Patents by Inventor Takahiro Hattori

Takahiro Hattori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220311348
    Abstract: The inverter includes: a main body case accommodating main circuit terminal block and a control terminal block, high-voltage wire and low-voltage wire being respectively connected to the main circuit terminal block and the control terminal block; a wire cover detachably attached to the main body case to cover the main circuit terminal block; and a front cover detachably attached to the wire cover to cover the control terminal block, the front cover being fixed to the main body case with a fastening member requiring a tool for removal. The front cover includes a stopper, and, in a state where the front cover is attached to the wire cover, the stopper is located on a path through which the wire cover moves when removing the wire cover from the main body case.
    Type: Application
    Filed: November 28, 2019
    Publication date: September 29, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Takahiro KURAHORI, Tatsuki MATSUNAGA, Norikazu HATTORI, Shohei SUZUKI, Yasuo FUJII
  • Patent number: 11440883
    Abstract: The present invention provides a heterocyclic compound having an orexin type 2 receptor agonist activity. A compound represented by the formula (I): wherein each symbol is as described in the specification, or a salt thereof, is useful as an agent for the prophylaxis or treatment of narcolepsy.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: September 13, 2022
    Assignee: Takeda Pharmaceutical Company Limited
    Inventors: Yuichi Kajita, Yuhei Miyanohana, Tatsuki Koike, Kohei Takeuchi, Yoshiteru Ito, Norihito Tokunaga, Takahiro Sugimoto, Tohru Miyazaki, Tsuneo Oda, Yasutaka Hoashi, Yasushi Hattori, Keisuke Imamura
  • Publication number: 20220286824
    Abstract: Provided are a resin container and a wireless communication system with which it is possible to efficiently manage the state of a wireless communication device installed in an underground space. A resin container 5 for accommodating cables such as a communication line 6 and an electric power line 7 comprises a container body 52 having an opening 51 that opens upward, a lid for closing off the opening 51, and a wireless tag 3 serving as an information processing device positioned in the lid 53 or the container body 52 and capable of wirelessly communicating with a terminal 40 serving as an external apparatus. The wireless tag 3: acquires, from a wireless communication device 2 positioned in the inside of the container body 52, information that relates to the maintenance of the wireless communication device 2; holds said information; and transmits said information relating to the maintenance to the terminal 40.
    Type: Application
    Filed: May 25, 2022
    Publication date: September 8, 2022
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hiroki HAMADA, Yuito MITSUHASHI, Taishi KAGIMOTO, Nobuhiko HATTORI, Takahiro MOCHIZUKI
  • Publication number: 20220283280
    Abstract: Provided is a resin container which contains a cable, the container being provided with: a container main body which has an opening section which opens upward; a lid which closes the opening section; and a first reflection plate which is configured from one or more reflection plates disposed at a prescribed position inside the lid, wherein, in the inside of the container main body, a wireless communication device provided with a first communication unit that communicates with a wireless communication apparatus is disposed, and, when a signal is transmitted from a second communication unit of the wireless communication device in a state where the lid closes the opening section, the first reflection plate is disposed at a position and an angle at which the signal is reflected and is received by the second communication unit.
    Type: Application
    Filed: May 23, 2022
    Publication date: September 8, 2022
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hiroki HAMADA, Yuito MITSUHASHI, Taishi KAGIMOTO, Nobuhiko HATTORI, Takahiro MOCHIZUKI
  • Patent number: 11402569
    Abstract: The present invention provides an optical sheet for a light guide plate type liquid crystal display, including a low refractive index layer having an extremely low refractive index. The optical sheet A12 for a light guide plate type liquid crystal display (1000) according to the present invention includes a first optical film (light guide plate) (1010), a low refractive index layer (20), and a second optical film (reflection plate) (1020) laminated in this order, and the low refractive index layer (20) has a refractive index of 1.25 or less.
    Type: Grant
    Filed: January 30, 2018
    Date of Patent: August 2, 2022
    Assignee: NITTO DENKO CORPORATION
    Inventors: Daisuke Hattori, Kozo Nakamura, Takahiro Yoshikawa
  • Publication number: 20220231398
    Abstract: This housing unit is provided with: a first resin container that houses therein a wireless base station to which a cable is connected; and a second resin container that is disposed anterior or posterior to the first resin container in the direction in which the cable extends, and that has the interior thereof connected with the interior of the first resin container. The first resin container is provided with a drainage part comprising: a crown section that has a height position higher than a boundary portion and a boundary portion with the second resin container; and a curved surface and a curved surface where the height position becomes increasingly lower from the crown section towards the boundary portion and the boundary portion, and meanwhile, the second resin container has a drain-receiving part which has a height position lower than the boundary portion and the boundary portion, and which is for receiving drainage water from the drainage part.
