Patents by Inventor Takahiro KIKUNAGA
Takahiro KIKUNAGA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240132805Abstract: A cleaning composition for semiconductor substrates, containing an alkaline compound (A), a corrosion inhibitor (B), and water, wherein the alkaline compound (A) is at least one selected from the group consisting of a quaternary ammonium hydroxide (A1) and potassium hydroxide (A2), and the corrosion inhibitor (B) is at least one selected from the group consisting of 4-substituted pyrazoles, potassium tris(1-pyrazolyl)borohydride, 2-(4-thiazolyl)benzimidazole, and halogenated-8-hydroxyquinolines.Type: ApplicationFiled: March 4, 2022Publication date: April 25, 2024Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Hiroaki TAKAKUWA, Akinobu HORITA, Takahiro KIKUNAGA
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Publication number: 20230365893Abstract: A cleaning composition for semiconductor substrates. The cleaning composition comprises hydrogen peroxide, a hydrogen peroxide stabilizing agent, an alkaline compound, and water. The hydrogen peroxide stabilizing agent is oxalic acid, diethylenetriaminepentaacetic acid, hydroxyethyliminodiacetic acid, potassium oxalate, 5-phenyl-1H-tetrazole, triethylenetetraminehexaacetic acid, trans-1,2-cyclohexanediaminetetraacetic acid, 8-quinolinol, L(+)-isoleucine, DL-valine, L(-)-proline, hydroxyethylethylenediaminetriacetic acid, N,N-di(2-hydroxyethyl)glycine, glycine, L-tryptophan, 2,6-pyridinedicarboxylic acid, benzothiazole, or DL-alanine. The alkaline compound is a quaternary ammonium hydroxide or potassium hydroxide.Type: ApplicationFiled: September 22, 2021Publication date: November 16, 2023Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Hiroaki HORIE, Akinobu HORITA, Makoto HAMANAKA, Kenji SHIMADA, Takahiro KIKUNAGA
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Patent number: 11629315Abstract: An aqueous composition includes (A) from 0.0001 to 10 mass % of one or more kinds of compounds selected from a C4-13 alkylphosphonic acid, a C4-13 alkylphosphonate ester, a C4-13 alkyl phosphate and a salt thereof, with respect to the total amount of the aqueous composition; and (B) from 0.0001 to 50 mass % of an acid other than the C4-13 alkylphosphonic acid, the C4-13 alkylphosphonate ester and the C4-13 alkyl phosphate or a salt thereof, with respect to the total amount of the aqueous composition.Type: GrantFiled: April 25, 2019Date of Patent: April 18, 2023Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Toshiyuki Oie, Takahiro Kikunaga, Akinobu Horita, Kenji Yamada
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Patent number: 11613720Abstract: An aqueous composition includes (A) from 0.001 to 20 mass % of one or more kinds of fluorine-containing compounds selected from tetrafluoroboric acid, hexafluorosilicic acid, hexafluoroaluminic acid, hexafluorotitanic acid and a salt thereof, with respect to the total amount of the aqueous composition; and (B) from 0.0001 to 10 mass % of one or more kinds of compounds selected from a C4-13 alkylphosphonic acid, a C4-13 alkylphosphonate ester, a C4-13 alkyl phosphate and a salt thereof, with respect to the total amount of the aqueous composition.Type: GrantFiled: April 25, 2019Date of Patent: March 28, 2023Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Toshiyuki Oie, Akinobu Horita, Takahiro Kikunaga, Kenji Yamada
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Patent number: 11479744Abstract: The present invention pertains to: a composition capable of removing dry etching residue present on the surface of a semiconductor integrated circuit, while suppressing alumina damage in a production process for the semiconductor integrated circuit; a cleaning method for semiconductor substrates that use alumina; and a production method for a semiconductor substrate having an alumina layer. This composition is characterized by containing 0.00005%-1% by mass of a barium compound (A) and 0.01%-20% by mass of a fluorine compound (B) and having a pH of 2.5-8.0.Type: GrantFiled: February 27, 2019Date of Patent: October 25, 2022Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Toshiyuki Oie, Akinobu Horita, Kenji Yamada, Takahiro Kikunaga
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Patent number: 11441109Abstract: The present invention can provide a cleaning solution containing 0.2-20 mass % of an amine compound (A), 40-70 mass % of a water-soluble organic solvent (B), and water, wherein the amine compound (A) contains at least one selected from the group consisting of n-butylamine, hexylamine, octylamine, 1,4-butanediamine, dibutylamine, 3-amino-1-propanol, N,N-diethyl-1,3-diaminopropane, and bis(hexamethylene)triamine, and the water-soluble organic solvent (B) has a viscosity of 10 mPa·s or less at 20° C. and a pH of 9.0-14.Type: GrantFiled: March 5, 2019Date of Patent: September 13, 2022Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Takahiro Kikunaga, Hiroaki Horie, Kimihiro Aoyama, Nobuo Tajima
