Abstract: A binder, including a fluoropolymer, the fluoropolymer including a polymerization unit based on vinylidene fluoride and a polymerization unit based on a monomer having an amide group represented by —CO—NRR? (R and R? are the same as or different from each other and each represent a hydrogen atom or an alkyl group optionally having a substituent group) or an amide bond represented by —CO—NR?— (R? represents a hydrogen atom, an alkyl group optionally having a substituent group, or a phenyl group optionally having a substituent group) and having a solution viscosity of 10 to 20,000 mPa·s. Also disclosed is a positive electrode mixture and a negative electrode mixture containing the binder, a positive electrode, a negative electrode and a lithium ion secondary cell.

Abstract: A crosslinkable fluororubber composition containing: a fluororubber (A); and a fluororesin (B), wherein the fluororesin (B) is a copolymer (B1) consisting of tetrafluoroethylene units (a) and hexafluoropropylene units (b) or a copolymer (B2) containing tetrafluoroethylene units (a), hexafluoropropylene units (b), and polymerized units (c) derived from a monomer copolymerizable with tetrafluoroethylene and hexafluoropropylene, the copolymer (B1) satisfies the condition that the ratio (a)/(b) is (80.0 to 87.3)/(12.7 to 20.0) on a molar basis, and the copolymer (B2) satisfies the condition that the ratio (a)/(b) is (80.0 to 90.0)/(10.0 to 20.0) on a molar basis, and the ratio (c)/{(a)+(b)} is (0.1 to 10.0)/(90.0 to 99.9) on a molar basis.

Abstract: The present invention aims to provide an acrylic rubber composition capable of giving an acrylic rubber molded product good in low-friction properties and non-sticking properties. The present invention relates to an acrylic rubber composition containing an acrylic rubber (A) and a fluororesin (B), the fluororesin (B) being a perfluororesin.

Abstract: The present invention provides a fluid transfer member having thermal stability on the occasion of molding, stress cracking resistance and low liquid chemical permeability at the same time. The present invention is a fluid transfer member which is composed by a laminate containing a layer [P] comprising a fluoropolymer and/or a fluorine-free organic material and a layer [Q] comprising a chlorotrifluoroethylene copolymer.

Abstract: The present invention provides a laminate having an environmental cracking resistance for a fuel and a fuel impermeability and, in addition, higher in productivity. The present invention is a laminate including a chlorotrifluoroethylene copolymer layer (C) and a fluorine-free organic material layer (K), wherein the chlorotrifluoroethylene copolymer has a melt flow rate of 15.0 to 40.0 (g/10 minutes) and contains 15.0 to 25.0 mole percent of chlorotrifluoroethylene units relative to all monomer units.

Abstract: A method of producing a fluororesin composition includes copolymerizing at least tetrafluoroethylene with hexafluoropropylene so that a melt flow rate at 372 degree C. of the copolymer formed in the copolymerization changes from 0.05-5.0 grams/10 minutes to 10-60 grams/10 minutes. The tetrafluoroethylene/hexafluoropropylene copolymer can be used as a coating on an electrical wire.

Abstract: Provided is a film for a film capacitor in which electrical insulation, and especially electrical properties at high temperatures are improved while a high dielectric constant of a vinylidene fluoride resin is maintained. The film for a film capacitor includes a tetrafluoroethylene resin (a1) that includes a vinylidene fluoride unit and a tetrafluoroethylene unit in the vinylidene fluoride unit/tetrafluoroethylene unit ratio (mol %) of 0/100 to 49/51 as a film-forming resin (A).

Abstract: The present invention provides a fluoropolymer capable of giving fluorine-containing molded materials and laminates excellent in moldability, productivity, interlaminar bonding and stress cracking resistance, in particular stress cracking resistance upon contacting with various liquid chemicals, without impairing such characteristics intrinsic in fluororesins as chemical resistance, solvent resistance, weathering resistance, antifouling properties, liquid chemical impermeability and nonstickiness. The present invention provides a fluoropolymer which is an oligomer-containing or oligomer-free fluoropolymer, wherein said oligomer has a molecular weight not higher than 10,000 and amounts to not more than 0.05% by mass relative to the fluoropolymer.

Abstract: The present invention provides an organosol composition that is stable even in the case that the PTFE particle content is high. The present invention relates to an organosol composition of PTFE particles, comprising PTFE particles (A), a polymer (B), and an organic solvent (S), wherein (1) the polymer (B) is soluble in the organic solvent (S), (2) the amount of the PTFE particles (A) is not lower than 50% by mass of the total amount of the PTFE particles (A) and the polymer (B), and (3) the precipitation ratio of the PTFE particles after 48 hours is not higher than 60% when the total solids concentration of the PTFE particles (A) and the polymer (B) is 5% by mass.

Abstract: It is an object of the present invention to provide a fluororesin composition which hardly causes molding defects even when high-speed molding is performed in covering extrusion molding within a relatively broad molding temperature range and which can give covered electric wires, in particular foamed electric wires, excellent in surface smoothness. A fluororesin composition comprising a polytetrafluoroethylene [PTFE] having a standard specific gravity of 2.15 to 2.30 and a tetrafluoroethylene/hexafluoropropylene-based copolymer [FEP], the content of said PTFE being 0.

Abstract: The present invention provides a fluoropolymer capable of giving fluorine-containing molded materials and laminates excellent in moldability, productivity, interlaminar bonding and stress cracking resistance, in particular stress cracking resistance upon contacting with various liquid chemicals, without impairing such characteristics intrinsic in fluororesins as chemical resistance, solvent resistance, weathering resistance, antifouling properties, liquid chemical impermeability and nonstickiness. The present invention provides a fluoropolymer which is an oligomer-containing or oligomer-free fluoropolymer, wherein said oligomer has a molecular weight not higher than 10,000 and amounts to not more than 0.05% by mass relative to the fluoropolymer.

