Patents by Inventor Takahiro Kawai
Takahiro Kawai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110275703Abstract: The present invention provides a compound represented by Formula (II): wherein R1 is a chlorine atom, a fluorine atom, a methyl group or an ethynyl group; Ar is a group represented by the following Formula (a), Formula (b), Formula (c) or Formula (d): wherein R2 is a C1-6 alkyl group which may be substituted with one or more halogen atoms, a C1-6 alkoxy group which may be substituted with one or more halogen atoms, a C1-3 alkylthio group, a halogen atom, a C1-3 alkylcarbonyl group or a C2-5 alkynyl group which may be substituted with —OR4; R3 is a hydrogen atom or a C1-3 alkyl group; R4 is a hydrogen atom or a C1-3 alkyl group; provided that Ar is a group represented by Formula (a) when R1 is a fluorine atom, methyl group or an ethynyl group, and that R2 is methoxy group, an ethoxy group, an isopropyl group, a propyl group, a trifluoromethyl group, a trifluoromethoxy group, 2-fluoroethyl group or 1-propynyl group when R1 is a methyl group or a pharmaceutically acceptable salt or a solvate thereof aType: ApplicationFiled: July 27, 2007Publication date: November 10, 2011Applicant: CHUGAI SEIYAKU KABUSHIKI KAISHAInventors: Tsutomu Sato, Kiyofumi Honda, Takahiro Kawai, Koo Hyeon Ahn
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Publication number: 20110262748Abstract: An affinity chromatography packing material includes porous mother particles that include a copolymer of a monomer mixture including a crosslinkable vinyl monomer and an epoxy group-containing vinyl monomer, a ligand being bound to the porous mother particles, and the porous mother particles including a ring-opening epoxy group produced by ring-opening of the epoxy group included in the porous mother particles.Type: ApplicationFiled: September 24, 2009Publication date: October 27, 2011Applicant: JSR CorporationInventors: Kouji Tamori, Tetsuo Fukuta, Masaaki Miyaji, Yong Wang, Takayoshi Abe, Yuusuke Okano, Masaki Momiyama, Takahiro Kawai
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Publication number: 20110233454Abstract: Organic polymer particles having a structure shown by the following formula (1) are disclosed. wherein A represents an alkylidene group, an alkylene group, a cyclohexylene group, or a phenylene group, and B represents a linear or branched alkylene group or an alkylidene group having 1 to 6 carbon atoms.Type: ApplicationFiled: June 3, 2011Publication date: September 29, 2011Applicant: JSR CORPORATIONInventors: Kouji TAMORI, Eiji TAKAMOTO, Takahiro KAWAI
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Patent number: 7981512Abstract: Organic polymer particles having a structure shown by the following formula (1) are disclosed. wherein A represents an alkylidene group, an alkylene group, a cyclohexylene group, or a phenylene group, and B represents a linear or branched alkylene group or an alkylidene group having 1 to 6 carbon atoms.Type: GrantFiled: July 5, 2007Date of Patent: July 19, 2011Assignee: JSR CorporationInventors: Kouji Tamori, Eiji Takamoto, Takahiro Kawai
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Publication number: 20100022755Abstract: A platelet aggregation inducing substance containing as an active ingredient a polypeptide having a peptide fragment represented by formula (1) (component A): -(Pro-X-Gly)n- ??(1) wherein X represents Pro or Hyp; and n represents an integer of from 20 to 5,000.Type: ApplicationFiled: December 12, 2007Publication date: January 28, 2010Applicant: CHISSO CORPORATIONInventors: Yasuto Umeda, Shinichi Takasaki, Takafumi Takebayashi, Takahiro Kawai
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Publication number: 20080160277Abstract: Magnetic particles comprise magnetic mother particles (A) having a particle diameter of d and non-magnetic child particles (B) having a particle diameter of d/2 or less stacked on the surface of the magnetic mother particles (A).Type: ApplicationFiled: December 20, 2007Publication date: July 3, 2008Applicant: JSR CorporationInventors: Kouji Tamori, Eiji Takamoto, Takahiro Kawai
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Publication number: 20080078974Abstract: Organic polymer particles having a structure shown by the following formula (1) are disclosed. wherein A represents an alkylidene group, an alkylene group, a cyclohexylene group, or a phenylene group, and B represents a linear or branched alkylene group or an alkylidene group having 1 to 6 carbon atoms.Type: ApplicationFiled: July 5, 2007Publication date: April 3, 2008Applicant: JSR CORPORATIONInventors: Kouji TAMORI, Eiji Takamoto, Takahiro Kawai