    Type: Application
    Filed: April 5, 2022
    Publication date: July 21, 2022
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Yuito MITSUHASHI, Hiroki HAMADA, Nobuhiko HATTORI, Taishi KAGIMOTO, Takahiro MOCHIZUKI
  • Publication number: 20220143866
    Abstract: To provide a building material manufacturing apparatus that is suitable for suppressing clogging of a screen that screens a building raw material. A building material manufacturing apparatus X1 includes at least a screen part 10 and a cleaning mechanism part 40. The screen part 10 includes at least one screen sheet 12 that has an inclination and that has a screen mesh. The cleaning mechanism part 40 includes a scraping part 40a. When the apparatus operates in a building material manufacturing mode in which a building raw material M is supplied to the screen sheet 12 and the screen sheet 12 is performing a wave motion, the scraping part 40a is separated from the screen sheet 12, and, when the apparatus operates in a cleaning mode in which the building raw material M is not supplied to the screen sheet 12 and the screen sheet 12 is not performing a wave motion, the scraping part 40a rotates in contact with the screen sheet 12.
    Type: Application
    Filed: January 14, 2022
    Publication date: May 12, 2022
    Applicant: NICHIHA CORPORATION
    Inventors: Takahiro HATTORI, Hidenori NISHIOKA
  • Publication number: 20210387276
    Abstract: A method includes applying a first flux onto an electrode provided on a substrate and placing a solder material on the electrode, heating the substrate to form a solder bump on the electrode, deforming the solder bump to provide a flat surface or a depressed portion on the solder bump, applying a second flux to the solder bump; placing a core material on the solder bump, the core material including a core portion and a solder layer that covers a surface of the core portion, and heating the substrate to join the core material to the electrode by the solder bump and the solder layer.
    Type: Application
    Filed: June 3, 2021
    Publication date: December 16, 2021
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Takahiro HATTORI, Hiroki SUDO, Hiroshi OKADA, Daisuke SOUMA
  • Patent number: 10773345
    Abstract: Provided is a solder alloy, a solder ball, a chip solder, a solder paste and a solder joint in which discoloration is suppressed and a growth of an oxide film is suppressed under a high temperature and high humidity environment. The solder alloy contains 0.005% by mass or more and 0.1% by mass or less of Mn, 0.001% by mass or more and 0.1% by mass or less of Ge and more than 0% by mass and 4% by mass or less of Ag, and a principal ingredient of remainder is Sn.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: September 15, 2020
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Ken Tachibana, Takahiro Hattori
  • Patent number: 10717157
    Abstract: Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ball 1A is provided with a Cu ball 2A for keeping a space between a semiconductor package and a printed circuit board and a solder layer 3A that covers the Cu ball 2A. The solder layer 3A is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ball 1A, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.
    Type: Grant
    Filed: November 5, 2014
    Date of Patent: July 21, 2020
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Takahiro Hattori, Hiroyoshi Kawasaki, Hiroshi Okada, Takahiro Roppongi, Daisuke Soma, Isamu Sato
  • Patent number: 10610979
    Abstract: Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: April 7, 2020
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Daisuke Maruko, Atsumi Takahashi, Hiroki Sudo, Hiroyoshi Kawasaki, Takahiro Hattori, Takahiro Roppongi, Daisuke Soma, Takashi Hagiwara, Isamu Sato, Yuji Kawamata
  • Publication number: 20200061757
    Abstract: A solder material capable of suppressing the occurrence of electromigration is provided. The solder material is core ball 1A which comprises spherical core 2A composed of Cu or a Cu alloy, and solder layer 3A coating core 2A, and wherein solder layer 3A has: a Cu content of 0.1 mass % or more and 3.0 mass % or less, a Bi content of 0.5 mass % or more and 5.0 mass % or less, a Ag content of 0 mass % or more and 4.5 mass % or less, and a Ni content of 0 mass % or more and 0.1 mass % or less, with Sn being the balance.
