Patents by Inventor Takahiro Hattori

Takahiro Hattori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10428023
    Abstract: The present invention provides a heterocyclic compound having an orexin type 2 receptor agonist activity. A compound represented by the formula (I): wherein each symbol is as described in the specification, or a salt thereof, is useful as an agent for the prophylaxis or treatment of narcolepsy.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: October 1, 2019
    Assignee: Takeda Pharmaceutical Company Limited
    Inventors: Yuichi Kajita, Yuhei Miyanohana, Tatsuki Koike, Kohei Takeuchi, Yoshiteru Ito, Norihito Tokunaga, Takahiro Sugimoto, Tohru Miyazaki, Tsuneo Oda, Yasutaka Hoashi, Yasushi Hattori, Keisuke Imamura
  • Publication number: 20190283798
    Abstract: A motor includes a rotor, a stator, a housing, a substrate, a connector, and a cover. The cover includes a covering wall that extends axially downward from a radial outer rim and covers at least a portion of the radial outer rim of the connector, and a cover recess that is radially inward from the covering wall and is depressed axially. The connector includes a connector projection that is provided in a radial outer edge area and extends axially, and the connector projection and the cover recess are fitted together through a gap.
    Type: Application
    Filed: March 30, 2017
    Publication date: September 19, 2019
    Inventors: Takashi HATTORI, Yusaku YOSHIDA, Toshiya OKAMOTO, Takahiro KIZU, Yuichi NISHIKAWA
  • Publication number: 20190280567
    Abstract: A motor includes a rotor including a shaft that extends axially, a stator that surrounds the radial outer side of the rotor and includes coils defined by windings of coil wires, a holder with through-holes that is axially above the stator for insertion of the coil wires therethrough and extends axially, and a substrate that is axially above the holder and includes an electronic component mounted thereon. Only some of the coil wires with the same phase are inserted into each of the through-holes, and the through-holes are separate holes provided to different phases of the coil wires.
    Type: Application
    Filed: March 30, 2017
    Publication date: September 12, 2019
    Inventors: Takashi HATTORI, Takahiro KIZU, Toshiya OKAMOTO, Yuichi NISHIKAWA, Yoshiaki YAMASHITA
  • Publication number: 20190280566
    Abstract: A motor includes a heat sink including an inner region, and an outer region located radially outward from the inner region. An axial thickness of the inner region is larger than an axial thickness of the outer region, the bottom surface of the outer region is located axially above the bottom surface of the inner region, and the inner region and the electronic component at least partially overlap in an axial direction. A bus bar holder is located axially below the outer region and overlaps the inner region in a radial direction.
    Type: Application
    Filed: March 30, 2017
    Publication date: September 12, 2019
    Inventors: Takashi HATTORI, Takahiro KIZU, Toshiya OKAMOTO, Yuichi NISHIKAWA, Yoshiaki YAMASHITA
  • Publication number: 20190273416
    Abstract: A motor includes a rotor, a stator, a housing, and a flange. The housing includes a first cylindrical portion, a contact portion extending radially inward from an axial lower end of the first cylindrical portion, a second cylindrical portion that extends axially downward from a radial inner edge of the contact portion and has a smaller outer diameter than the first cylindrical portion, and a bottom portion extending radially inward from an axial lower end of the second cylindrical portion. The flange includes a flange cylindrical portion, and a flange flat portion extending radially outward from an axial lower end of the flange cylindrical portion. The flange cylindrical portion is fixed to an outer surface of the second cylindrical portion and an upper end of the flange cylindrical portion contacts with an outside lower surface of the contact portion.
    Type: Application
    Filed: March 30, 2017
    Publication date: September 5, 2019
    Inventors: Takahiro KIZU, Takashi HATTORI, Toshiya OKAMOTO, Yuichi NISHIKAWA
  • Publication number: 20190267862
    Abstract: A motor includes a rotor including a shaft extending axially, a stator surrounding a radial outside of the rotor and including a coil defined by a wound coil wire, a holder disposed on an axially upper side of the stator, the coil wire being inserted into the holder, the holder including through-holes extending axially, and a circuit board disposed on the axially upper side of the holder, an electronic component being mounted on the circuit board. When the holder is viewed from the axially upper side, the through-holes are located in a region where a center angle (?) centered on the shaft is less than or equal to 180 degrees.