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Publication number: 20040117193Abstract: An audio decoding reproduction apparatus includes an input data analyzer, a decoding channel controller and a decoding processor. The input data analyzer analyzes an input data stream to decide the number and types of the source channels of the input data stream. The decoding processor generates decoded data of at least one channel by decoding data in the input data stream. In response to the number and types of the source channels the input data analyzer decides, the decoding channel controller adjusts the number and types of the channels of the decoded data the decoding processor decodes. The audio decoding reproduction apparatus can make effective use of its processing ability without generating the unnecessary decoded data.Type: ApplicationFiled: June 5, 2003Publication date: June 17, 2004Applicant: RENESAS TECHNOLOGY CORPORATIONInventor: Takahiro Kawai
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Publication number: 20020166685Abstract: The invention provides a technique for mounting circuit elements, in which short circuits between the electrodes of the circuit element do not occur when using silver paste to mount the circuit element. On a board 1 between conductors 2 on which a circuit element 4 is mounted, an insulating resin layer 6 is formed, which is about twice as wide as the circuit element 4, and has a thickness that fills the gap between the mounted circuit element 4 and the board 1. The insulating resin layer 6 is made of a resin whose curing speed is faster than that of a silver paste 5, and is cured at the same time as the curing step of the silver paste 5.Type: ApplicationFiled: January 24, 2002Publication date: November 14, 2002Applicant: NGK Insulators, Ltd.Inventors: Kikuji Miyamura, Susumu Nomoto, Mitsuo Nakahashi, Takahiro Kawai
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Patent number: 6363514Abstract: A sound reproducing system that decodes audio data in a frame with which detection of a syncword fails, if a syncword included in a subsequent frame is detected, if correctness of bit stream information in the subsequent frame is proved, and if no CRC error is detected (when CRC is included). This makes it possible to solve a problem involved in a conventional system in that when a unit frame without an error check pattern is input and a synchronization detector produces a synchronization detection error signal, unpleasant sound interruption can take place even if the audio data is correct, because the correctness of the audio data cannot be checked, and hence the audio data cannot be decoded in this case.Type: GrantFiled: January 5, 1999Date of Patent: March 26, 2002Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Takahiro Kawai, Chuya Hayashi
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Patent number: 6331829Abstract: There is provided a decoding device comprising a unit for checking whether an error occurs in pack header information which is extracted from each pack by a pack header information extracting unit, for retrieving pack header information that mostly conforms to a specific standard from a pack header information database if the extracted pack header information has an error, and for replacing the extracted pack header information having an error with the pack header information that mostly conforms to the specific standard to enable a packet header detecting unit to detect the packet header.Type: GrantFiled: November 9, 1999Date of Patent: December 18, 2001Assignee: Mitsubishi Denki Kabushiki KaishaInventor: Takahiro Kawai
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Publication number: 20010033237Abstract: There is provided a decoding device comprising a unit for checking whether an error occurs in pack header information which is extracted from each pack by a pack header information extracting unit, for retrieving pack header information that mostly conforms to a specific standard from a pack header information database if the extracted pack header information has an error, and for replacing the extracted pack header information having an error with the pack header information that mostly conforms to the specific standard to enable a packet header detecting unit to detect the packet header.Type: ApplicationFiled: November 9, 1999Publication date: October 25, 2001Inventor: TAKAHIRO KAWAI
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Patent number: 6080598Abstract: In a method of producing a semiconductor laser element with suppression of mirror degradation by the laser light which can operate stably with a high output power, a laser wafer is prepared to have a layered structure of semiconductor layers including an active layer, followed by forming contact electrodes on the top and the bottom of the wafer, cleaving the wafer in a ultra high vacuum chamber to provide a laser bar, and covering cleaved end faces of the laser bar with semiconductor amorphous layers, as protective layers, of a compound semiconductor material between a third group element and a fifth group element in the element periodic table, to form a protected laser bar. An example of the amorphous layer is of GaAs semiconductor material. Then, a laser element without mirror degradation is obtained by forming dielectric films on the protective layers.Type: GrantFiled: January 6, 1997Date of Patent: June 27, 2000Assignee: NEC CorporationInventor: Takahiro Kawai
