Patents by Inventor Takahiro Ishizaki

Takahiro Ishizaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11053562
    Abstract: An objective of the invention is to provide an austenitic stainless steel article having superior irradiation resistance and stress corrosion cracking resistance than before while maintaining mechanical properties equivalent to those of conventional ones. There is provided a dispersion strengthened austenitic stainless steel article, including: 16-26 mass % of Cr; 8-22 mass % of Ni; 0.005-0.08 mass % of C; 0.002-0.1 mass % of N; 0.02-0.4 mass % of O; at least one of 0.2-2.8 mass % of Zr, 0.4-5 mass % of Ta, and 0.2-2.6 mass % of Ti; and a balance consisting of Fe and inevitable impurities. The Zr, Ta and Ti components form inclusion particles in the stainless steel article by combining with the C, N and O components. The stainless steel article has an average grain size of 1 ?m or less and a maximum grain size of 5 ?m or less.
    Type: Grant
    Filed: October 19, 2016
    Date of Patent: July 6, 2021
    Assignee: HITACHI, LTD.
    Inventors: Takahiro Ishizaki, Yusaku Maruno
  • Publication number: 20210189537
    Abstract: An austenitic stainless steel includes a mixed grain structure composed of a columnar crystal having an average crystal grain size of 20 ?m or less and an equiaxed crystal having an average crystal grain size of 5.0 ?m or less, in which an area proportion of the columnar crystal in the mixed grain structure is 20% or more, and an average crystal grain size of the whole mixed grain structure is 5.0 ?m or less. Accordingly, it is possible to provide a material having excellent irradiation resistance and mechanical properties.
    Type: Application
    Filed: March 11, 2019
    Publication date: June 24, 2021
    Inventors: Takahiro ISHIZAKI, Yusaku MARUNO, Kinya AOTA, Yingjuan YANG
  • Patent number: 10840524
    Abstract: A building comprises a structural material configured to form a framework of the building; a hydrogen storing alloy integrated with the structural material; a temperature regulator provided inside of the structural material such as to regulate temperature of the structural material; and a piping provided inside of the structural material such as to cause hydrogen taken out from the hydrogen storing alloy to flow therethrough.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: November 17, 2020
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takaharu Tateishi, Takahiro Ishizaki, Mizuki Kiuchi, Yusuke Kaneko, Kazuhiko Miyamoto
  • Publication number: 20200083548
    Abstract: A building comprises a structural material configured to form a framework of the building; a hydrogen storing alloy integrated with the structural material; a temperature regulator provided inside of the structural material such as to regulate temperature of the structural material; and a piping provided inside of the structural material such as to cause hydrogen taken out from the hydrogen storing alloy to flow therethrough.
    Type: Application
    Filed: August 9, 2019
    Publication date: March 12, 2020
    Inventors: Takaharu TATEISHI, Takahiro ISHIZAKI, Mizuki KIUCHI, Yusuke KANEKO, Kazuhiko MIYAMOTO
  • Publication number: 20180274053
    Abstract: An objective of the invention is to provide an austenitic stainless steel article having superior irradiation resistance and stress corrosion cracking resistance than before while maintaining mechanical properties equivalent to those of conventional ones. There is provided a dispersion strengthened austenitic stainless steel article, including: 16-26 mass % of Cr; 8-22 mass % of Ni; 0.005-0.08 mass % of C; 0.002-0.1 mass % of N; 0.02-0.4 mass % of O; at least one of 0.2-2.8 mass % of Zr, 0.4-5 mass % of Ta, and 0.2-2.6 mass % of Ti; and a balance consisting of Fe and inevitable impurities. The Zr, Ta and Ti components form inclusion particles in the stainless steel article by combining with the C, N and O components. The stainless steel article has an average grain size of 1 ?m or less and a maximum grain size of 5 ?m or less.
    Type: Application
    Filed: October 19, 2016
    Publication date: September 27, 2018
    Inventors: Takahiro ISHIZAKI, Yusaku MARUNO
  • Publication number: 20170167005
    Abstract: An object of the present invention is to provide austenitic stainless steel having a high strength and high corrosion resistance while improving resistance to irradiation and reducing irradiation-induced stress corrosion cracking. A solution is as follows. Austenitic stainless steel of the present invention contains Cr: 16 to 26%, Ni: 8 to 22%, O: 0.02 to 0.4%, C: 0.08% or less, and N: 0.1% or less by weight, and further contains at least one kind of Zr: 0.2 to 2.8%, Ta: 0.4 to 5. 0%, and Ti: 0.2 to 2.6%, the balance being Fe and unavoidable impurities, wherein Zr, Ta, and Ti are precipitated as precipitates of one or more kinds of oxide particles, carbide particles, nitride particles, and composite particles thereof.
