Abstract: There is provided an optical member that can achieve a backlight unit excellent in brightness uniformity. The optical member includes: a light guide plate having an end surface that light from a light source enters, an emitting surface from which the entered light is emitted, and a light extraction pattern arranged on a surface opposite to the emitting surface; and a reflective plate bonded to the light guide plate via a double-sided pressure-sensitive adhesive film. An outer edge of the light guide plate is positioned outside an outer edge of the double-sided pressure-sensitive adhesive film, and the outer edge of the double-sided pressure-sensitive adhesive film is positioned outside an outer edge of the light extraction pattern.

Abstract: An ozone generator (100) includes: a flow path (1) through which gas flows from an inlet (5) to an outlet (6); an ozone generation unit (3) disposed in the flow path (1); and an ozone sensor (4) disposed in the flow path (1) and upstream of the ozone generation unit (3). The flow path (1) has an upstream-side flow path (130) that forms a gas passing space (AR) located upstream of the ozone generation unit (3) and through which the gas flows from one side to another side in a predetermined direction. The inlet (5) is disposed closer to an outer circumferential portion (131) of the upstream-side flow path (130) than the ozone sensor (4).

Abstract: A control device that is mounted in a second vehicle which a first vehicle having a following travel function is detachably connected to or loaded on is provided. The control device includes a control unit configured to perform: detecting another vehicle that is within a predetermined range from the second vehicle in a state in which the second vehicle has the first vehicle connected thereto or loaded thereon and of which some or all of a scheduled travel route is the same as some or all of a scheduled travel route of the first vehicle after the first vehicle has been disconnected from the second vehicle; and transmitting following instruction information to the first vehicle and disconnecting the first vehicle from the second vehicle such that the first vehicle travels with the detected other vehicle as a preceding vehicle by the following travel function.

Abstract: This gas turbine plant is provided with a gas turbine and a fuel supply facility. The fuel supply facility is provided with: a liquid ammonia line; a warm water line through which warm water can flow; a vaporizer which can perform the heat exchange between the warm water coming from the warm water line and liquid ammonia coming from the liquid ammonia line to heat and vaporize the liquid ammonia; a heat exchanger which can perform the heat exchange between the warm water in the warm water line and a medium; a heat exchange amount controller which can control the amount of heat exchange between the warm water and the medium to control the temperature of the warm water flowing into the vaporizer; and a gaseous ammonia line which can introduce gaseous ammonia that is ammonia vaporized by the vaporizer into the gas turbine.

Abstract: Provided is a lighting apparatus having high light entrance efficiency with respect to a light guide plate, and being excellent in tint of light emitted from the light guide plate. The lighting apparatus of the present invention includes: an LED package; a light guide plate, which includes a main surface serving as a light emission surface, and a side surface serving as a light entrance surface, and which is arranged so that the side surface is opposed to the LED package; and a low-refractive index layer arranged between the LED package and the light guide plate.

Abstract: An apparatus for manufacturing a bagged electrode includes a conveying unit, a first bonding unit, a second bonding unit, and a separating unit. The conveying unit conveys an electrode in a manner interposed between a pair of long separator materials unwound from a pair of rolls. The first bonding unit bonds the pair of long separator materials outside the electrode along a conveyance direction without stopping conveyance of the electrode and the pair of long separator materials. The second bonding unit bonds the pair of long separator materials outside the electrode along a direction intersecting the conveyance direction without stopping conveyance of the electrode and the pair of long separator materials. The separating unit cuts the pair of long separator materials along the direction intersecting the conveyance direction to cut off the bagged electrode without stopping conveyance of the electrode and the pair of long separator materials.

Abstract: A thermoelectric conversion device that includes an element body including a plurality of stacked; and a meandering wire inside the element body and that has a stacked structure. The meandering wire includes a thermoelectric material that has an anomalous Nernst effect, and a thermal conductivity of the plurality of stacked substrates is lower than that of the thermoelectric material. A thermoelectric conversion device that includes a winding core; and a winding wire wound around the winding core. The winding wire consists only of a thermoelectric material that has an anomalous Nernst effect. A thermoelectric conversion device that includes a plurality of substrates and meandering wires on main surfaces of the respective substrates. The meandering wires include a thermoelectric material that has an anomalous Nernst effect, and the substrates adjacent to each other are arranged at an angle that is larger than 0 degrees and smaller than 180 degrees.

Abstract: A method includes applying a first flux onto an electrode provided on a substrate and placing a solder material on the electrode, heating the substrate to form a solder bump on the electrode, deforming the solder bump to provide a flat surface or a depressed portion on the solder bump, applying a second flux to the solder bump; placing a core material on the solder bump, the core material including a core portion and a solder layer that covers a surface of the core portion, and heating the substrate to join the core material to the electrode by the solder bump and the solder layer.

Abstract: A solder alloy that contains 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge, and a balance of Sn. A plurality of Ge oxides is distributed on an outermost surface side of an oxide film including Sn oxide, Mn oxide and Ge oxide by adding 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge to the solder alloy having a principal ingredient of Sn, so that it is possible to obtain the discolor-inhibiting effect even under the high-temperature and high-humidity environment.

