Patents by Inventor Takahiro Iida
Takahiro Iida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240322777Abstract: A method of producing a composite substrate includes: forming a first layer on a lower surface side of a piezoelectric substrate having an upper surface and a lower surface facing each other and having an electrode formed on the lower surface; performing flattening treatment to set a waviness of a surface of the first layer to more than 2 nm and 70 nm or less; and joining a support substrate to a first layer side of the piezoelectric substrate having the first layer formed thereon.Type: ApplicationFiled: June 7, 2024Publication date: September 26, 2024Applicant: NGK INSULATORS, LTD.Inventors: Takahiro YAMADERA, Tsuyoshi IIDA
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Publication number: 20240302900Abstract: An operational data management system includes an operational data acquisition unit, a tag assigner, and a database management unit. The operational data acquisition unit acquires, as operational data, time-series control parameters used to transmit force tactile sensation between devices. The tag assigner assigns, as identification information, information related to operation content implemented by the operational data to the operational data acquired by the operational data acquisition unit. The database management unit accumulates a plurality of pieces of operational data assigned identification information by the tag assigner, and manages the operational data so that desired operational data is searchable from the accumulated plurality of pieces of operational data based on the identification information.Type: ApplicationFiled: June 8, 2022Publication date: September 12, 2024Applicants: KEIO UNIVERSITY, Motion Lib, Inc.Inventors: Kouhei OHNISHI, Takahiro MIZOGUCHI, Wataru IIDA, Genki KOKUBUN
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Patent number: 12049110Abstract: In a tire tread pattern, lug grooves with sipes each include: a lug groove and a first sipe further extending from the lug groove to a second circumferential main groove and pass through a land portion region. Second sipes are alternately disposed with the lug grooves with sipes in a circumferential direction and pass through the land portion region. The second sipes extend inclined with respect to a lateral direction in a direction opposite to a direction in the circumferential direction in which the lug grooves with sipes are inclined. At an opening end at which the lug groove opens to a first circumferential main groove, the lug grooves with sipes and the second sipes are joined. Thus, triangular blocks surrounded by the second circumferential main groove, the lug grooves with sipes, and the second sipes are disposed side by side in the land portion region in the circumferential direction.Type: GrantFiled: September 28, 2018Date of Patent: July 30, 2024Assignee: The Yokohama Rubber Co., LTD.Inventor: Takahiro Iida
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Publication number: 20240243390Abstract: An electrically heated catalyst system includes a catalyst support that is made of a conductive material and includes an outer surface, a pair of metal terminals attached to the outer surface of the catalyst support, a buck-boost converter that applies a voltage across the two metal terminals, an inverter that is disposed between the two metal terminals and the buck-boost converter and switches a direction of energization to the two metal terminals, and a controller that controls the inverter. When an energization time to the two metal terminals reaches the end of a prescribed time interval, the controller switches the direction of energization to the two metal terminals.Type: ApplicationFiled: January 12, 2024Publication date: July 18, 2024Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, NGK INSULATORS, LTD.Inventors: Shinobu SHIMASAKI, Takahiro SADAMITSU, Tatsuo IIDA, Katsumi SAIKI, Ryosuke SAKAI
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Patent number: 11964361Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.Type: GrantFiled: March 3, 2020Date of Patent: April 23, 2024Assignee: TOKYO SEIMITSU CO., LTD.Inventors: Takahiro Iida, Teruhiko Nishikawa, Tasuku Shimizu
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Patent number: 11907103Abstract: An appropriate test environment is selected while preventing test cases from being detained therein. A test environment determination device includes: an element selection unit that selects one or more test targets and one or more test environments for executing a test case based on target requirements described for specifications of an electronic control unit, which is a test target, and environment requirements described for specifications of a test environment for simulating an external environment of the test target; an environment operation information acquisition unit that acquires operation information on the test environments; and an environment selection unit that selects a combination of the selected test target and the selected test environment based on the acquired operation information.Type: GrantFiled: December 12, 2019Date of Patent: February 20, 2024Assignee: HITACHI ASTEMO, LTD.Inventors: Masashi Mizoguchi, Takahiro Iida, Toru Irie, Yoshimi Yamazaki