    Type: Application
    Filed: March 18, 2015
    Publication date: June 15, 2017
    Applicant: HITACHI, LTD.
    Inventors: Takahiro ISHIZAKI, Junya KANEDA
  • Patent number: 9359676
    Abstract: An tank such as an electroless copper plating tank 200, includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: June 7, 2016
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Teruyuki Hotta, Hisamitsu Yamamoto, Takahiro Ishizaki, Masayuki Utsumi, Takuya Okamachi, Syunsaku Hoshi, Fujio Asa, Junji Mizumoto
  • Patent number: 9120113
    Abstract: A tank body 100 includes a liquid receiving part 2 for receiving processing solution Q applied to a plate-like work 10 and a liquid retaining part 4 for retaining liquids to be applied to the plate-like work 10 and a liquid outflowing part 6 for causing a flow of the processing solution Q which is spilled out of the liquid retaining part 4 and traveled down toward the plate-like work 10, wherein a tip 6a of the liquid outflowing part 6 is projected from a connecting part 5 connecting to the liquid retaining part 4 (or the liquid receiving part 2).
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: September 1, 2015
    Assignee: C. UYEMURA & CO., LTD.
    Inventors: Teruyuki Hotta, Hisamitsu Yamamoto, Masayuki Utsumi, Takahiro Ishizaki
  • Patent number: 9045836
    Abstract: The regeneration unit includes a tubular portion having the inner circumferential surface functioning as an anode, and a cathode provided inside the tubular portion and extending along the extension direction of the tubular portion in a state of separation from the inner circumferential surface. The treatment liquid used for desmearing treatment is fed through a gap between the inner circumferential surface of the tubular portion and the cathode. A feed-side conduit is connected by a downstream end portion thereof to the tubular portion and guides the treatment liquid discharged from a desmearing treatment tank into a regeneration unit. A return-side conduit is connected by an upstream end portion thereof to the tubular portion and guides the treatment liquid discharged from the regeneration unit into the desmearing treatment tank.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: June 2, 2015
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Yoshikazu Saijo, Hisamitsu Yamamoto, Takahiro Ishizaki
  • Publication number: 20140116334
    Abstract: An tank such as an electroless copper plating tank 200, includes a liquid squirting part 4 having a squirt port 6 for squirting the processing solution Q from the squirt port 6 toward the treatment object obliquely upward to a horizontal plane, and hitting the processing solution Q on the upper area of the plate-like work 10 so that the processing solution Q runs down the plate-like work 10.
    Type: Application
    Filed: September 26, 2013
    Publication date: May 1, 2014
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Teruyuki HOTTA, Hisamitsu YAMAMOTO, Takahiro ISHIZAKI, Masayuki UTSUMI, Takuya OKAMACHI, Syunsaku HOSHI, Fujio ASA, Junji MIZUMOTO
  • Publication number: 20140053774
    Abstract: A tank body 100 includes a liquid receiving part 2 for receiving processing solution Q applied to a plate-like work 10 and a liquid retaining part 4 for retaining liquids to be applied to the plate-like work 10 and a liquid outflowing part 6 for causing a flow of the processing solution Q which is spilled out of the liquid retaining part 4 and traveled down toward the plate-like work 10, wherein a tip 6a of the liquid outflowing part 6 is projected from a connecting part 5 connecting to the liquid retaining part 4 (or the liquid receiving part 2).
    Type: Application
    Filed: July 26, 2013
    Publication date: February 27, 2014
    Applicant: C. Uyemura & Co., Ltd.
    Inventors: Teruyuki HOTTA, Hisamitsu YAMAMOTO, Masayuki UTSUMI, Takahiro ISHIZAKI
  • Publication number: 20130295294
    Abstract: Provided are an electroless copper plating bath and an electroless copper plating method using the electroless copper plating bath, the electroless copper plating bath not containing formaldehyde; being usable under approximately neutral pH conditions; improving plating bath stability; and capable of forming a plating film with a good thickness while controlling deposition outside a pattern. The electroless copper plating bath according to the present invention contains a water-soluble copper salt, and amine borane or a substituted derivative thereof as a reducing agent; does not contain formaldehyde; and has a pH of 4 to 9, wherein polyaminopolyphosphonic acid as a complexing agent, an anionic surface-active agent, an antimony compound, and a nitrogen-containing aromatic compound are contained.
