Abstract: To provide a circuit module capable of reducing the influence of noise transmitted through a shield film on an inductor mounted on a substrate. A circuit module according to the present disclosure includes a substrate, an inductor mounted on a surface of the substrate, a sealing resin provided on the surface of the substrate and covering the inductor, a conductive shield film covering the sealing resin, and a wire disposed between the inductor on the surface of the substrate and the side film of the shield film. The one end portion of the wire is electrically connected to the side film. The other end portion of the wire is electrically connected to the surface of the substrate. In plan view, an imaginary straight line passing through the one end portion and the other end portion of the wire is inclined with respect to the side film.

Abstract: An ESD protection device includes a ceramic base material, a pair of opposed electrodes provided on a surface of or in the ceramic base material, and a discharge auxiliary electrode film arranged to connect the pair of opposed electrodes, wherein the discharge auxiliary electrode film is composed of a material containing, as its main constituents, metallic particles and glass covering the metallic particles. The discharge auxiliary electrode film is formed by providing an electrode paste containing glass-coated metallic particles that have an approximately 15% rate of increase in weight at about 400° C. for about 2 hours in air, a resin binder, and a solvent so as to connect the pair of opposed electrodes to each other, and then firing at a temperature of about 600° C. or more, higher than a softening point of glass of the glass-coated metallic particles, and not +200° C. higher than the softening point.

Abstract: An ESD protection device includes a ceramic multilayer substrate, at least one pair of discharge electrodes provided in the ceramic multilayer substrate and facing each other with a space formed therebetween, external electrodes provided on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode obtained by dispersing a metal material and a semiconductor material and being arranged in a region that connects the pair of discharge electrodes to each other.

Abstract: An ESD protection device includes a ceramic base material, a pair of opposed electrodes provided on a surface of or in the ceramic base material, and a discharge auxiliary electrode film arranged to connect the pair of opposed electrodes, wherein the discharge auxiliary electrode film is composed of a material containing, as its main constituents, metallic particles and glass covering the metallic particles. The discharge auxiliary electrode film is formed by providing an electrode paste containing glass-coated metallic particles that have an approximately 15% rate of increase in weight at about 400° C. for about 2 hours in air, a resin binder, and a solvent so as to connect the pair of opposed electrodes to each other, and then firing at a temperature of about 600° C. or more, higher than a softening point of glass of the glass-coated metallic particles, and not +200° C. higher than the softening point.

Abstract: An ESD protection device includes a ceramic multilayer substrate, at least one pair of discharge electrodes provided in the ceramic multilayer substrate and facing each other with a space formed therebetween, external electrodes provided on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode obtained by dispersing a metal material and a semiconductor material and being arranged in a region that connects the pair of discharge electrodes to each other.