Abstract: A process allocation control device achieves efficient control of satisfactorily utilizing an accelerator included in an information processing device by including: a reception unit that receives a request to execute a process, which can be executed by a plurality of processors having different configurations and has different characteristics of performance exhibited through execution by the different processors; a detection unit that detects the states of the plurality of processors; and an allocation unit that allocates execution of the process to at least one of the plurality of processors on the basis of the states of the plurality of processors and the characteristics of the process.

Abstract: A substrate liquid processing apparatus includes a processing liquid storage unit configured to store a processing liquid therein; a processing liquid drain unit configured to drain the processing liquid from the processing liquid storage unit; and a control unit. The control unit performs a first control in a constant concentration mode in which a concentration of the processing liquid in the processing liquid storage unit is regulated to a predetermined set concentration and a second control in a concentration changing mode in which the concentration of the processing liquid is changed. In the second control, a set concentration after concentration change is compared with a set concentration before the concentration change, and when the set concentration after the concentration change is lower, the control unit controls the processing liquid drain unit to start draining of the processing liquid.

Abstract: A control device for a substrate processing apparatus stores a plurality of records each including a recipe for a substrate etching processing and a control value for a control target, the control value being an actual output value for the control target in the substrate etching processing; acquires a recipe at a start of the substrate etching processing when an abnormality occurs in the temperature sensor or in the concentration sensor; reads a record from among the plurality of records having a recipe identical to the recipe acquired at the start of the substrate etching processing; and executes the substrate etching processing based on the control value of the record read by the processor.

Abstract: A control device for a substrate processing apparatus stores a plurality of records each including a recipe for a substrate etching processing and a control value for a control target, the control value being an actual output value for the control target in the substrate etching processing; acquires a recipe at a start of the substrate etching processing when an abnormality occurs in the temperature sensor or in the concentration sensor; reads a record from among the plurality of records having a recipe identical to the recipe acquired at the start of the substrate etching processing; and executes the substrate etching processing based on the control value of the record read by the processor.

Abstract: A substrate processing method includes generating a plurality of records each including a piece of recipe information in a substrate processing in association with control value information of a control target in the substrate processing, storing the plurality of records generated in the generating, acquiring recipe information input by an operator when performing the substrate processing, reading a record including recipe information identical to the recipe information acquired in the acquiring, and controlling the control target based on the control value information in the recipe information of the record read in the reading.

Abstract: Disclosed is a method for performing a liquid processing on a substrate using an aqueous solution of a chemical agent at a predetermined concentration as a processing liquid. The method includes: storing the processing liquid in a processing liquid storage unit; and supplying an aqueous solution of the chemical agent at a different concentration from the concentration of the processing liquid to the processing liquid storage unit, discharging the processing liquid from the processing liquid storage unit so as to update the processing liquid stored in the processing liquid storage unit. The aqueous solution in a predetermined amount is supplied to the processing liquid storage unit, and the processing liquid is discharged from the processing liquid storage unit, the processing liquid containing the chemical agent in the same amount as the amount of the chemical agent contained in the aqueous solution supplied to the processing liquid storage unit.

Abstract: A substrate processing method includes generating a plurality of records each including a piece of recipe information in a substrate processing in association with control value information of a control target in the substrate processing, storing the plurality of records generated in the generating, acquiring recipe information input by an operator when performing the substrate processing, reading a record including recipe information identical to the recipe information acquired in the acquiring, and controlling the control target based on the control value information in the recipe information of the record read in the reading.

Abstract: A substrate liquid processing apparatus A1 includes a processing liquid storage unit 38 configured to store a processing liquid therein; a processing liquid drain unit 41 configured to drain the processing liquid from the processing liquid storage unit 38; and a control unit 7. The control unit 7 performs a first control in a constant concentration mode in which a concentration of the processing liquid in the processing liquid storage unit 38 is regulated to a predetermined set concentration and a second control in a concentration changing mode in which the concentration of the processing liquid is changed. In the second control, a set concentration after concentration change is compared with a set concentration before the concentration change, and when the set concentration after the concentration change is lower, the control unit controls the processing liquid drain unit 41 to start draining of the processing liquid.

Abstract: Provided is an etching method including: an etching step of performing an etching processing using an etching liquid on a workpiece accommodated in an etching processing unit; and an interval step between the etching step on the workpiece and a next etching step on another workpiece. The etching step includes a first partial replacement pattern including discharging the etching liquid in the etching processing unit provided for the etching processing by a first set amount, and supplying a new etching liquid into the etching processing unit by a second set amount, and the interval step includes a second partial replacement pattern including discharging the etching liquid in the etching processing unit provided for the etching processing by a third set amount, and supplying a new etching liquid into the etching processing unit by a fourth set amount.

Abstract: [Problem] To perform precise etching treatment on a wafer by maintaining in a given range the concentration of leached components in an etching solution leaching from a wafer, without completely replacing the etching solution. [Solution] This etching method comprises a plurality of etching steps, and an interval step between each of the etching steps. Each etching step contains a first partial replacement pattern wherein only a first set amount of the etching solution supplied for the etching treatment is discharged, and only a second set amount of fresh etching solution is supplied. The interval step contains a second partial replacement pattern wherein only a third set amount of the etching solution supplied for the etching treatment is discharged, and only a fourth set amount of the fresh etching solution is supplied.

Abstract: Disclosed is a method for performing a liquid processing on a substrate using an aqueous solution of a chemical agent at a predetermined concentration as a processing liquid. The method includes: storing the processing liquid in a processing liquid storage unit; and supplying an aqueous solution of the chemical agent at a different concentration from the concentration of the processing liquid to the processing liquid storage unit, discharging the processing liquid from the processing liquid storage unit so as to update the processing liquid stored in the processing liquid storage unit. The aqueous solution in a predetermined amount is supplied to the processing liquid storage unit, and the processing liquid is discharged from the processing liquid storage unit, the processing liquid containing the chemical agent in the same amount as the amount of the chemical agent contained in the aqueous solution supplied to the processing liquid storage unit.