Patents by Inventor Takahiro Ikeda
Takahiro Ikeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12157987Abstract: A rotary working vehicle includes a lower traveling body, an upper rotating body, a rotating frame constituting the bottom of the upper rotating body, a boom bracket supported by the rotating frame so as to be capable pivoting horizontally, a first vertical plate and a second vertical plate, which are raised from the bottom plate of the rotating frame, a swing cylinder provided on the opposite side of the second vertical plate from the first vertical plate and connecting the rotating frame and the boom bracket, a protrusion piece protruding toward the swing cylinder from a side wall of the second vertical plate above the swing cylinder, a hose guide provided to the protrusion piece, and first and second hydraulic hoses which pass above the first vertical plate and the second vertical plate, extend downward from above through the hose guide, and reach the swing cylinder.Type: GrantFiled: December 28, 2021Date of Patent: December 3, 2024Assignee: YANMAR POWER TECHNOLOGY CO., LTD.Inventors: Mitsuyuki Hatanaka, Takahiro Ikeda
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Publication number: 20240258951Abstract: The servo system includes a servo motor, an encoder for detecting rotation information regarding the position and speed of the servo motor, and a servo amplifier for controlling the driving of the servo motor using the rotation information. The servo amplifier includes an encoder communication interface configured by hardware, a processor for calculating a control command to control the servo motor based on an operation command and the rotation information input through the encoder communication interface, and a control unit for controlling the driving of the servo motor based on the control command. Then, the processor compares the rotation information directly received from the encoder with the rotation information input through the encoder communication interface and diagnoses that there is a failure when both the pieces of rotation information do not match each other.Type: ApplicationFiled: June 10, 2022Publication date: August 1, 2024Inventors: Zhiyuan LUO, Takahiro IKEDA, Satoshi IIMURO, Kenji TAKEDA
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Publication number: 20240206079Abstract: A wiring circuit board includes a metal supporting layer, an adhesion layer, a first conductive layer, an insulating layer, and a second conductive layer. The adhesion layer is disposed on one-side surface of the metal supporting layer in the thickness direction, and contains at least one metal selected from the group Zr, Ti, W, Mo, V, Y, Nb, and Ta. The first conductive layer is disposed on one-side surface of the adhesion layer in the thickness direction, and has an insulating layer with a penetrating hole disposed on a one-side surface thereof. The second conductive layer includes a portion electrically connected with the metal supporting layer through the adhesion layer located in the penetrating hole. The second conductive layer is located at one side of the metal supporting layer in the penetrating hole and one side of the insulating layer in the thickness direction.Type: ApplicationFiled: December 7, 2023Publication date: June 20, 2024Applicant: NITTO DENKO CORPORATIONInventors: Takahiro IKEDA, Teppei NIINO
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Publication number: 20240206053Abstract: A method for producing a wiring circuit board includes a step (1) of producing a substrate with a metal support board including a metal support board and a step (2) of etching the metal support board. The wiring circuit board includes a frame, a mounting portion, an opening portion, and a joint. Each of the frame and the mounting portion includes a metal support layer, a base insulating layer, a conductive layer, and a cover insulating layer. The joint does not include the metal support layer. In step (2), by etching the metal support board corresponding to the opening portion and the joint from the other side in the thickness direction by using an etching resist, the metal support layer is formed.Type: ApplicationFiled: December 7, 2023Publication date: June 20, 2024Applicant: NITTO DENKO CORPORATIONInventors: Takahiro IKEDA, Teppei NIINO, Shusaku SHIBATA, Shoei TETSUKAWA
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Publication number: 20240040705Abstract: A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wiring circuit board in a direction in which the edge extends. The difference between the percentage of the area of the conductive pattern to the area of the insulating base layer and the percentage of the area of the dummy conductive pattern to the area of the dummy formation region is 50% or less.Type: ApplicationFiled: November 1, 2021Publication date: February 1, 2024Applicant: NITTO DENKO CORPORATIONInventors: Rihito FUKUSHIMA, Takahiro IKEDA, Shun SHIGA
