Abstract: Provided is a photosensitive resin composition which comprises (A) a polymer comprising repeating units represented by formula (A1) and at least one kind of repeating units selected from among repeating units represented by formula (A2) and repeating units represented by formula (A3), (B) an epoxy compound containing four or more epoxy groups on average in the molecule, (C) a photoacid generator, (D) a benzotriazole compound and/or an imidazole compound, and (E) an organic solvent.

Abstract: A photosensitive resin composition comprising a polymer containing a silphenylene skeleton and a fluorene skeleton and having a crosslinkable site in the molecule, a phenol compound having a Mw of 300-10,000, a photoacid generator, and a benzotriazole or imidazole compound has improved film properties. Even from a thick film, a fine size pattern can be formed.

Abstract: A photosensitive resin composition comprising a polymer containing a silphenylene skeleton and a fluorene skeleton and having a crosslinkable site in the molecule, a phenol compound having a Mw of 300-10,000, a photoacid generator, and a benzotriazole or imidazole compound has improved film properties. Even from a thick film, a fine size pattern can be formed.

Abstract: The present invention relates to a polyimide resin produced by using silphenylene compound represented by the following formula (1) as a monomer: in which R1 to R4 each independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms, and R5 and R6 each independently represents a divalent hydrocarbon group having 2 to 8 carbon atoms. The silphenylene compound of the present invention is useful as a flexible printed wiring board material, a passivation film for IC chips, and a panel material for liquid crystals.

Abstract: The present invention relates to a silphenylene compound represented by the following formula (1): in which R1 to R4 each independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms, and R5 and R6 each independently represents a divalent hydrocarbon group having 2 to 8 carbon atoms. The silphenylene compound of the present invention is useful as a flexible printed wiring board material, a passivation film for IC chips, and a panel material for liquid crystals.

Abstract: The present invention relates to a polyimide resin produced by using silphenylene compound represented by the following formula (1) as a monomer: in which R1 to R4 each independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms, and R5 and R6 each independently represents a divalent hydrocarbon group having 2 to 8 carbon atoms. The silphenylene compound of the present invention is useful as a flexible printed wiring board material, a passivation film for IC chips, and a panel material for liquid crystals.

Abstract: The present invention relates to a silphenylene compound represented by the following formula (1): in which R1 to R4 each independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms, and R5 and R6 each independently represents a divalent hydrocarbon group having 2 to 8 carbon atoms. The silphenylene compound of the present invention is useful as a flexible printed wiring board material, a passivation film for IC chips, and a panel material for liquid crystals.

Abstract: An oil comprising an amino-modified silicone fluid containing an amino group with an amine equivalent of 10,000 to 200,000 g/mol and having a viscosity of 10 to 100,000 centistokes at 25.degree. C. is effective in preventing any electric contact failure in relays, switches, motors, corotrons and similar electric elements.

Abstract: A process for preparing a silicone composition is provided, which comprises a step of distilling away an organic solvent from a mixture of (1) a low viscosity silicone oil represented by the general formula, R.sub.a SiO.sub.(4-a)/2 (wherein R's may be the same or different, each being an unsubstituted or substituted, monovalent hydrocarbon residue containing 1 to 6 carbon atoms; and "a" ranges from 1.8 to 2.3), and having a viscosity of 100 centistokes or less at 25.degree. C., with (2) an organosilica sol containing, as a dispersoid, spherical porous trimethylsilylated silica particles having an average particle size of 10 to 100 millimicrons, a specific surface area of 300 m.sup.2 /g or above, a trimethylsilyl group density of 0.5 to 10 micromol/m.sup.2, an alkoxy group density of 0.5 to 10 micromole/m.sup.2, and a silanol group density of 0.5 to 5 micromol/m.sup.2, and a step of homogeneously kneading the resulting mixture under shearing stress.