Patents by Inventor Takahiro Iljima

Takahiro Iljima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package, method of manufacturing the same, and semiconductor device
    Patent number: 6884655
    Abstract: A wiring layer for serving as a first electrode layer of a capacitor portion patterned in a predetermined shape on an insulative base member is formed. A resin layer for serving as a dielectric layer of the capacitor portion is formed on a surface of the wiring layer using an electrophoretic process. Another wiring layer for serving as a second electrode layer of the capacitor portion patterned in a predetermined shape by patterning on the insulative base member inclusive of the resin layer is formed.
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: April 26, 2005
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Takahiro Iljima, Akio Rokugawa, Noriyoshi Shimizu
  • SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE
    Publication number: 20040209398
    Abstract: A wiring layer for serving as a first electrode layer of a capacitor portion patterned in a predetermined shape on an insulative base member is formed. A resin layer for serving as a dielectric layer of the capacitor portion is formed on a surface of the wiring layer using an electrophoretic process. Another wiring layer for serving as a second electrode layer of the capacitor portion patterned in a predetermined shape by patterning on the insulative base member inclusive of the resin layer is formed.
    Type: Application
    Filed: June 4, 2004
    Publication date: October 21, 2004
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takahiro Iljima, Akio Rokugawa, Noriyoshi Shimizu