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Publication number: 20240015884Abstract: Provided is a wiring circuit board that includes a metal supporting board; a first metal thin film; an insulating layer; a second metal thin film; and a conductive layer in order toward one side in a thickness direction. The metal supporting board includes a metal supporting layer and a surface metal layer. The surface metal layer is disposed on one surface in the thickness direction of the metal supporting layer and has higher conductivity than the metal supporting layer. The insulating layer has a through hole. The conductive layer has a via portion. The via portion is disposed in the through hole and is electrically connected to the metal supporting board.Type: ApplicationFiled: October 28, 2021Publication date: January 11, 2024Applicant: NITTO DENKO CORPORATIONInventors: Shusaku SHIBATA, Takahiro IKEDA, Teppei NIINO
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Publication number: 20240008178Abstract: A wiring circuit board includes a metal supporting board; an insulating layer; and a conductive layer in this order in a thickness direction. The conductive layer includes a terminal portion, and a tail line portion extending from the terminal portion. The terminal portion has a via portion that penetrates the insulating layer in the thickness direction and is connected to the metal supporting board. The tail line portion has a base end portion that has a width different from a width of the terminal portion in a direction orthogonal to the extending direction of the tail line portion and that is connected with the terminal portion; and a second via portion that penetrates the insulating layer in the thickness direction and that is connected to the metal supporting board.Type: ApplicationFiled: October 29, 2021Publication date: January 4, 2024Applicant: NITTO DENKO CORPORATIONInventors: Shusaku SHIBATA, Takahiro IKEDA, Teppei NIINO
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Publication number: 20240005059Abstract: To assess a risk involving a possibility of hindering an automobile in traveling in real time. When a new risk exists, dynamically generate a new traveling scenario, a risk management apparatus specifies a risk parameter indicating a risk involved in traveling of the automobile, from sensor information acquired by a sensor unit incorporated in the automobile, determines a level of correspondence of the risk parameter with an existing traveling scenario, based on a credibility level of the risk parameter and on a correlation level of the risk parameter with the existing traveling scenario stored in a scenario database, determines a driving control action for controlling driving of the automobile, based on the level of correspondence, and generates a new traveling scenario, based on a new risk parameter of which a correlation level with the existing traveling scenario stored in the scenario database does not satisfy a given correlation level criterion.Type: ApplicationFiled: November 16, 2021Publication date: January 4, 2024Inventors: Anjali RAJITH, Takahiro IKEDA
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Publication number: 20230422397Abstract: A wiring circuit board includes a metal supporting board, first and second metal thin films, an insulating layer, and a conductive layer, where the resistance between the conductive layer and metal supporting board are lowered. The first metal thin film is disposed on one surface of the metal supporting board in the thickness direction, with the insulating layer having a through hole. The second metal thin film is disposed on one surface of the insulating layer in the thickness direction with the conductive layer disposed thereon. In the through hole, the first and second metal thin films, whose surfaces contact, are disposed between the metal supporting board and the conductive layer, and the other surface of the first metal thin film is in contact with the one surface of the metal supporting board. The other surface of the second metal thin film is in contact with the conductive layer.Type: ApplicationFiled: June 21, 2023Publication date: December 28, 2023Applicant: NITTO DENKO CORPORATIONInventors: Takahiro IKEDA, Taketo ISHIKAWA, Yuki TAKEDA, Hironori KUWAYAMA, Kyotaro YAMADA
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Publication number: 20230413431Abstract: A wiring circuit board includes a metal supporting layer, a first metal thin film, an insulating layer including a through hole, a second metal thin film disposed on the first metal thin film in the through hole, and a conductive pattern electrically connected to the metal supporting layer through the first metal thin film and the second metal thin film in the through hole. The first metal thin film includes an oxide coating at least on a contact surface in contact with the insulating layer. In the central part of the through hole, the oxide coating has a thickness of 0 or a thickness smaller than a thickness of the oxide coating on the contact surface.Type: ApplicationFiled: June 6, 2023Publication date: December 21, 2023Applicant: NITTO DENKO CORPORATIONInventors: Takahiro IKEDA, Kyotaro YAMADA, Taketo ISHIKAWA, Hironori KUWAYAMA, Yuki TAKEDA
