Abstract: A tire assembly includes a tire for mounting on a vehicle, an elastic body disposed on an inner side of the tire, and a power generation body disposed between an inner surface of the tire and the elastic body. The power generation body includes a first member and a second member. The first member has a first insulating film forming a first surface. The second member has a second insulating film forming a second surface that faces the first surface and contacts the first surface. The elastic body biases the power generation body toward the inner surface of the tire.

Abstract: A temporary protective film comprising a support film and an adhesive layer provided on one surface or both surfaces of the support film is disclosed. The coefficient of linear expansion at 30° C. to 200° C. of the temporary protective film may be greater than or equal to 16 ppm/° C. and less than or equal to 20 ppm/° C. in at least one in-plane direction of the temporary protective film.

Abstract: Disclosed is a film-shaped adhesive. An embodiment of the film-shaped adhesive contains metal particles and has a shear viscosity at 110° C. of 30000 Pa·s or less. Another embodiment of the film-shaped adhesive contains metal particles and has a loss modulus at 110° C. of 200 kPa or less. Another embodiment of the film-shaped adhesive contains metal particles, a thermosetting resin, a curing agent, and an elastomer, in which a content of the metal particles based on the total amount of the metal particles, thermosetting resin, curing agent, and elastomer is 70.0% by mass or more, and a total content of the thermosetting resin and the curing agent is 13.0% by mass or more.

Abstract: A temporary protective film for semiconductor sealing molding includes a support film and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent. The content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

Abstract: A temporary protective film for semiconductor encapsulation molding includes a support film and an adhesive layer. The adhesive layer contains a thermoplastic resin and at least one compound selected from the group consisting of sorbitol polyglycidyl ether, polyethylene glycol diglycidyl ether, a glycidyl ether of an aliphatic alcohol having 10 to 20 carbon atoms, glycerol polyglycidyl ether, a polyalkylene glycol ester of a fatty acid having 2 to 30 carbon atoms, a dipentaerythritol ester of a fatty acid having 2 to 20 carbon atoms, polyethylene glycol monoalkyl ether, and polyethylene glycol dialkyl ether.

Abstract: A temporary protective film for semiconductor encapsulation molding includes a support film and an adhesive layer. The adhesive layer contains a thermoplastic resin and a low-molecular-weight additive having a molecular weight of less than 1000. The adhesive layer is configured to contain the low-molecular-weight additive so that X2 is smaller than X1 when X1 is a proportion of an oxygen atom in a surface of a copper plate as determined after the temporary protective film is bonded to the surface of the copper plate in a direction in which the adhesive layer comes into contact with the copper plate to form a bonded body having the copper plate and the temporary protective film, and then the bonded body is initially heated at 180° C. for 1 hour, while X2 is a proportion of the oxygen atom in the surface of the copper plate as determined after the bonded body is subjected to a thermal treatment at 400° C. for 2 minutes subsequent to the initial heating.

Abstract: A temporary protective film including a support film and an adhesive layer provided on one surface or both surfaces of the support film. The support film is a polyimide film. The thickness of the adhesive layer is less than 8 ?m.

Abstract: Disclosed is a temporary protective film for semiconductor sealing molding comprising: a support film; and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent, and the content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

Abstract: A temporary protective film for semiconductor sealing molding includes a support film and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent. The content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

Abstract: A temporary protective film for temporarily protecting a surface of a semiconductor substrate that is opposite to a surface on which a semiconductor element is mounted. The temporary protective film includes an adhesive layer containing acrylic rubber. When the temporary protective film is attached to a copper alloy plate at 25° C. so that the adhesive layer is in contact with the copper alloy plate, and the obtained laminate is sequentially heated at 180° C. for 60 minutes and at 200° C. for 60 minutes, a 90-degree peeling strength of the temporary protective film against the copper alloy plate is 5 N/m or more at 25° C. before heating the laminate and 150 N/m or less at 50° C. after heating the laminate.