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Patent number: 11352593Abstract: An aqueous composition may include: (A) a fluoride ion supply source in an amount that gives a fluoride ion concentration of 0.05 to 30 mmol/L in the composition; (B) a cation supply source in an amount that gives a mole ratio of cations of 0.3 to 20 to the fluoride ions in the composition; and (C) 0.0001 to 10 mass % of one or more compounds selected from a C4-13 alkylphosphonic acid, a C4-13 alkylphosphonate ester, a C4-13 alkyl phosphate and a salt thereof, with respect to the total amount of the composition, wherein pH is in a range of from 2 to 6.Type: GrantFiled: April 25, 2019Date of Patent: June 7, 2022Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Akinobu Horita, Toshiyuki Oie, Takahiro Kikunaga, Kenji Yamada
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Publication number: 20210155881Abstract: An aqueous composition may include: (A) a fluoride ion supply source in an amount that gives a fluoride ion concentration of 0.05 to 30 mmol/L in the composition; (B) a cation supply source in an amount that gives a mole ratio of cations of 0.3 to 20 to the fluoride ions in the composition; and (C) 0.0001 to 10 mass % of one or more compounds selected from a C4-13 alkylphosphonic acid, a C4-13 alkylphosphonate ester, a C4-13 alkyl phosphate and a salt thereof, with respect to the total amount of the composition, wherein pH is in a range of from 2 to 6.Type: ApplicationFiled: April 25, 2019Publication date: May 27, 2021Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Akinobu HORITA, Toshiyuki OIE, Takahiro KIKUNAGA, Kenji YAMADA
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Publication number: 20210147768Abstract: An aqueous composition includes (A) from 0.0001 to 10 mass % of one or more kinds of compounds selected from a C4-13 alkylphosphonic acid, a C4-13 alkylphosphonate ester, a C4-13 alkyl phosphate and a salt thereof, with respect to the total amount of the aqueous composition; and (B) from 0.0001 to 50 mass % of an acid other than the C4-13 alkylphosphonic acid, the C4-13 alkylphosphonate ester and the C4-13 alkyl phosphate or a salt thereof, with respect to the total amount of the aqueous composition.Type: ApplicationFiled: April 25, 2019Publication date: May 20, 2021Applicant: Mitsubishi gas chemical company, INC.Inventors: Toshiyuki OIE, Takahiro KIKUNAGA, Akinobu HORITA, Kenji YAMADA
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Publication number: 20210047594Abstract: The present invention can provide a cleaning solution containing 0.2-20 mass % of an amine compound (A), 40-70 mass % of a water-soluble organic solvent (B), and water, wherein the amine compound (A) contains at least one selected from the group consisting of n-butylamine, hexylamine, octylamine, 1,4-butanediamine, dibutylamine, 3-amino-1-propanol, N,N-diethyl-1,3-diaminopropane, and bis(hexamethylene)triamine, and the water-soluble organic solvent (B) has a viscosity of 10 mPa·s or less at 20° C. and a pH of 9.0-14.Type: ApplicationFiled: March 5, 2019Publication date: February 18, 2021Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Takahiro KIKUNAGA, Hiroaki HORIE, Kimihiro AOYAMA, Nobuo TAJIMA
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Publication number: 20210047593Abstract: An aqueous composition includes (A) from 0.001 to 20 mass % of one or more kinds of fluorine-containing compounds selected from tetrafluoroboric acid, hexafluorosilicic acid, hexafluoroaluminic acid, hexafluorotitanic acid and a salt thereof, with respect to the total amount of the aqueous composition; and (B) from 0.0001 to 10 mass % of one or more kinds of compounds selected from a C4-13 alkylphosphonic acid, a C4-13 alkylphosphonate ester, a C4-13 alkyl phosphate and a salt thereof, with respect to the total amount of the aqueous composition.Type: ApplicationFiled: April 25, 2019Publication date: February 18, 2021Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Toshiyuki OIE, Akinobu HORITA, Takahiro KIKUNAGA, Kenji YAMADA
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Publication number: 20210002591Abstract: The present invention pertains to: a composition capable of removing dry etching residue present on the surface of a semiconductor integrated circuit, while suppressing alumina damage in a production process for the semiconductor integrated circuit; a cleaning method for semiconductor substrates that use alumina; and a production method for a semiconductor substrate having an alumina layer. This composition is characterized by containing 0.00005%-1% by mass of a barium compound (A) and 0.01%-20% by mass of a fluorine compound (B) and having a pH of 2.5-8.0.Type: ApplicationFiled: February 27, 2019Publication date: January 7, 2021Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Toshiyuki OIE, Akinobu HORITA, Kenji YAMADA, Takahiro KIKUNAGA