a manufacturing method for such semiconductor device. A resin-coated metal part is manufactured by forming an organic coating by depositing a material including functional organic molecules on a wiring lead composed of a metallic material. Each of the functional organic molecules includes a main chain, a first functional group having a metal bonding property, and a second functional group. The first functional group and the second functional group are provided at different ends of the main chain. Thereafter the functional organic molecules self-assemble by bonding of the first functional groups to metal atoms of the wiring lead. After performing the organic coating formation step, resin is adhered to a predetermined surface area of the wiring lead having the organic coating formed thereon.

Abstract: A semiconductor device and manufacturing method therefor, provided with the aims of constraining resin burr formation while having good electric connectivity and joining strength, and LED device, provided with the aim of improving adhesion between silicon resin and leads while having good luminescent characteristics. For these purposes, an organic film is formed through self-assembly by functional organic molecules at surface border regions of outer leads of a QFP. The functional organic molecules consist of a first functional group bonding with metals, a principal chain, and a second functional group inducing hardening in thermosetting resins. The principal chain consists of a glycol chain, or else of a glycol chain and one or more among methylene, fluoromethylene, or siloxane chains. The principal chain also preferably includes one or more among a hydroxyl radical, ketone, thioketone, primary amine, secondary amine, and aromatic compounds.

Abstract: A semiconductor device and manufacturing method therefor, provided with the aims of constraining resin burr formation while having good electric connectivity and joining strength, and LED device, provided with the aim of improving adhesion between silicon resin and leads while having good luminescent characteristics.

Abstract: The present invention aims to make possible facile removal of resin burrs without the risk of damaging resin body covering a wiring lead in a semiconductor device. In detail, the semiconductor device 10 has a structure in which a semiconductor element is mounted on the wiring lead 10, the wiring lead 10 including a metal plate with metal coating applied to the outer surface thereof. The peripheral region 15 of the wiring lead 11 is covered with an organic coating including purine skeleton compounds. The organic coating is formed through the self-assembling of functional organic compounds each having a structure in which a purine skeleton has at an end thereof a functional group having a metal bonding property.

Abstract: A steam generating container A heated by a heat source includes: a water evaporation chamber into which water is supplied by a water supply device; a leading opening to lead steam from the water evaporation chamber, and ejection openings ejecting steam led through the leading opening into a heating chamber containing food. A buffer chamber connecting through the leading opening and with the ejection openings is provided between the water evaporation chamber and the heating chamber. Even when bumping water enters the buffer chamber through the leading opening, the bumping water having entered flows inside the buffer chamber. Thus, the bumping water is hardly ejected into the heating chamber through the ejection openings.

Abstract: Provided are a semiconductor device lead frame and a method of manufacturing of the same that improve adhesive properties between plating layers when a plurality of plating layers are laminated, that control deterioration in wire bonding properties during the manufacturing process of a semiconductor device and worsening of solderability during packaging, and that effectively reduce manufacturing cost. Specifically, the lead frame (2a, 2b) has a laminated structure that includes a lower plating layer (22) formed on a conductive base material (21) and an uppermost plating layer (23), with an organic film (22) that has metal-binding properties formed between the lower plating layer (21) and the uppermost plating layer (23). The organic film (22) is formed as a monomolecular film in which functional organic molecules (11) self assemble. Each of the organic molecules (11) has functional groups (A1, A1) with metal-binding properties on both ends of a main chain (B1).

Abstract: Provided are a semiconductor device lead frame and a method of manufacturing of the same that improve adhesive properties between plating layers when a plurality of plating layers are laminated, that control deterioration in wire bonding properties during the manufacturing process of a semiconductor device and worsening of solderability during packaging, and that effectively reduce manufacturing cost. Specifically, the lead frame (2a, 2b) has a laminated structure that includes a lower plating layer (22) formed on a conductive base material (21) and an uppermost plating layer (23), with an organic film (22) that has metal-binding properties formed between the lower plating layer (21) and the uppermost plating layer (23). The organic film (22) is formed as a monomolecular film in which functional organic molecules (11) self assemble. Each of the organic molecules (11) has functional groups (A1, A1) with metal-binding properties on both ends of a main chain (B1).