Abstract: An image forming apparatus includes: a job acquirer that acquires a print job; a photoconductor including a surface on which a toner image is to be formed; an electrifying member that electrifies the photoconductor; an exposure member that exposes the photoconductor; a developing member that supplies toner to the photoconductor; a cleaner that cleans the photoconductor; and a controller connected to the job acquirer to control the image forming apparatus, wherein the controller computes a first non-toner region that is provided on the surface of the photoconductor when the toner image is formed on the photoconductor, the first non-toner region not containing toner in a longitudinal direction of the surface of the photoconductor, and the controller causes the exposure member and the developing member to form the toner image on the photoconductor and to form a set of toner patches in the first non-toner region.

Abstract: A temporary protective film comprising a support film and an adhesive layer provided on one surface or both surfaces of the support film is disclosed. The coefficient of linear expansion at 30° C. to 200° C. of the temporary protective film may be greater than or equal to 16 ppm/° C. and less than or equal to 20 ppm/° C. in at least one in-plane direction of the temporary protective film.

Abstract: Disclosed is a temporary protective film for semiconductor sealing molding comprising: a support film; and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent, and the content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

Abstract: An image forming apparatus includes: a job acquirer that acquires a print job; a photoconductor including a surface on which a toner image is to be formed; an electrifying member that electrifies the photoconductor; an exposure member that exposes the photoconductor; a developing member that supplies toner to the photoconductor; a cleaner that cleans the photoconductor; and a controller connected to the job acquirer to control the image forming apparatus, wherein the controller computes a first non-toner region that is provided on the surface of the photoconductor when the toner image is formed on the photoconductor, the first non-toner region not containing toner in a longitudinal direction of the surface of the photoconductor, and the controller causes the exposure member and the developing member to form the toner image on the photoconductor and to form a set of toner patches in the first non-toner region.

Abstract: A nozzle structure for discharging molten steel with improved sealing performance. The nozzle structure comprises: a molten steel discharge path having an inner bore; and one or more joints through which the molten steel discharge path is divided at one or more positions in a orthogonal direction with respect to an upward-downward direction of discharge of molten steel, and which join the molten steel discharge path. An inner bore sleeve is formed of a refractory material, and provided on an inner bore surface of the nozzle structure to extend in the upward-downward direction across at least one of the joints.

Abstract: In the method for replacing an immersion nozzle while pushing out a used immersion nozzle by a new immersion nozzle, in order to minimize leakage of molten steel during the replacement, to enable the use of a shaped joint sealer in a joint interface, and to ensure high sealability, a concave portion is formed on the new immersion nozzle's upper plane so as to include a nozzle hole, and the shaped joint sealer is mounted in this concave portion. The immersion nozzle's upper plane is caused to slide while being pressed to the upper nozzle's lower plane.

Abstract: A panel opening/closing device includes: a support which supports a panel and is turnable about a first rotary shaft; a dial which is turnable about a second rotary shaft in accordance with an operation by a user; and a movable unit which undergoes horizontal movement and includes pins inserted into a groove of the dial and a groove of the support, respectively.

Abstract: In the method for replacing an immersion nozzle while pushing out a used immersion nozzle by a new immersion nozzle, in order to minimize leakage of molten steel during the replacement, to enable the use of a shaped joint sealer in a joint interface, and to ensure high sealability, a concave portion is formed on the new immersion nozzle's upper plane so as to include a nozzle hole, and the shaped joint sealer is mounted in this concave portion. The immersion nozzle's upper plane is caused to slide while being pressed to the upper nozzle's lower plane.

Abstract: An immersion nozzle for use with an immersion nozzle replacement apparatus, capable of preventing crack formation due to the presence of a neck region. The immersion nozzle includes a nozzle body, a flange, and a metal casing. The nozzle body is formed such that a region of an outer peripheral surface thereof located above a point of power of an upward supporting force from a supporting device extends vertically up to an upper edge of the nozzle body without any dimensional change with respect to an central axis of an inner bore of the nozzle body. The outer peripheral surface region is not joined to the metal casing.

Abstract: A nozzle structure for discharging molten steel with improved sealing performance. The nozzle structure comprises: a molten steel discharge path having an inner bore; and one or more joints through which the molten steel discharge path is divided at one or more positions in a orthogonal direction with respect to an upward-downward direction of discharge of molten steel, and which join the molten steel discharge path. An inner bore sleeve is formed of a refractory material, and provided on an inner bore surface of the nozzle structure to extend in the upward-downward direction across at least one of the joints.