Abstract: An object of the present invention it to provide a novel fluororesin that has excellent mechanical strength and chemical resistance, and very low permeability at high temperature. The fluorine resin a copolymer that includes copolymerized units derived from tetrafluoroethylene, vinylidene fluoride, and an ethylenically unsaturated monomer other than tetrafluoroethylene and vinylidene fluoride. The fluororesin has a storage modulus E?, as measured at 170° C. by a dynamic viscoelasticity analysis, in the range of 60 to 400 MPa.

Abstract: It is an object of the present invention to provide a fluororesin composition which hardly causes molding defects even when high-speed molding is performed in covering extrusion molding within a relatively broad molding temperature range and which can give covered electric wires, in particular foamed electric wires, excellent in surface smoothness. A fluororesin composition comprising a polytetrafluoroethylene [PTFE] having a standard specific gravity of 2.15 to 2.30 and a tetrafluoroethylene/hexafluoropropylene-based copolymer [FEP], the content of said PTFE being 0.

Abstract: The present invention provides a fluoropolymer capable of giving fluorine-containing molded materials and laminates excellent in moldability, productivity, interlaminar bonding and stress cracking resistance, in particular stress cracking resistance upon contacting with various liquid chemicals, without impairing such characteristics intrinsic in fluororesins as chemical resistance, solvent resistance, weathering resistance, antifouling properties, liquid chemical impermeability and nonstickiness. The present invention provides a fluoropolymer which is an oligomer-containing or oligomer-free fluoropolymer, wherein said oligomer has a molecular weight not higher than 10,000 and amounts to not more than 0.05% by mass relative to the fluoropolymer.

Abstract: A tetrafluoroethylene/hexafluoropropylene copolymer has improved moldability in melt extrusion molding, especially with significant reduction of defects in high-speed extrusion coating of an electrical wire. The tetrafluoroethylene/hexafluoropropylene copolymer is obtained by polymerization of at least tetrafluoroethylene and hexafluoropropylene selected from the group consisting of tetrafluoroethylene, hexafluoropropylene and a third monomer without mixing with the resin which has the melting point with the difference of 20 degree C. and more from the melting point of the tetrafluoroethylene/hexafluoropropylene copolymer; and has a complex viscosity of from 2.0×I03 to 10.0×I03 Pa*s and a storage modulus of from 0.1 to 3.5 Pa*s in melt viscoelasticity measurement under the condition of atmosphere temperature of 310 degree C. and angular frequency of 0.01 radian/second. The tetrafluoroethylene/hexafluoropropylene copolymer can be used in an electrical wire as a coating on a conductive core.

Abstract: A fluororesin composition including a tetrafluoroethylene/hexafluoropropylene-based copolymer and 0.01 to 3 parts by mass per 100 parts the copolymer of a polytetrafluoroethylene having a standard specific gravity of 2.15 to 2.30, and being obtained by mixing an aqueous dispersion of the tetrafluoroethylene/hexafluoropropylene-based copolymer with an aqueous dispersion of the polytetrafluoroethylene, causing coagulation, drying the polymer mixture and melt-extruding the same.

Abstract: A fluororesin which does not cause cone break, when used for insulating a core wire having a diameter of 0.05 to 0.07 mm under the conditions of a resin temperature of 320 to 370° C., a drawdown rate [DDR] of 80 to 120, a draw rate balance [DRB] of 1.0, a wire coating speed of 700 feet/minute and an insulating thickness of 30 to 50 ?m.

Abstract: The present invention provides a laminate which is highly impermeable to fuels and has high fuel crack resistance. The present invention is a laminate having: a layer (A) comprising a fluorinated ethylenic polymer; a layer (B) comprising a chlorotrifluoroethylene copolymer; and a layer (C) comprising a fluorine-free organic material (P); the fluorinated ethylenic polymer being different from the chlorotrifluoroethylene copolymer forming the layer (B) in one and the same laminate and the layer (A), the layer (B), and the layer (C) being bonded together in that order.

Abstract: The present invention provides a laminate having an environmental cracking resistance for a fuel and a fuel impermeability and, in addition, higher in productivity. The present invention is a laminate including a chlorotrifluoroethylene copolymer layer (C) and a fluorine-free organic material layer (K), wherein the chlorotrifluoroethylene copolymer has a melt flow rate of 15.0 to 40.0 (g/10 minutes) and contains 15.0 to 25.0 mole percent of chlorotrifluoroethylene units relative to all monomer units.

Abstract: The present invention provides a CTFE copolymer-containing laminate produced by coextrusion molding of a PFA and/or FEP layer and a CTFE copolymer layer with the thermal degradation of the latter layer being suppressed and the liquid chemical impermeability and gas barrier properties, among others, being improved as well as a method of producing the same. The present invention is a chlorotrifluoroethylene copolymer-containing laminate having a layer (A) comprising a tetrafluoroethylene/perfluoro(vinyl ether) copolymer and/or a tetrafluoroethylene/hexafluoropropylene copolymer and a layer (B) comprising a chlorotrifluoroethylene copolymer, the layer (A) and the layer (B) being formed by coextrusion molding under a condition such that the temperature of a flow path (pa) through which a layer (A)-forming material (a) flows is 300 to 400° C. and the temperature of a flow path (pb) through which a layer (B)-forming material (b) flows is 250 to 350° C.