Abstract: A semiconductor device and manufacturing method therefor, provided with the aims of constraining resin burr formation while having good electric connectivity and joining strength, and LED device, provided with the aim of improving adhesion between silicon resin and leads while having good luminescent characteristics. For these purposes, an organic film 110 is formed through self-assembly by functional organic molecules 11 at surface border regions of outer leads 301a of a QFP 10. The functional organic molecules 11 consist of a first functional group A1 bonding with metals, a principal chain B1, and a second functional group C1 inducing hardening in thermosetting resins. The principal chain B1 consists of a glycol chain, or else of a glycol chain and one or more among methylene, fluoromethylene, or siloxane chains. The principal chain B1 also preferably includes one or more among a hydroxyl radical, ketone, thioketone, primary amine, secondary amine, and aromatic compounds.

Abstract: The present invention aims to make possible facile removal of resin burrs without the risk of damaging resin body covering a wiring lead in a semiconductor device. In detail, the semiconductor device 10 has a structure in which a semiconductor element is mounted on the wiring lead 10, the wiring lead 10 including a metal plate with metal coating applied to the outer surface thereof. The peripheral region 15 of the wiring lead 11 is covered with an organic coating including purine skeleton compounds. The organic coating is formed through the self-assembling of functional organic compounds each having a structure in which a purine skeleton has at an end thereof a functional group having a metal bonding property.

Abstract: There is provided a semiconductor device that suppresses the occurrence of resin burrs to ensure favorable electrical connectivity and bond strength, and a manufacturing method for such semiconductor device. Also provided is an LED device which ensures stronger adhesion between a silicone resin and a wiring lead and thus achieves favorable light emitting properties, and a manufacturing method for such LED device. Also provided is an LED device that can present superior luminous efficiency by the provision of a sufficient reflectivity even when emitting relatively short wavelength light, and a manufacturing method for such LED device. Also provided is a film carrier tape with which a superior Sn plating coat is formed, mechanical strength and connectivity are achieved. Also provided is a manufacturing method for such film carrier tape that can avoid damage to the wiring pattern layer during an Sn plating step while maintaining favorable manufacturing efficiency.

Abstract: An image forming apparatus includes a scanner section, an image forming section, and a functional unit. The scanner section is configured to read image information by scanning an image bearing side of a document sheet. The image forming section is located above or below the scanner section with a space section provided therebetween and is configured to perform image formation processing on a recording medium based on the image information read. The space section has at least one open vertical side. The functional unit is removably fitted into the space section through the open side.

Abstract: A cleaning blade for removing residual toner left on the surface of an intermediate transfer belt after the second transfer is supported integrally with movement of a tension roller. In the case where the tension roller moves to make a tension of the intermediate transfer belt constant, then, following this, the cleaning blade moves. Thus, the contact state of the cleaning blade with respect to the surface of the intermediate transfer belt is kept constant, and thus cleaning of the intermediate transfer belt can be performed stably.

Abstract: Provided is an image forming apparatus support structure which permits improvements in both strength and dimensional accuracy, and which can also accommodate increases in size. Because respective coupling member(s) and steel channel of respective post member(s) may be sequentially and individually connected, it is possible to improve support structure dimensional accuracy, it being possible to assemble support structure(s) such that deviation(s) in the respective coupling member(s) and the respective post member(s) offset(s) one another. Furthermore, steel channel is suitable for supporting load(s) in vertical direction(s). Moreover, respective coupling member(s) may serve as brace(s) when interposed between respective post members. Where this is the case, strength of the overall support structure may be made extremely high, and strain exhibited by the overall support structure may be reduced.

Abstract: There is provided a semiconductor device that suppresses the occurrence of resin burrs and has favorable electrical connectivity and bond strength, and a manufacturing method for such semiconductor device. A resin-coated metal part is manufactured by forming an organic coating by depositing a material including functional organic molecules on a wiring lead composed of a metallic material. Each of the functional organic molecules includes a main chain, a first functional group having a metal bonding property, and a second functional group. The first functional group and the second functional group are provided at different ends of the main chain. Thereafter the functional organic molecules self-assemble by bonding of the first functional groups to metal atoms of the wiring lead. After performing the organic coating formation step, resin is adhered to a predetermined surface area of the wiring lead having the organic coating formed thereon.