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Publication number: 20230409403Abstract: A control device includes a plurality of cores each having an array of one or more process portions that are started cyclically. The control device includes a first process portion having a given logical execution time set therefor, and a time monitoring unit that determines an execution state of each of the process portions in a determination time shorter than the logical execution time of the first process portion. The time monitoring unit determines whether a passage time from the start of the first process portion exceeds the determination time.Type: ApplicationFiled: August 30, 2021Publication date: December 21, 2023Applicant: Hitachi Astemo, Ltd.Inventors: Takahiro IIDA, Makoto IJUIN, Shin KAGOSHIMA
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Patent number: 11768721Abstract: The invention provides a technology for suppressing a delay in communication between a plurality of cores that perform parallel processing. In the invention, an ECU 302 of a vehicle control system 2 includes a plurality of cores 401 and a shared memory 405. When transmitting data in the inter-core communication, a transmission side core 401-1 writes a counter value updated according to the data and a writing order to a buffer unit 901 which is determined by a counter value managed for each communication system, which is stored in each of the plurality of buffer units 901 provided in the shared memory 405. When receiving data in the inter-core communication, a reception side core 401-2 reads data from the buffer unit 901 in which the latest data for each communication system is stored, which is determined by the counter value stored in each of the plurality of buffer units 901.Type: GrantFiled: March 12, 2019Date of Patent: September 26, 2023Assignee: Hitachi Astemo, Ltd.Inventors: Takahiro Iida, Takafumi Suzuki
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Patent number: 11724550Abstract: The tread pattern of the pneumatic tire includes an outer main groove, shoulder lug grooves, and vertical sipes. The outer main groove extends in the tire circumferential direction on an outer side of the tire centerline in the tire width direction. The shoulder lug grooves are spaced apart in the tire circumferential direction and provided in the shoulder land portion regions on an outer side of the outer main groove in the tire width direction, extend from the outer side in the tire width direction toward the outer main groove, are closed in a shoulder land portion region. Each of the vertical sipes has a narrower width than each of the shoulder lug grooves, crosses each of the shoulder lug grooves and extends in the tire circumferential direction. Each of the vertical sipes has a depth greater than a groove depth of each of the shoulder lug grooves.Type: GrantFiled: November 16, 2018Date of Patent: August 15, 2023Assignee: The Yokohama Rubber Co., Ltd.Inventor: Takahiro Iida
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Patent number: 11571785Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.Type: GrantFiled: May 28, 2021Date of Patent: February 7, 2023Assignee: TOKYO SEIMITSU CO., LTD.Inventors: Takahiro Iida, Teruhiko Nishikawa, Tasuku Shimizu
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Patent number: 11504869Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.Type: GrantFiled: February 26, 2021Date of Patent: November 22, 2022Assignee: TOKYO SEIMITSU CO., LTD.Inventors: Takahiro Iida, Teruhiko Nishikawa, Tasuku Shimizu
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Patent number: 11494167Abstract: Disclosed subject matter is related to project reusability including method and system for identifying reusable project components for building a new project. The method comprises extracting current requirement of the new project from one or more data sources, using NLP and detect pre-existing requirements associated with pre-existing projects, similar to the current requirement by performing semantic analysis of the current requirement and the pre-existing requirements using a predefined machine learning technique such as Latent Semantic Analysis (LSA) technique. Further, a similarity score is determined for each of the one or more pre-existing requirements based on degree of similarity between the current requirement and the pre-existing requirements.Type: GrantFiled: July 2, 2019Date of Patent: November 8, 2022Assignee: Hitachi Astemo, Ltd.Inventors: Takahiro Iida, Telang Geet Tapan, Satoshi Yashiro, Takafumi Suzuki, Masahiro Matsubara
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Patent number: 11472055Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.Type: GrantFiled: February 26, 2021Date of Patent: October 18, 2022Assignee: TOKYO SEIMITSU CO., LTD.Inventors: Takahiro Iida, Teruhiko Nishikawa, Tasuku Shimizu
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Patent number: 11409252Abstract: The present invention provides a vehicle control device and a vehicle control simulation device that enable, even for parallel processing with a plurality of arithmetic devices, approximation in act between at verification of simulation operation on a model base and at verification of operation on an actual vehicle. Provided are: control model information for control of a system; hardware information for operation of a control model; arithmetic-device allocation information as to which arithmetic device in hardware is allocated to perform arithmetic processing to a control program in the control model; delay time information regarding a case where the control model operates on the hardware; and a delay-time adding unit configured to create delay-inclusive control model information in which the delay time information is inserted in the control model, based on at least either the arithmetic-device allocation information or the hardware information.Type: GrantFiled: June 25, 2018Date of Patent: August 9, 2022Assignee: Hitachi Astemo, Ltd.Inventors: Takeshi Fukuda, Toru Irie, Takafumi Suzuki, Takahiro Iida
