Patents by Inventor Takahiro Hachisu

Takahiro Hachisu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10497731
    Abstract: A photoelectric conversion device includes a semiconductor substrate having a photoelectric conversion unit, a magnetic layer arranged over an opposite side to a light-receiving face of the semiconductor substrate, and an infrared ray absorbing layer arranged between the semiconductor substrate and the magnetic layer.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: December 3, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yuichi Kazue, Takahiro Hachisu
  • Patent number: 10424548
    Abstract: According to one aspect of the present invention, a method of manufacturing a semiconductor device is provided, which includes a bonding step bonding a semiconductor substrate having a semiconductor element disposed on a first surface, to a support substrate, at least through an adhesive layer between the semiconductor substrate and the support substrate, and a groove forming step forming a groove in a scribe area of the semiconductor substrate, from a side of a second surface of the semiconductor substrate, the second surface being opposite to the first surface, and in the groove forming step, a conductive layer between the semiconductor substrate and the support substrate is exposed at a bottom of the groove, without the adhesive layer being exposed in the groove.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: September 24, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yuichi Kazue, Takahiro Hachisu, Hidemasa Oshige
  • Publication number: 20190252327
    Abstract: A semiconductor apparatus in which are bonded a semiconductor substrate, in which a semiconductor element is arranged, and a supporting substrate is provided. A bonding layer for bonding the semiconductor substrate and the supporting substrate is arranged between the supporting substrate and a front side of the semiconductor substrate on the side of the supporting substrate. The bonding layer includes a first resin member arranged in a first region inside of an outer edge of the semiconductor substrate in an orthographic projection to the front side, and a second resin member arranged in a second region between the outer edge of the semiconductor substrate and the first region, in the orthographic projection to the front side. A linear expansion coefficient of the first resin member is less than a linear expansion coefficient of the second resin member.
    Type: Application
    Filed: February 1, 2019
    Publication date: August 15, 2019
    Inventor: Takahiro Hachisu
  • Patent number: 10115756
    Abstract: A solid-state image pickup device has an image pickup pixel including a first photoelectric conversion portion and a first transistor and a focus detection pixel including a second photoelectric conversion portion, a second transistor, and a light shielding portion, in which a reflection preventing portion is provided on the underface side of the light shielding portion.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: October 30, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Kouhei Hashimoto, Takahiro Hachisu
  • Patent number: 10115691
    Abstract: A module, comprising an electronic component having a first electrode, a mounting board having a second electrode, a solder-bump configured to connect the first electrode and the second electrode, and a thermoplastic resin member configured to contact both the first electrode and the second electrode and cover the solder-bump, so as to form a space between the electronic component and the mounting board.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: October 30, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Ichiro Kataoka, Takahiro Hachisu, Tadashi Kosaka
  • Publication number: 20180233524
    Abstract: A photoelectric conversion device includes a semiconductor substrate having a photoelectric conversion unit, a magnetic layer arranged over an opposite side to a light-receiving face of the semiconductor substrate, and an infrared ray absorbing layer arranged between the semiconductor substrate and the magnetic layer.
    Type: Application
    Filed: February 5, 2018
    Publication date: August 16, 2018
    Inventors: Yuichi Kazue, Takahiro Hachisu
  • Patent number: 10026764
    Abstract: A solid-state image pickup device has an image pickup pixel including a first photoelectric conversion portion and a first transistor and a focus detection pixel including a second photoelectric conversion portion, a second transistor, and a light shielding portion, in which a reflection preventing portion is provided on the underface side of the light shielding portion.
    Type: Grant
    Filed: November 28, 2016
    Date of Patent: July 17, 2018
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Kouhei Hashimoto, Takahiro Hachisu
  • Publication number: 20180090453
    Abstract: According to one aspect of the present invention, a method of manufacturing a semiconductor device is provided, which includes a bonding step bonding a semiconductor substrate having a semiconductor element disposed on a first surface, to a support substrate, at least through an adhesive layer between the semiconductor substrate and the support substrate, and a groove forming step forming a groove in a scribe area of the semiconductor substrate, from a side of a second surface of the semiconductor substrate, the second surface being opposite to the first surface, and in the groove forming step, a conductive layer between the semiconductor substrate and the support substrate is exposed at a bottom of the groove, without the adhesive layer being exposed in the groove.