    Type: Application
    Filed: December 28, 2012
    Publication date: November 7, 2013
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Takahiro ISHIZAKI, Tomoharu NAKAYAMA, Teruyuki HOTTA
  • Patent number: 8276270
    Abstract: The present invention is directed to a method for manufacturing a printed circuit board in which a plurality of conductive layers forming a wiring pattern are laminated in the state where they are put between insulating layers, and a printed circuit board formed thereby. The printed circuit board manufacturing method for the present invention includes a step of forming a via fill (17) to allow electroless plating liquid to be in contact with the surface of the wiring pattern exposed to a bottom part of a via hole (14) formed at a insulating layer to laminate plating metallic film from the bottom part to a opening part of the via hole (14), to form the via fill (17), and a step of forming a wiring pattern to form electroless plating metallic film (20) serving as the wiring pattern onto a substrate where the via fill (17) is formed.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: October 2, 2012
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Teruyuki Hotta, Shushi Morimoto, Takahiro Ishizaki, Hisamitsu Yamamoto
  • Patent number: 8262831
    Abstract: A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer (2L) is formed on an insulating resin (11) that forms a first insulating layer (1L). An insulating resin (13) that forms a second insulating layer (3L) is laminated on the insulating resin (11) on which the circuit pattern has been formed. A trench (14) is formed in the laminated insulating resin (13) to expose the circuit pattern. An electroless plating metal (15) is buried by electroless plating in the trench (14) formed.
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: September 11, 2012
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Shigeo Hashimoto, Teruyuki Hotta, Takahiro Ishizaki
  • Patent number: 8197583
    Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.
    Type: Grant
    Filed: November 14, 2011
    Date of Patent: June 12, 2012
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Teruyuki Hotta, Takahiro Ishizaki, Tomohiro Kawase, Masaharu Takeuchi
  • Patent number: 8137447
    Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: March 20, 2012
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Teruyuki Hotta, Takahiro Ishizaki, Tomohiro Kawase, Masaharu Takeuchi
  • Publication number: 20120058254
    Abstract: Disclosed is an electroless plating solution exhibiting a good plating metal filling performance even for larger trenches or vias of several to one hundred and tens of ?m, in a manner free from voids or seams, and allowing maintenance of stabilized performance for prolonged time. The electroless plating solution contains at least a water-soluble metal salt, a reducing agent for reducing metal ions derived from the water-soluble metal salt, and a chelating agent. In addition, the electroless plating solution contains a sulfur-based organic compound as a leveler having at least one aliphatic cyclic group or aromatic cyclic group to which may be linked at least one optional substituent. The aliphatic cyclic group or the aromatic cyclic group contains optional numbers of carbon atoms, oxygen atoms, phosphorus atoms, sulfur atoms and nitrogen atoms.
    Type: Application
    Filed: November 14, 2011
    Publication date: March 8, 2012
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Teruyuki Hotta, Takahiro Ishizaki, Tomohiro Kawase, Masaharu Takeuchi
  • Publication number: 20120048728
    Abstract: The regeneration unit includes a tubular portion having the inner circumferential surface functioning as an anode, and a cathode provided inside the tubular portion and extending along the extension direction of the tubular portion in a state of separation from the inner circumferential surface. The treatment liquid used for desmearing treatment is fed through a gap between the inner circumferential surface of the tubular portion and the cathode. A feed-side conduit is connected by a downstream end portion thereof to the tubular portion and guides the treatment liquid discharged from a desmearing treatment tank into a regeneration unit. A return-side conduit is connected by an upstream end portion thereof to the tubular portion and guides the treatment liquid discharged from the regeneration unit into the desmearing treatment tank.
    Type: Application
    Filed: August 26, 2011
    Publication date: March 1, 2012
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Yoshikazu SAIJO, Hisamitsu YAMAMOTO, Takahiro ISHIZAKI
  • Publication number: 20110259373
    Abstract: A surface processing method and a surface processing agent for effectively removing smear produced in a via or the like are disclosed. The smear is to be removed without etching an inner metalized layer without using expensive permanganates that might impose a greater load on an environment and operators. By removing the smear, the tightness in adhesion between an inner metalized circuit layer and plating metal as well as reliability in electrical connection may be improved. To this end, a surface processing method for a resin-containing substrate of a printed circuit board is provided in which the smear left in an opening, such as a blind via, a through-hole or a trench, formed in the substrate, may be removed without etching a metalized inner layer.
    Type: Application
    Filed: April 19, 2011
    Publication date: October 27, 2011
    Applicant: C. UYEMURA CO., LTD
    Inventors: Teruyuki Hotta, Takahiro Ishizaki
  • Publication number: 20100243149
    Abstract: A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer (2L) is formed on an insulating resin (11) that forms a first insulating layer (1L). An insulating resin (13) that forms a second insulating layer (3L) is laminated on the insulating resin (11) on which the circuit pattern has been formed. A trench (14) is formed in the laminated insulating resin (13) to expose the circuit pattern. An electroless plating metal (15) is buried by electroless plating in the trench (14) formed.
    Type: Application
    Filed: October 3, 2008
    Publication date: September 30, 2010
    Applicant: C. UYEMURA & CO., LTD
    Inventors: Shigeo Hashimoto, Teruyuki Hotta, Takahiro Ishizaki