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Publication number: 20220058113Abstract: An appropriate test environment is selected while preventing test cases from being detained therein. A test environment determination device includes: an element selection unit that selects one or more test targets and one or more test environments for executing a test case based on target requirements described for specifications of an electronic control unit, which is a test target, and environment requirements described for specifications of a test environment for simulating an external environment of the test target; an environment operation information acquisition unit that acquires operation information on the test environments; and an environment selection unit that selects a combination of the selected test target and the selected test environment based on the acquired operation information.Type: ApplicationFiled: December 12, 2019Publication date: February 24, 2022Applicant: HITACHI ASTEMO, LTD.Inventors: Masashi MIZOGUCHI, Takahiro IIDA, Toru IRIE, Yoshimi YAMAZAKI
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Patent number: 11203673Abstract: A thermoplastic composite material comprising, a fiber bundle having a polypropylene emulsion impregnated therein and having a plurality of reinforcing fibers lined up in a predetermined direction, and satisfies the following conditions (1) to (4); and a formed body: (1) A void content of the thermoplastic composite material is 3% or less, (2) A fiber volume fraction of the thermoplastic composite material is 40% or more and 70% or less, (3) A bending strength of a laminated body, in which a plurality of layers of the thermoplastic composite material has been laminated so that the reinforcing fibers would be lined up in one direction, when bent in the fiber-axis direction and measured in conformity to JIS K7074, is 250 MPa or more, and a bending elastic modulus of the laminated body is 90 GPa or more, and (4) A variation coefficient of the bending strength, when measured at N=5 or more and calculated in conformity to JIS K7074, is within 7%.Type: GrantFiled: May 4, 2018Date of Patent: December 21, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Motoko Yoshizaki, Makiko Nakano, Takayori Ito, Yukihiro Ikura, Takahiro Iida, Yasumasa Morishima, Hidekazu Hara
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Publication number: 20210294581Abstract: Disclosed subject matter is related to project reusability including method and system for identifying reusable project components for building a new project. The method comprises extracting current requirement of the new project from one or more data sources, using NLP and detect pre-existing requirements associated with pre-existing projects, similar to the current requirement by performing semantic analysis of the current requirement and the pre-existing requirements using a predefined machine learning technique such as Latent Semantic Analysis (LSA) technique. Further, a similarity score is determined for each of the one or more pre-existing requirements based on degree of similarity between the current requirement and the pre-existing requirements.Type: ApplicationFiled: July 2, 2019Publication date: September 23, 2021Inventors: Takahiro IIDA, Telang Geet TAPAN, Satoshi YASHIRO, Takafumi SUZUKI, Masahiro MATSUBARA
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Publication number: 20210290047Abstract: An image processing apparatus includes: a processor including hardware. The processor is configured to extract pieces of positional information associated with image data captured by a capsule endoscope introduced into a digestive tract to calculate a movement amount of an image capturing position of the capsule endoscope in a luminal direction, acquire, from the pieces of positional information, a change amount of the image capturing position of the capsule endoscope in a direction different from the luminal direction, select first position information from among the pieces of positional information, the first position information being position information for which the change amount of the positional information is smaller than a first threshold and the movement amount is smaller than a second threshold, and generate a shape model of the digestive tract by using the first position information.Type: ApplicationFiled: June 7, 2021Publication date: September 23, 2021Applicant: OLYMPUS CORPORATIONInventors: Yusuke SUZUKI, Atsushi CHIBA, Takahiro IIDA
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Publication number: 20210283745Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.Type: ApplicationFiled: May 28, 2021Publication date: September 16, 2021Applicant: Tokyo Seimitsu Co., Ltd.Inventors: Takahiro IIDA, Teruhiko NISHIKAWA, Tasuku SHIMIZU
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Publication number: 20210245324Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.Type: ApplicationFiled: March 3, 2020Publication date: August 12, 2021Applicant: Tokyo Seimitsu Co., Ltd.Inventors: Takahiro IIDA, Teruhiko NISHIKAWA, Tasuku SHIMIZU