    Type: Application
    Filed: September 21, 2017
    Publication date: March 29, 2018
    Inventors: Yuichi Kazue, Takahiro Hachisu, Hidemasa Oshige
  • Publication number: 20170330852
    Abstract: A module, comprising an electronic component having a first electrode, a mounting board having a second electrode, a solder-bump configured to connect the first electrode and the second electrode, and a thermoplastic resin member configured to contact both the first electrode and the second electrode and cover the solder-bump, so as to form a space between the electronic component and the mounting board.
    Type: Application
    Filed: April 19, 2017
    Publication date: November 16, 2017
    Inventors: Ichiro Kataoka, Takahiro Hachisu, Tadashi Kosaka
  • Publication number: 20170077160
    Abstract: A solid-state image pickup device has an image pickup pixel including a first photoelectric conversion portion and a first transistor and a focus detection pixel including a second photoelectric conversion portion, a second transistor, and a light shielding portion, in which a reflection preventing portion is provided on the underface side of the light shielding portion.
    Type: Application
    Filed: November 28, 2016
    Publication date: March 16, 2017
    Inventors: Kouhei Hashimoto, Takahiro Hachisu
  • Patent number: 9536923
    Abstract: A solid-state image pickup device has an image pickup pixel including a first photoelectric conversion portion and a first transistor and a focus detection pixel including a second photoelectric conversion portion, a second transistor, and a light shielding portion, in which a reflection preventing portion is provided on the underface side of the light shielding portion.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: January 3, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Kouhei Hashimoto, Takahiro Hachisu
  • Publication number: 20110309737
    Abstract: The electron-emitting device is configured such that an inclination angle ?2 of a lower portion from a height-direction intermediate portion to the lower end is larger than the inclination angle ?1 of an upper portion from a lower edge of the concave portion to a height-direction intermediate portion. And, an electric resistance of a lower cathode portion which is a portion of the lower portion of the cathode is larger than that of an upper cathode portion which is a portion of the upper portion of the cathode.
    Type: Application
    Filed: May 24, 2011
    Publication date: December 22, 2011
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Satoshi Tsutsui, Toshiharu Sumiya, Takahiro Hachisu
  • Patent number: 7427826
    Abstract: There provided is an electron beam apparatus of preventing surface creeping discharge from newly arising due to discharge that arises between an anode electrode and an electron-emitting device. In an electron-emitting device including a scan signal device electrode and an information signal device electrode, a portion of the scan signal device electrode is covered by an insulating layer of insulating scan signal wiring from information signal wiring, an additional electrode is connected to the scan signal device electrode at an end portion of the insulating layer and the additional electrode is configured so that energy Ee being lost due to melting of the additional electrode is larger than energy Ea of discharge current flowing in to the electron-emitting device.
    Type: Grant
    Filed: January 13, 2006
    Date of Patent: September 23, 2008
    Assignee: Canon Kabushiki Kaisha
    Inventors: Jun Iba, Yasuo Ohashi, Hisanobu Azuma, Takahiro Hachisu, Masanori Takahashi
  • Patent number: 7097530
    Abstract: There is provided an electron source substrate capable of, even with occurrence of discharge between an anode and an electron-emitting device, avoiding the negative effect on other electron-emitting devices. The electron source substrate has row-directional wiring laid in a row direction; column-directional wiring laid in a column direction so as to intersect with the row-directional wiring; and an electron-emitting device one end of which is coupled to the row-directional wiring, the other end of which is coupled through a resistor element to the column-directional wiring, and to which a predetermined drive voltage is supplied through the wiring, and is configured so that a wiring resistance of the column-directional wiring is higher than a wiring resistance of the row-directional wiring.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: August 29, 2006
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazunori Katakura, Takahiro Hachisu
  • Publication number: 20060164001
    Abstract: There provided is an electron beam apparatus of preventing surface creeping discharge from newly arising due to discharge that arises between an anode electrode and an electron-emitting device. In an electron-emitting device including a scan signal device electrode and an information signal device electrode, a portion of the scan signal device electrode is covered by an insulating layer of insulating scan signal wiring from information signal wiring, an additional electrode is connected to the scan signal device electrode at an end portion of the insulating layer and the additional electrode is configured so that energy Ee being lost due to melting of the additional electrode is larger than energy Ea of discharge current flowing in to the electron-emitting device.