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Patent number: 11831253Abstract: A driving control apparatus controls an actuator that relatively moves a vibrator and a contact body contacting the vibrator, the vibrator being made to generate vibration by applying a first signal and a second signal having a phase difference. The driving control apparatus includes at least one processor or circuit configured to execute a plurality of tasks including a first determining task configured to determine the phase difference, and a second determining task configured to determine a voltage amplitude of power supplied to the actuator so that the voltage amplitude decreases as an absolute value of the phase difference decreases.Type: GrantFiled: December 8, 2020Date of Patent: November 28, 2023Assignee: CANON KABUSHIKI KAISHAInventor: Takahiro Ikeda
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Publication number: 20230324317Abstract: According to one embodiment, there is provided an inspection device including a measurement unit and a controller. The measurement unit measures a physical quantity in accordance with a predetermined pattern for a sample with the predetermined pattern, and generates a first spectral pattern in accordance with a measurement result. The controller predicts a processed cross-sectional shape by applying a parameter to a shape function indicating an ion flux amount in accordance with an etching depth in a case where the predetermined pattern is processed in dry etching processing, determines a second spectral pattern in accordance with the processed cross-sectional shape that has been predicted, adjusts the parameter while comparing the first spectral pattern with the second spectral pattern, and reconstructs the processed cross-sectional shape of the sample in accordance with an adjustment result.Type: ApplicationFiled: September 7, 2022Publication date: October 12, 2023Applicant: Kioxia CorporationInventors: Takahiro IKEDA, Takashi ICHIKAWA, Takaki HASHIMOTO, Hiroyuki TANIZAKI
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Publication number: 20230313388Abstract: A water electrolysis cell includes an anode disposed on one side across a solid polymer electrolyte membrane and a cathode disposed on another side. The anode is configured of an anode catalyst layer, an anode gas diffusion layer, and an anode separator, laminated in that order from a side of the solid polymer electrolyte membrane, a channel is provided in the anode separator, and the channel extends in a wave shape.Type: ApplicationFiled: February 15, 2023Publication date: October 5, 2023Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Joji YOSHIMURA, Ryuichi IWATA, Tsuyoshi HAMAGUCHI, Tomoyuki KAYAMA, Takahiro IKEDA
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Publication number: 20230304173Abstract: A water electrolysis cell includes an anode disposed on one side across a solid polymer electrolyte membrane and a cathode disposed on the other side. The anode is configured of an anode catalyst layer, an anode gas diffusion layer, and an anode separator, laminated in that order from a side of the solid polymer electrolyte membrane. The cathode is configured of a cathode catalyst layer, a cathode gas diffusion layer, and a cathode separator, laminated in that order from the side of the solid polymer electrolyte membrane. A first channel is provided in the anode separator, and a wall face of the first channel in the anode separator is imparted with water repellency. A second channel is provided in the cathode separator, and a wall face of the second channel in the cathode separator is imparted with hydrophilicity.Type: ApplicationFiled: February 1, 2023Publication date: September 28, 2023Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Joji YOSHIMURA, Tomoyuki KAYAMA, Tsuyoshi HAMAGUCHI, Ryuichi IWATA, Takahiro IKEDA
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Publication number: 20230295822Abstract: Provided is a method of controlling a load of a water electrolysis stack in which a plurality of water electrolysis cells including an anode disposed on one side and a cathode disposed on the other side with a solid polyelectrolyte film interposed are stacked and housed. The method includes determining an appropriate load based on a condition of an inside of the water electrolysis stack obtained from at least one of a temperature of the inside of the water electrolysis stack, an electrical resistance, or a water flow rate, and changing application of the load on the water electrolysis stack such that the load is the appropriate load.Type: ApplicationFiled: February 8, 2023Publication date: September 21, 2023Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Keisuke FUJITA, Tsuyoshi HAMAGUCHI, Ryuichi IWATA, Tomoyuki KAYAMA, Takahiro IKEDA
