Patents by Inventor Takahiro Koshimizu

Takahiro Koshimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical semiconductor-sealing composition
    Patent number: 8263686
    Abstract: The present invention provides an optical semiconductor encapsulating composition comprising (A) an epoxy compound, (B) a carboxylic anhydride curing agent, (C) a curing accelerator, and (D) surface-coated silica particles having an average particle diameter of 5 to 50 nm in which 0.2 to 3 mmol of a silane coupling agent (D2) that contains an epoxy group-containing silane coupling agent (d1) is reacted with 1 g of silica particles (D1) to surface-coat the silica particles, the epoxy group being converted into a hydroxyl group through ring opening; and an optical semiconductor device in which an optical semiconductor is encapsulated with the composition.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: September 11, 2012
    Assignee: Arakawa Chemical Industries, Ltd.
    Inventors: Hideharu Takeuchi, Kouki Hamata, Masaki Kobayashi, Minoru Murata, Takahiro Koshimizu
  • OPTICAL SEMICONDUCTOR-SEALING COMPOSITION
    Publication number: 20100171146
    Abstract: The present invention provides an optical semiconductor encapsulating composition comprising (A) an epoxy compound, (B) a carboxylic anhydride curing agent, (C) a curing accelerator, and (D) surface-coated silica particles having an average particle diameter of 5 to 50 nm in which 0.2 to 3 mmol of a silane coupling agent (D2) that contains an epoxy group-containing silane coupling agent (d1) is reacted with 1 g of silica particles (D1) to surface-coat the silica particles, the epoxy group being converted into a hydroxyl group through ring opening; and an optical semiconductor device in which an optical semiconductor is encapsulated with the composition.
    Type: Application
    Filed: July 1, 2008
    Publication date: July 8, 2010
    Inventors: Hideharu Takeuchi, Kouki Hamata, Masaki Kobayashi, Minoru Murata, Takahiro Koshimizu