Patents by Inventor Takahiro Isozaki

Takahiro Isozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9267217
    Abstract: An object of the present invention is to provide a production method for an R—Fe—B based sintered magnet having a plating film excellent in adhesiveness on the surface thereof, by conducting a series of processes of acid cleaning and smut removal as pretreatments of an R—Fe—B based sintered magnet, and the subsequent plating treatment effectively without causing trouble. The production method of the present invention includes a series of processes of acid cleaning and smut removal of a magnet as pretreatments, and the subsequent plating treatment is conducted consistently with a state, in which the magnet is placed in a barrel made of synthetic resin. The smut removal is conducted by ultrasonic cleaning of the magnet with rotating the barrel in water in which the dissolved oxygen amount is set to 0.1 ppm to 6 ppm by degassing.
    Type: Grant
    Filed: January 4, 2012
    Date of Patent: February 23, 2016
    Assignee: HITACHI METALS, LTD.
    Inventors: Masanao Kamachi, Koshi Yoshimura, Takahiro Isozaki
  • Publication number: 20130313125
    Abstract: An object of the present invention is to provide a production method for an R—Fe—B based sintered magnet having a plating film excellent in adhesiveness on the surface thereof, by conducting a series of processes of acid cleaning and smut removal as pretreatments of a plating treatment of an R—Fe—B based sintered magnet, and the subsequent plating treatment, effectively without requiring troubles. The production method for an R—Fe—B based sintered magnet having a plating film on the surface thereof of the present invention, as a solution method therefor, is characterized in that a series of processes of acid cleaning and smut removal of a magnet as pretreatments of a plating treatment, and the subsequent plating treatment is conducted consistently with a state, in which the magnet is placed in a barrel made of synthetic resin, and that the smut removal is conducted by ultrasonic cleaning of the magnet with rotating the barrel in water in which the dissolved oxygen amount is set to 0.
    Type: Application
    Filed: January 4, 2012
    Publication date: November 28, 2013
    Applicant: HITACHI METALS, LTD.
    Inventors: Masanao Kamachi, Koshi Yoshimura, Takahiro Isozaki
  • Patent number: 6923898
    Abstract: An electroplating device including an anode inserted through and disposed in a hole provided in a work and communicating with the outside, and a member for rotating the work about its center axis and supplying a plating electric current to the work. Alternatively, a separate member may supply the plating electric current to the work. A plating solution in the hole in the work may be allowed to flow. Thus, a uniform plated film can be formed on both of the outer and inner surfaces of the work having the communicating with the outside such as a ring-shaped work, of which a ring-shaped bonded magnet is representative, by using the electroplating device.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: August 2, 2005
    Assignee: Neomax Co., Ltd.
    Inventors: Kohshi Yoshimura, Takeshi Nishiuchi, Fumiaki Kikui, Masahiro Asano, Takahiro Isozaki
  • Patent number: 6474949
    Abstract: An apparatus for and a method of evacuating a vacuum chamber (process chamber) or the like of a semiconductor fabrication facility, for example. The evacuating apparatus has a vacuum chamber to be evacuated, a discharge pipe connecting the vacuum chamber to an atmospheric port, a vacuum pump connected to the discharge pipe and operable at a variable rotational speed, and a controller for controlling the rotational speed of the vacuum pump.
    Type: Grant
    Filed: November 20, 2000
    Date of Patent: November 5, 2002
    Assignee: Ebara Corporation
    Inventors: Satoshi Arai, Katsuaki Usui, Takahiro Isozaki
  • Patent number: 6423369
    Abstract: A molded product having pores in its surface, an inorganic powder, a fat and oil and media are placed into a treating vessel, and a kinetic energy is supplied to the contents of the treating vessel, thereby forcing the inorganic powder into the pores and hardening it in the pores. In another process, a molded product having pores in its surface and an inorganic powder producing material are placed into a treating vessel, and a kinetic energy is supplied to the contents of the treating vessel, thereby forcing an inorganic powder produced from the inorganic powder producing material into the pores and hardening it in the pores. The inorganic powder producing material performs a role of producing an inorganic powder by the collision of pieces of the inorganic powder producing material against one another, against the molded product and against the inner wall of the vessel, and a role as media for forcing the produced inorganic powder into the pores.
    Type: Grant
    Filed: April 21, 2000
    Date of Patent: July 23, 2002
    Assignee: Sumitomo Special Metals Co., Ltd.
    Inventors: Kohshi Yoshimura, Takeshi Nishiuchi, Fumiaki Kikui, Masahiro Asano, Takahiro Isozaki
  • Publication number: 20020079229
    Abstract: The present invention provides an electroplating device including an anode inserted through and disposed in a hole provided in a work and communicating with the outside, and a member for rotating the work about its center axis and supplying a plating electric current to the work. The present invention also provides an electroplating device including an anode inserted through and disposed in a hole provided in a work and communicating with the outside, a member for rotating the work about its center axis, and a member for supplying a plating electric current to the work. Further, the present invention provides an electroplating device including an anode inserted through and disposed in a hole provided in a work and communicating with the outside, and a means for allowing a plating solution in the hole in the work to flow.
    Type: Application
    Filed: December 28, 2001
    Publication date: June 27, 2002
    Applicant: SUMITOMO SPECIAL METALS CO., LTD.
    Inventors: Kohshi Yoshimura, Takeshi Nishiuchi, Fumiaki Kikui, Masahiro Asano, Takahiro Isozaki
  • Patent number: 6348138
    Abstract: The present invention provides an electroplating device including an anode inserted through and disposed in a hole provided in a work and communicating with the outside, and a member for rotating the work about its center axis and supplying a plating electric current to the work. Thus, a uniform plated film can be formed on both of the outer and inner surfaces of the work having the hole communicating with the outside such as a ring-shaped work, of which a ring-shaped bonded magnet is representative, by using the electroplating device.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: February 19, 2002
    Assignee: Sumitomo Special Metals Co., Ltd.
    Inventors: Kohshi Yoshimura, Takeshi Nishiuchi, Fumiaki Kikui, Masahiro Asano, Takahiro Isozaki