    Type: Application
    Filed: March 30, 2017
    Publication date: August 29, 2019
    Inventors: Takashi HATTORI, Takahiro KIZU, Toshiya OKAMOTO, Yuichi NISHIKAWA, Yoshiaki YAMASHITA, Mitsuo KODAMA, Yuya SAITO, Shingo FUKUMOTO, Chiharu KOBAYASHI
  • Patent number: 10379479
    Abstract: According to one embodiment, a sheet binding device includes a tape support base, a tape holder, and a first displacement mechanism. The tape support base supports a tape. The tape holder is movable in a first direction. The first displacement mechanism displaces the tape holder from a first position that is a position away from the tape to a second position at which the tape holder is capable of coming into contact with the tape when the tape holder moves toward the tape support base and receives the tape.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: August 13, 2019
    Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA TEC KABUSHIKI KAISHA
    Inventors: Takamitsu Sunaoshi, Misato Ishikawa, Takahiro Kokubo, Shunsuke Hattori, Kikuo Mizutani
  • Patent number: 10381319
    Abstract: A core material including a core and a solder plating layer of a (Sn—Bi)-based solder alloy made of Sn and Bi on a surface of the core. Bi in the solder plating layer is distributed in the solder plating layer at a concentration ratio in a predetermined range of, for example, 91.7% to 106.7%. Bi in the solder plating layer is homogeneous, and thus, a Bi concentration ratio is in a predetermined range over the entire solder plating layer including an inner circumference side and an outer circumference side in the solder plating layer.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: August 13, 2019
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Tomoaki Nishino, Shigeki Kondo, Takahiro Hattori, Hiroyoshi Kawasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato
  • Publication number: 20190240176
    Abstract: Embodiments of the present disclosure provide for methods of treating cancer (e.g., leukemia), pharmaceutical compositions for treating cancer, methods of modulating cancer progression and development, and the like.
    Type: Application
    Filed: October 26, 2017
    Publication date: August 8, 2019
    Inventors: Takahiro Ito, Ayuna Hattori
  • Publication number: 20190234251
    Abstract: An attachment structure for a vehicle motor is applied for the purpose of attaching a vehicle motor to in-vehicle equipment. The attachment structure for a vehicle motor is provided with an axial gap motor that includes a rotor and a stator facing each other in the axial direction. The motor is attached to the in-vehicle equipment in a mode in which the axial direction is perpendicular to the vertical direction.
    Type: Application
    Filed: October 30, 2017
    Publication date: August 1, 2019
    Applicant: DENSO CORPORATION
    Inventors: Seiya YOKOYAMA, Takahiro TSUCHIYA, Shigemasa KATO, Yoji YAMADA, Koji MIKAMI, Akihisa HATTORI
  • Patent number: 10322472
    Abstract: Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball (1) contains a Cu ball (2) made of Cu or a Cu alloy and a solder layer (3) which is made of a solder alloy composed of Sn and Cu and covers the Cu ball (2). The solder layer (3) contains not less than 0.1% through not more than 3.0% of Cu and the remainder is composed of Sn and impurities.
    Type: Grant
    Filed: November 4, 2014
    Date of Patent: June 18, 2019
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Takahiro Hattori, Daisuke Soma, Takahiro Roppongi, Isamu Sato
  • Publication number: 20190143732
    Abstract: A binding mechanism has a base, a feeder, a tape cutting unit, a tape holding unit and a tape support driving unit. The feeder is supported by the base. The feeder feeds an adhesive tape. The tape cutting unit is supported by the base. The tape cutting unit cuts the fed adhesive tape. The tape holding unit can hold the fed adhesive tape. The tape support units are installed as a pair. The tape support driving unit drives the pair of tape support units such that the pair of tape support units hold the fed adhesive tape simultaneously.
    Type: Application
    Filed: August 21, 2018
    Publication date: May 16, 2019
    Inventors: Takamitsu SUNAOSHI, Takahiro KOKUBO, Shunsuke HATTORI, Kikuo MIZUTANI
  • Publication number: 20190070696
    Abstract: Provided is a solder alloy, a solder ball, a chip solder, a solder paste and a solder joint in which discoloration is suppressed and a growth of an oxide film is suppressed under a high temperature and high humidity environment. The solder alloy contains 0.005% by mass or more and 0.1% by mass or less of Mn, 0.001% by mass or more and 0.1% by mass or less of Ge and more than 0% by mass and 4% by mass or less of Ag, and a principal ingredient of remainder is Sn.
