Abstract: The inverter includes: a main body case accommodating main circuit terminal block and a control terminal block, high-voltage wire and low-voltage wire being respectively connected to the main circuit terminal block and the control terminal block; a wire cover detachably attached to the main body case to cover the main circuit terminal block; and a front cover detachably attached to the wire cover to cover the control terminal block, the front cover being fixed to the main body case with a fastening member requiring a tool for removal. The front cover includes a stopper, and, in a state where the front cover is attached to the wire cover, the stopper is located on a path through which the wire cover moves when removing the wire cover from the main body case.

Abstract: A heat sink includes a first surface including an attachment area to which a semiconductor module is attached and is installed such that a first side of the first surface extends in a vertical direction. Thermal grease containing oil is applied to the attachment area. A first groove extending in a horizontal direction is formed below the attachment area in the first surface. An inner wall of the first groove includes a groove top surface and a groove bottom surface spaced below the groove top surface. The length of the first groove in the horizontal direction is shorter than the length of the first surface in the horizontal direction. A wall includes a first wall extending in the horizontal direction and second walls respectively connected to both end portions of the first wall in the horizontal direction and inclined upward as the second walls extend away from the first wall.

Abstract: The inverter includes: a main body case accommodating main circuit terminal block and a control terminal block, high-voltage wire and low-voltage wire being respectively connected to the main circuit terminal block and the control terminal block; a wire cover detachably attached to the main body case to cover the main circuit terminal block; and a front cover detachably attached to the wire cover to cover the control terminal block, the front cover being fixed to the main body case with a fastening member requiring a tool for removal. The front cover includes a stopper, and, in a state where the front cover is attached to the wire cover, the stopper is located on a path through which the wire cover moves when removing the wire cover from the main body case.

Abstract: A heat sink includes a first surface including an attachment area to which a semiconductor module is attached and is installed such that a first side of the first surface extends in a vertical direction. Thermal grease containing oil is applied to the attachment area. A first groove extending in a horizontal direction is formed below the attachment area in the first surface. An inner wall of the first groove includes a groove top surface and a groove bottom surface spaced below the groove top surface. The length of the first groove in the horizontal direction is shorter than the length of the first surface in the horizontal direction. A wall includes a first wall extending in the horizontal direction and second walls respectively connected to both end portions of the first wall in the horizontal direction and inclined upward as the second walls extend away from the first wall.