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Patent number: 6024150Abstract: An apparatus for manufacturing a cutter and attaching the cutter to a carton including a vertically movable upper mold provided with an upper blade having an edge and a suction device for sucking and holding a severed nonmetallic cutter, a fixed lower mold provided with a lower blade having an edge where the lower mold engages with the upper mold, a feeding device for intermittently feeding a sheet on the lower mold, and a conveying device for conveying and setting sequentially the cartons one-by-one to a bottom dead center of the upper mold. In the alternative, the lower mold can be vertically movable and include the section device while the upper mold is fixed.Type: GrantFiled: December 16, 1998Date of Patent: February 15, 2000Assignee: Dai Nippon Printing Co., Ltd.Inventors: Takahiro Kawai, Atsushi Maruyama, Hiroshi Sano, Mineo Mukai, Masataka Okushita, Hiroshi Miyama, Yasuyuki Sasaki
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Patent number: 5943356Abstract: In a semiconductor laser, a first dielectric layer is formed on the front face of a laser diode for producing a compressive stress, and a second dielectric layer is formed on the first dielectric layer for producing a tensile stress for counteracting the compressive stress of the first dielectric layer. The first dielectric layer is formed of a substance such as Al.sub.2 O.sub.3 and the second dielectric layer is formed of a substance such as SiN.sub.x. A high stability into is created between the first dielectric layer and the front face of the laser diode to prevent it from suffering from a castrophic optical damage.Type: GrantFiled: June 5, 1997Date of Patent: August 24, 1999Assignee: NEC CorporationInventor: Takahiro Kawai
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Patent number: 5897736Abstract: A method of attaching a cutter to a carton includes the steps of feeding intermittently a nonmetallic sheet by a feeding device toward upper and lower molds, one of which is vertically movable, punching the nonmetallic sheet by the molds to form the cutter, conveying and setting cartons one by one by a conveying device, sucking and holding the cutter on the movable mold, and pressing the cutter to the carton which is adhered thereto by an adhesive paste applied to the cutter. The nonmetallic sheet has an adhesive paste on one side and a removable sheet on the paste which is peeled away prior to punching.Type: GrantFiled: November 12, 1996Date of Patent: April 27, 1999Assignee: Dai Nippon Printing Co., Ltd.Inventors: Takahiro Kawai, Atsushi Maruyama, Hiroshi Sano, Mineo Mukai
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Patent number: 5301294Abstract: An address bus control system is provided of the type in which a controller including a central processing unit is connected through an address bus and a data bus to hardware modules which control equipment to be controlled. An address space defined by an address bus includes a discrimination space for discriminating the attribute of the hardware module and a function space for allocating and clearing an address space for a function interface of the hardware module. The attribute of a hardware module connected to a connector having a corresponding address is recognized using the discrimination space. The function interface of each hardware module is assigned a space within the function space in accordance with the contents of the discrimination space in concern, or the assigned space is canceled.Type: GrantFiled: April 23, 1991Date of Patent: April 5, 1994Assignees: Hitachi Ltd., Hitachi Techno Engineering Co., Ltd.Inventors: Takahiro Kawai, Masatsugu Shinozaki, Hitoshi Sadamitsu, Tadashi Kyoda, Katsuya Takanashi, Hironori Uchida
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Patent number: 5200253Abstract: A thin film of molten polypropylene resin extruded from a T die is pressed and cooled with a chill roll equipped with a hologram relief master plate on its peripheral surface, whereupon a hologram pattern is simultaneously formed as an integral part of the polypropylene resin sheet being molded. Since the polypropylene resin has a Rockwell hardness of at least 70, the hologram pattern formed in the resulting hologram forming sheet is less likely to be damaged or lost during subsequent processing.Type: GrantFiled: August 3, 1990Date of Patent: April 6, 1993Assignee: Dai Nippon Insatsu Kabushiki KaishaInventors: Masahisa Yamaguchi, Hitoshi Fujii, Shuichi Kobayashi, Takahiro Kawai