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Publication number: 20230133282Abstract: A wiring circuit board includes a metal support board, a first metal thin film, an insulating layer, a second metal thin film, and a conductive layer in a thickness direction order. The insulating layer includes a through hole penetrating in the thickness direction, which includes a first opening end at the first metal thin film side, a second opening end opposite to the first opening end, and an inner wall surface between the first and-the second opening ends. The first metal thin film includes a first opening portion, which overlaps the first opening end in a projection view in the thickness direction. The second metal thin film includes a second opening portion, which overlaps the first opening portion and the second opening end in a projection view in the thickness direction. The conductive layer has a via portion disposed in the through hole and connected to the metal support board.Type: ApplicationFiled: October 25, 2022Publication date: May 4, 2023Applicant: NITTO DENKO CORPORATIONInventors: Takahiro IKEDA, Teppei NIINO
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Patent number: 11457137Abstract: An electronic apparatus of the present invention includes: an acquisition unit configured to acquire an image captured on any one of a plurality of conditions in a predetermined period; a display control unit configured to implement control so that a plurality of images acquired by the acquisition unit are classified into groups correspondingly to the plurality of conditions and displayed; and a selection unit configured to implement control so that an operation target image is selected in accordance with user operation from the plurality of images that are classified and displayed by the display control unit.Type: GrantFiled: October 6, 2020Date of Patent: September 27, 2022Assignee: Canon Kabushiki KaishaInventor: Takahiro Ikeda
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Publication number: 20220136207Abstract: A rotary working vehicle is provided with: a lower traveling body; an upper rotating body; a rotating frame constituting the bottom of the upper rotating body; a boom bracket supported by the rotating frame so as to be capable pivoting horizontally; a first vertical plate and a second vertical plate, which are raised from the bottom plate of the rotating frame; a swing cylinder provided on the opposite side of the second vertical plate from the first vertical plate and connecting the rotating frame and the boom bracket; a protrusion piece protruding toward the swing cylinder from a side wall of the second vertical plate above the swing cylinder; a hose guide provided to the protrusion piece; and first and second hydraulic hoses which pass above the first vertical plate and the second vertical plate, extend downward from above through the hose guide, and reach the swing cylinder.Type: ApplicationFiled: December 28, 2021Publication date: May 5, 2022Inventors: Mitsuyuki HATANAKA, Takahiro IKEDA
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Patent number: 11236487Abstract: A rotary working vehicle is provided with: a lower traveling body; an upper rotating body; a rotating frame constituting the bottom of the upper rotating body; a boom bracket supported by the rotating frame so as to be capable pivoting horizontally; a first vertical plate and a second vertical plate, which are raised from the bottom plate of the rotating frame; a swing cylinder provided on the opposite side of the second vertical plate from the first vertical plate and connecting the rotating frame and the boom bracket; a protrusion piece protruding toward the swing cylinder from a side wall of the second vertical plate above the swing cylinder; a hose guide provided to the protrusion piece; and first and second hydraulic hoses which pass above the first vertical plate and the second vertical plate, extend downward from above through the hose guide, and reach the swing cylinder.Type: GrantFiled: June 4, 2019Date of Patent: February 1, 2022Assignee: YANMAR POWER TECHNOLOGY CO., LTD.Inventors: Mitsuyuki Hatanaka, Takahiro Ikeda
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Patent number: 11143987Abstract: An intermediate transfer belt includes a base layer that has ionic conductivity and is a thickest layer out of multiple layers making up the intermediate transfer belt with respect to the thickness direction of the intermediate transfer belt, and an inner layer having electronic conductivity and a lower electrical resistance than the base layer.Type: GrantFiled: November 2, 2018Date of Patent: October 12, 2021Assignee: CANON KABUSHIKI KAISHAInventors: Tsuguhiro Yoshida, Masaru Shimura, Shinji Katagiri, Eiichi Hamana, Takahiro Ikeda, Takayuki Tanaka, Shuichi Tetsuno