    Type: Application
    Filed: March 8, 2017
    Publication date: March 7, 2019
    Inventors: Ken Tachibana, Takahiro Hattori
  • Publication number: 20180339375
    Abstract: Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.
    Type: Application
    Filed: May 24, 2018
    Publication date: November 29, 2018
    Inventors: Daisuke Maruko, Atsumi Takahashi, Hiroki Sudo, Hiroyoshi Kawasaki, Takahiro Hattori, Takahiro Roppongi, Daisuke Soma, Takashi Hagiwara, Isamu Sato, Yuji Kawamata
  • Publication number: 20180174991
    Abstract: A core material including a core and a solder plating layer of a (Sn—Bi)-based solder alloy made of Sn and Bi on a surface of the core. Bi in the solder plating layer is distributed in the solder plating layer at a concentration ratio in a predetermined range of, for example, 91.7% to 106.7%. Bi in the solder plating layer is homogeneous, and thus, a Bi concentration ratio is in a predetermined range over the entire solder plating layer including an inner circumference side and an outer circumference side in the solder plating layer.
    Type: Application
    Filed: December 6, 2017
    Publication date: June 21, 2018
    Inventors: Tomoaki Nishino, Shigeki Kondo, Takahiro Hattori, Hiroyoshi Kawasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato
  • Publication number: 20170312860
    Abstract: Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ball 1A is provided with a Cu ball 2A for keeping a space between a semiconductor package and a printed circuit board and a solder layer 3A that covers the Cu ball 2A. The solder layer 3A is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ball 1A, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.
    Type: Application
    Filed: November 5, 2014
    Publication date: November 2, 2017
    Inventors: Takahiro Hattori, Hiroyoshi Kawasaki, Hiroshi Okada, Takahiro Roppongi, Daisuke Soma, Isamu Sato
  • Publication number: 20170216975
    Abstract: A solder alloy that contains 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge, and a balance of Sn. A plurality of Ge oxides is distributed on an outermost surface side of an oxide film including Sn oxide, Mn oxide and Ge oxide by adding 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge to the solder alloy having a principal ingredient of Sn, so that it is possible to obtain the discolor-inhibiting effect even under the high-temperature and high-humidity environment.
    Type: Application
    Filed: February 15, 2016
    Publication date: August 3, 2017
    Inventors: Ken TACHIBANA, Takahiro HATTORI
  • Patent number: 9668358
    Abstract: A Cu ball that has low ? dose and high sphericity even when containing at least a certain amount of impurity elements other than Cu. Even when the purity thereof is 99.995% or less and U and Th contents are 5 ppb or less in order to suppress any software errors and decrease connection failure, ? dose is 0.0200 cph/cm2 or less. Further, the sphericity of the Cu ball is unexpectedly improved by making the purity not more than 99.995%.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: May 30, 2017
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroyoshi Kawasaki, Takahiro Hattori, Takahiro Roppongi, Daisuke Soma, Isamu Sato
  • Patent number: 9662730
    Abstract: A bump electrode is formed on an electrode pad using a Cu core ball in which a core material is covered with solder plating, and a board which has bump electrodes such as semiconductor chip or printed circuit board mounts such a bump electrode. Flux is coated on a substrate and the bump electrodes are then mounted on the electrode pad. In a step of heating the electrode pad and the Cu core ball to melt the solder plating, a heating rate of the substrate is set to have not less than 0.01° C./sec and less than 0.3.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: May 30, 2017
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Takahiro Hattori, Daisuke Soma, Isamu Sato
  • Publication number: 20160368105
    Abstract: Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball (1) contains a Cu ball (2) made of Cu or a Cu alloy and a solder layer (3) which is made of a solder alloy composed of Sn and Cu and covers the Cu ball (2). The solder layer (3) contains not less than 0.1% through not more than 3.0% of Cu and the remainder is composed of Sn and impurities.
    Type: Application
    Filed: November 4, 2014
    Publication date: December 22, 2016
    Inventors: Takahiro Hattori, Daisuke Soma, Takahiro Roppongi, Isamu Sato