Abstract: A surface treatment technique having excellent adhering function, excellent reacting function and rich diversity is provided. The surface treatment includes applying a solution containing compound (?) to a substrate and thus providing compound (?) thereon, wherein: the compound (?) is at least one of Formula [IV] and Formula [V]: wherein A is —N(Ra)Rb—Si(Rc)n(ORd)3?n, or —N{Rb—Si(Rc)n(ORd)3?n}2, B is ——N(Re)Rf(NH2)m, or —N{Rf(NH2(m}2, C is A, B, or —N(Rg)Rh, D is Ri and wherein each of Ra, Re, and Rg is independently H or a hydrocarbon group, Rb, Rc, Rd, Rf, Rh, and Ri are hydrocarbon groups, n is 0, 1, or 2, and m is 1 or 2.

Abstract: Provided is an electronic machine including a speaker unit; a housing; and a rotating device. The rotating device rotates the speaker unit with respect to the housing, wherein the speaker unit is provided with an opening portion and a member which is supported by the housing and extends substantially in parallel to a rotational axis of the speaker unit is adapted to passing through the opening portion.

Abstract: Provided is an electronic machine that is provided with a speaker and that enables a direction of the speaker to be appropriately and arbitrarily changed. The electronic machine includes a speaker unit, housings, and a rotating device. The speaker unit is supported by the housing. The rotating device includes a first rotating device configured to rotate the speaker unit with respect to the housings about a direction intersecting with an axis of the housings serving as a rotational axis, and a second rotating device configured to rotate the speaker unit with respect to the housings about the axis of the housings serving as a rotational axis.

Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.

Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.

Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.

Abstract: A transmitting device includes: a compressing unit configured to generate and output a compressed digital signal that has been compressed, by converting an input digital signal by use of a Walsh function and extracting a specific frequency component.

Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.

Abstract: Provided is a surface treatment technique whereby excellent adhering function, excellent reacting function and rich diversity can be established. A surface treatment method that comprises applying a solution containing compound (?) to a substrate and thus providing compound (?) thereon, wherein: said compound (?) has at least an M-OH group and/or a group capable of forming M-OH (wherein M represents a metal atom), an amino group and a triazine ring; one or more said M-OH groups and/or groups capable of forming M-OH (wherein M represents a metal atom) are present; said amino group is bonded to a terminal; one or more said amino groups bonded to the terminal are present; and one or more said triazine rings are present.

Abstract: Provided is an electronic machine that is provided with a speaker and that enables a direction of the speaker to be appropriately and arbitrarily changed. The electronic machine includes a speaker unit, housings, and a rotating device. The speaker unit is supported by the housing. The rotating device includes a first rotating device configured to rotate the speaker unit with respect to the housings about a direction intersecting with an axis of the housings serving as a rotational axis, and a second rotating device configured to rotate the speaker unit with respect to the housings about the axis of the housings serving as a rotational axis.

Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.

Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.

Abstract: The purpose of the present invention is to provide a wiring substrate from which a metal film cannot be detached easily. A process for forming a metal film comprises a step (X) of applying an agent containing a compound (?) onto the surface of a base and a step (Y) of forming a metal film on the surface of the compound (?) by a wet-mode plating technique, wherein the compound (?) is a compound having either an OH group or an OH-generating group, an azide group and a triazine ring per molecule, and the base comprises a polymer.

Abstract: To provide a technique by which an —OH group can be effectively formed on a material surface for the purpose of making the material suitable for bonding (for example, for molecular bonding) that utilizes a chemical reaction (chemical binding). [Solution] A bonding method for bonding a substrate A and a substrate B, which comprises: a step for applying an agent that contains the compound (?) described below on the surface of the substrate A; a step for arranging the substrate B so as to face the compound (?) that is present on the surface of the substrate A; and a step for integrally bonding the substrate A and the substrate B by applying a force onto the substrate A and/or the substrate B. The compound (?) is a compound that has an OH group or an OH-forming group, an azide group and a triazine ring in each molecule, and the substrate A is configured using a polymer.

Abstract: A high-strength composition iron powder is prepared by mixing an iron base powder with 0.5 to 3.0 mass % of an Fe—Mn powder having a particle diameter of 45 ?m or less and a Mn content in the range of 60 to 90 mass %, 1.0 to 3.0 mass % of a Cu powder, 0.3 to 1.0 mass % of a graphite powder, and 0.4 to 1.2 mass % of a powder lubricant for die-forming while adjusting the ratio of the amount of Mn contained in the Fe—Mn powder to the amount of the Cu powder in the range of 0.1 to 1. The high-strength composition iron powder is press-formed and sintered at a temperature equal to or higher than the melting point of Cu to produce a high-strength sintered part having a tensile strength of 580 MPa or higher without using expensive alloying elements such as Ni and Mo.

Abstract: A method for producing granular metallic iron by heating and reducing a raw material mixture which includes an iron oxide-containing material, a carbonaceous reductant and a Li2O supplying material in a thermal reduction furnace, wherein the iron oxide-containing material includes a hematite-containing material, and the raw material mixture includes at least Fe, Ca, Mg, Si and Li as constituent elements in such a manner that slag which forms as a by-product during heating and reduction contains CaO, MgO, SiO2 and Li2O, has a Li2O content of 0.05% by mass or more, and the slag has a basicity [(CaO+MgO)/SiO2] in a range of from 1.5 to 1.9. This method enables granular metallic iron to be produced at a high productivity even when a hematite-containing material is used as the iron oxide-containing material.

Abstract: A server apparatus 20 that is connected, through a communication network 11, to a mobile terminal 40 for reproducing a content and to a ticket gate machine 30. The ticket gate machine 30 detects that a user's entrance into a station area or boarding onto a vehicle, identifies at least a boarding zone, and notifies the identified boarding zone to the server apparatus 20. The server apparatus 20 includes a required duration calculating unit 22 which calculates, based on the boarding zone notified by the ticket gate machine 30, a duration for a user traveling by the vehicle, a content selecting unit 23 which determines a content whose reproduction is completed within the calculated duration, and a data transmitting/receiving unit 21 which delivers the determined content to the mobile terminal 40.

Abstract: An information providing system that provides information to a traveling user, includes a visit history record unit which detects that the user visits a place which is away from a user's living area in order to generate a travel history, and records, as a visit history, the travel history together with a visit area which represents the visited place. Moreover, the information providing system includes a visit history database, a facility information database which provides the user with the information regarding the visit area recorded in the visit history database, and a facility information search unit.

Abstract: A current position determination unit determines a current position of a user; a facility candidate search unit specifies, as a candidate for a visited place, a facility that is located within a predetermined area including the current position determined by the current position determination unit; an electronic money unit and a payment amount calculation unit detect a payment amount of the user; and a most-likely visited facility identification unit identifies a most-likely visited place by selecting from a plurality of facilities a facility corresponding to the payment amount detected by the electronic money unit and the payment amount calculation unit, when the plurality of facilities are specified by the facility candidate search unit.

Abstract: A biometric authentication device and a terminal exhibit high security corresponding to a utilizing mode. The biometric authentication device includes a biometric information storage module performing mutual authentication with an electronic device by use of a common key, acquiring biometric information from the electronic device when validity is mutually authenticated and storing the biometric information in a biometric information storage module, and a biometric information authenticating module effecting the authentication with the electronic device by use of the public key, and authenticating, when the validity is authenticated, the biometric information stored in the biometric information storage module and the present biometric information.