Abstract: To provide a building material manufacturing apparatus that is suitable for suppressing clogging of a screen that screens a building raw material. A building material manufacturing apparatus X1 includes at least a screen part 10 and a cleaning mechanism part 40. The screen part 10 includes at least one screen sheet 12 that has an inclination and that has a screen mesh. The cleaning mechanism part 40 includes a scraping part 40a. When the apparatus operates in a building material manufacturing mode in which a building raw material M is supplied to the screen sheet 12 and the screen sheet 12 is performing a wave motion, the scraping part 40a is separated from the screen sheet 12, and, when the apparatus operates in a cleaning mode in which the building raw material M is not supplied to the screen sheet 12 and the screen sheet 12 is not performing a wave motion, the scraping part 40a rotates in contact with the screen sheet 12.

Abstract: A method includes applying a first flux onto an electrode provided on a substrate and placing a solder material on the electrode, heating the substrate to form a solder bump on the electrode, deforming the solder bump to provide a flat surface or a depressed portion on the solder bump, applying a second flux to the solder bump; placing a core material on the solder bump, the core material including a core portion and a solder layer that covers a surface of the core portion, and heating the substrate to join the core material to the electrode by the solder bump and the solder layer.

Abstract: Provided is a solder alloy, a solder ball, a chip solder, a solder paste and a solder joint in which discoloration is suppressed and a growth of an oxide film is suppressed under a high temperature and high humidity environment. The solder alloy contains 0.005% by mass or more and 0.1% by mass or less of Mn, 0.001% by mass or more and 0.1% by mass or less of Ge and more than 0% by mass and 4% by mass or less of Ag, and a principal ingredient of remainder is Sn.

Abstract: Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ball 1A is provided with a Cu ball 2A for keeping a space between a semiconductor package and a printed circuit board and a solder layer 3A that covers the Cu ball 2A. The solder layer 3A is composed of Sn or a solder alloy whose main component is Sn. For the Cu core ball 1A, lightness is equal to or more than 65 in the L*a*b* color space and yellowness is equal to or less than 7.0 in the L*a*b* color space, and more preferably, the lightness is equal to or more than 70 and the yellowness thereof is equal to or less than 5.1.

Abstract: Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.

Abstract: A solder material capable of suppressing the occurrence of electromigration is provided. The solder material is core ball 1A which comprises spherical core 2A composed of Cu or a Cu alloy, and solder layer 3A coating core 2A, and wherein solder layer 3A has: a Cu content of 0.1 mass % or more and 3.0 mass % or less, a Bi content of 0.5 mass % or more and 5.0 mass % or less, a Ag content of 0 mass % or more and 4.5 mass % or less, and a Ni content of 0 mass % or more and 0.1 mass % or less, with Sn being the balance.

Abstract: A core material including a core and a solder plating layer of a (Sn—Bi)-based solder alloy made of Sn and Bi on a surface of the core. Bi in the solder plating layer is distributed in the solder plating layer at a concentration ratio in a predetermined range of, for example, 91.7% to 106.7%. Bi in the solder plating layer is homogeneous, and thus, a Bi concentration ratio is in a predetermined range over the entire solder plating layer including an inner circumference side and an outer circumference side in the solder plating layer.

Abstract: Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball (1) contains a Cu ball (2) made of Cu or a Cu alloy and a solder layer (3) which is made of a solder alloy composed of Sn and Cu and covers the Cu ball (2). The solder layer (3) contains not less than 0.1% through not more than 3.0% of Cu and the remainder is composed of Sn and impurities.

Abstract: Provided is a solder alloy, a solder ball, a chip solder, a solder paste and a solder joint in which discoloration is suppressed and a growth of an oxide film is suppressed under a high temperature and high humidity environment. The solder alloy contains 0.005% by mass or more and 0.1% by mass or less of Mn, 0.001% by mass or more and 0.1% by mass or less of Ge and more than 0% by mass and 4% by mass or less of Ag, and a principal ingredient of remainder is Sn.

Abstract: Provided is a flux containing not less than 11.0 degrees and not more than 17.0 of a contact angle between the flux and a resist substrate on which the flux has been printed to have 1.0 mm of a diameter and 0.15 mm of a thickness when heating the resist substrate at 150 degrees C. for 30 seconds and cooling the resist substrate to a room temperature. The flux also contains more than zero seconds and not more than 2.0 seconds of a zero-cross time when heating a Cu plate at 150 degrees C. in a thermostat oven for 12 hours, applying the flux onto the baked Cu plate, and dipping the baked Cu plate onto which the flux is applied into a Sn-3.0Ag-0.5Cu alloy at a dipping speed of 15 mm/sec and by 2.0 mm of a dipped depth.

Abstract: A core material including a core and a solder plating layer of a (Sn—Bi)-based solder alloy made of Sn and Bi on a surface of the core. Bi in the solder plating layer is distributed in the solder plating layer at a concentration ratio in a predetermined range of, for example, 91.7% to 106.7%. Bi in the solder plating layer is homogeneous, and thus, a Bi concentration ratio is in a predetermined range over the entire solder plating layer including an inner circumference side and an outer circumference side in the solder plating layer.