Patents by Inventor Takahiro Haishima

Takahiro Haishima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for producing microencapsulated electroconductive filler
    Patent number: 6255138
    Abstract: A process for producing a microencapsulated electroconductive filler comprising conductive filler particles each having an insulating resin coated on the surface thereof, which comprises: a first step of treating the surface of conductive filler particles with a coupling agent having reactive functional group A at a terminal end or in a side chain of its molecule; and a second step of allowing the coupling agent having functional group A present on the surface of the conductive filler particles to undergo nonaqueous polymerization reaction with a reactant B which is polymerizable with the functional group A, to thereby form an insulating resin layer on the surface of the conductive filler particles.
    Type: Grant
    Filed: June 23, 1998
    Date of Patent: July 3, 2001
    Assignees: Three Bond Co., Ltd., Fujitsu Limited
    Inventor: Takahiro Haishima