    Type: Application
    Filed: January 13, 2006
    Publication date: July 27, 2006
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Jun Iba, Yasuo Ohashi, Hisanobu Azuma, Takahiro Hachisu, Masanori Takahashi
  • Patent number: 7067236
    Abstract: The present invention provides a method of manufacturing a member pattern having a patterned member on a substrate, the method including: a first exposure step of exposing a desired region of a negative type photosensitive material applied to the substrate to light from a first direction; a second exposure step of exposing the desired region of the negative type photosensitive material to light from a second direction opposite to the first direction; a development step of performing development after the exposure steps to form a precursor pattern of the member; and a step of baking the precursor pattern.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: June 27, 2006
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shuji Yamada, Takahiro Hachisu, Tadayasu Meguro
  • Patent number: 6853128
    Abstract: An electron source substrate has an electron-emitting device consisting of a pair of device electrodes and an electroconductive thin film having an electron-emitting region; and metal wiring coupled to the device electrodes and made in a composition different from that of the device electrodes, on a substrate. A shortest distance between the conductive thin film and the metal wiring along an interface between the device electrodes and the substrate is not less than 50 ?m. This configuration is able to effectively prevent diffusion of the wiring metal to the conductive thin film and to the electron-emitting region which can cause degradation of electron emission characteristics.
    Type: Grant
    Filed: August 26, 2002
    Date of Patent: February 8, 2005
    Assignee: Canon Kabushiki Kaisha
    Inventor: Takahiro Hachisu
  • Patent number: 6788381
    Abstract: A liquid crystal device is constructed in such a structure that a plurality of stripe bulkheads substantially perpendicular to a direction of a layer of a smectic liquid crystal are provided on at least one of a pair of substrates retaining the smectic liquid crystal therebetween and that an elastic modulus E of the bulkheads, an outside pressure P, an area A1 of the substrate, a total area A2 of contact surfaces between the bulkheads and the substrate, and a volumetric shrinkage ratio &Dgr;Vlc/Vlc of the smectic liquid crystal within an ambient temperature range of the liquid crystal device satisfy the following relation: (1/E)×P×(A1/A2)≧&Dgr;Vlc/Vlc, whereby the bulkheads become able to be compressed in response to volumetric shrinkage of the liquid crystal.
    Type: Grant
    Filed: November 19, 2001
    Date of Patent: September 7, 2004
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takahiro Hachisu, Seishi Miura
  • Publication number: 20040018449
    Abstract: The present invention provides a method of manufacturing a member pattern having a patterned member on a substrate, the method including: a first exposure step of exposing a desired region of a negative type photosensitive material applied to the substrate to light from a first direction; a second exposure step of exposing the desired region of the negative type photosensitive material to light from a second direction opposite to the first direction; a development step of performing development after the exposure steps to form a precursor pattern of the member; and a step of baking the precursor pattern.
    Type: Application
    Filed: July 16, 2003
    Publication date: January 29, 2004
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Shuji Yamada, Takahiro Hachisu, Tadayasu Meguro
  • Patent number: RE41086
    Abstract: An electron source substrate has an electron-emitting device consisting of a pair of device electrodes and an electroconductive thin film having an electron-emitting region; and metal wiring coupled to the device electrodes and made in a composition different from that of the device electrodes, on a substrate. A shortest distance between the conductive thin film and the metal wiring along an interface between the device electrodes and the substrate is not less than 50 ?m. This configuration is able to effectively prevent diffusion of the wiring metal to the conductive thin film and to the electron-emitting region which can cause degradation of electron emission characteristics.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: January 26, 2010
    Assignee: Canon Kabushiki Kaisha
    Inventor: Takahiro Hachisu