    Type: Application
    Filed: February 28, 2018
    Publication date: February 27, 2020
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Tomoaki NISHINO, Takahiro HATTORI, Hiroyoshi KAWASAKI, Takahiro ROPPONGI, Daisuke SOMA, Isamu SATO
  • Patent number: 10381319
    Abstract: A core material including a core and a solder plating layer of a (Sn—Bi)-based solder alloy made of Sn and Bi on a surface of the core. Bi in the solder plating layer is distributed in the solder plating layer at a concentration ratio in a predetermined range of, for example, 91.7% to 106.7%. Bi in the solder plating layer is homogeneous, and thus, a Bi concentration ratio is in a predetermined range over the entire solder plating layer including an inner circumference side and an outer circumference side in the solder plating layer.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: August 13, 2019
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Tomoaki Nishino, Shigeki Kondo, Takahiro Hattori, Hiroyoshi Kawasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato
  • Patent number: 10322472
    Abstract: Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball (1) contains a Cu ball (2) made of Cu or a Cu alloy and a solder layer (3) which is made of a solder alloy composed of Sn and Cu and covers the Cu ball (2). The solder layer (3) contains not less than 0.1% through not more than 3.0% of Cu and the remainder is composed of Sn and impurities.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: June 18, 2019
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Takahiro Hattori, Daisuke Soma, Takahiro Roppongi, Isamu Sato
  • Publication number: 20190070696
    Abstract: Provided is a solder alloy, a solder ball, a chip solder, a solder paste and a solder joint in which discoloration is suppressed and a growth of an oxide film is suppressed under a high temperature and high humidity environment. The solder alloy contains 0.005% by mass or more and 0.1% by mass or less of Mn, 0.001% by mass or more and 0.1% by mass or less of Ge and more than 0% by mass and 4% by mass or less of Ag, and a principal ingredient of remainder is Sn.
    Type: Application
    Filed: March 8, 2017
    Publication date: March 7, 2019
    Inventors: Ken Tachibana, Takahiro Hattori
  • Publication number: 20180339375
    Abstract: Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.
    Type: Application
    Filed: May 24, 2018
    Publication date: November 29, 2018
    Inventors: Daisuke Maruko, Atsumi Takahashi, Hiroki Sudo, Hiroyoshi Kawasaki, Takahiro Hattori, Takahiro Roppongi, Daisuke Soma, Takashi Hagiwara, Isamu Sato, Yuji Kawamata
  • Publication number: 20180174991
    Abstract: A core material including a core and a solder plating layer of a (Sn—Bi)-based solder alloy made of Sn and Bi on a surface of the core. Bi in the solder plating layer is distributed in the solder plating layer at a concentration ratio in a predetermined range of, for example, 91.7% to 106.7%. Bi in the solder plating layer is homogeneous, and thus, a Bi concentration ratio is in a predetermined range over the entire solder plating layer including an inner circumference side and an outer circumference side in the solder plating layer.
    Type: Application
    Filed: December 6, 2017
    Publication date: June 21, 2018
    Inventors: Tomoaki Nishino, Shigeki Kondo, Takahiro Hattori, Hiroyoshi Kawasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato
  • Publication number: 20170312860
    Abstract: Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ball 1A is provided with a Cu ball 2A for keeping a space between a semiconductor package and a printed circuit board and a solder layer 3A that covers the Cu ball 2A. The solder layer 3A is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ball 1A, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.
    Type: Application
    Filed: November 5, 2014
    Publication date: November 2, 2017
    Inventors: Takahiro Hattori, Hiroyoshi Kawasaki, Hiroshi Okada, Takahiro Roppongi, Daisuke Soma, Isamu Sato
  • Publication number: 20170216975
    Abstract: A solder alloy that contains 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge, and a balance of Sn. A plurality of Ge oxides is distributed on an outermost surface side of an oxide film including Sn oxide, Mn oxide and Ge oxide by adding 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge to the solder alloy having a principal ingredient of Sn, so that it is possible to obtain the discolor-inhibiting effect even under the high-temperature and high-humidity environment.
    Type: Application
    Filed: February 15, 2016
    Publication date: August 3, 2017
    Inventors: Ken TACHIBANA, Takahiro HATTORI
  • Patent number: 9662730
    Abstract: A bump electrode is formed on an electrode pad using a Cu core ball in which a core material is covered with solder plating, and a board which has bump electrodes such as semiconductor chip or printed circuit board mounts such a bump electrode. Flux is coated on a substrate and the bump electrodes are then mounted on the electrode pad. In a step of heating the electrode pad and the Cu core ball to melt the solder plating, a heating rate of the substrate is set to have not less than 0.01° C./sec and less than 0.3.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: May 30, 2017
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Takahiro Hattori, Daisuke Soma, Isamu Sato