Abstract: A fuel cell power generation module includes a first fuel cell module, and a second fuel cell module capable of generating power with a first exhaust fuel gas exhausted from the first fuel cell module. It is configured such that a first recirculation line recirculates from a second exhaust fuel gas line through which a second exhaust fuel gas exhausted from the second fuel cell module flows, and the second exhaust fuel gas is supplied to a fuel-side electrode of the second fuel cell module.

Abstract: A fuel cell power generation system includes: a fuel cell; a peripheral device used to operate the fuel cell; a resource storage part; and a resource supply part. The resource storage part is capable of storing a resource generated in the fuel cell in an operation/stop process of the fuel cell. The resource supply part is capable of supplying the resource stored in the resource storage part to at least either of the fuel cell or the peripheral device.

Abstract: A fuel cell power generation system includes: a first fuel cell; and a second fuel cell connected to a downstream side of the first fuel cell via an exhaust fuel gas line, the second fuel cell being capable of generating electric power using an exhaust fuel gas from the first fuel cell. A water recovery unit is disposed on the exhaust fuel gas line, the water recovery unit being capable of recovering water contained in the exhaust fuel gas. A bypass line brings an upstream side and a downstream side of the exhaust fuel gas line with respect to the water recovery unit into communication. At least one flow control valve is disposed on at least one of the exhaust fuel gas line or the bypass line. A control unit controls an opening degree of the at least one flow control valve.

Abstract: A manufacturing tool for a solid electrolyte sheet is a manufacturing tool for a solid electrolyte sheet configured such that a porous base is filled with a solid electrolyte material. The manufacturing tool includes a first frame member and a second frame member each having opposing sandwiching portions and sandwiching the base by the sandwiching portions. The sandwiching portions provide a fixing structure configured of provide tension to the sandwiched base.

Abstract: A method of manufacturing a semiconductor device answerable to refinement of circuits by correctly connecting adjacent small patterns with each other with excellent reproducibility in connective exposure and a semiconductor device manufactured by this method are proposed. According to this method of manufacturing a semiconductor device, connective exposure is performed by dividing a pattern formed on a semiconductor substrate into a plurality of patterns and exposing the plurality of divided patterns in a connective manner, by forming marks for adjusting arrangement of the patterns to be connected with each other on the semiconductor substrate before exposing patterns of a semiconductor element and connectively exposing the patterns of the semiconductor element in coincidence with the marks for adjusting arrangement.

Abstract: A method of manufacturing a semiconductor device answerable to refinement of circuits by correctly connecting adjacent small patterns with each other with excellent reproducibility in connective exposure and a semiconductor device manufactured by this method are proposed. According to this method of manufacturing a semiconductor device, connective exposure is performed by dividing a pattern formed on a semiconductor substrate into a plurality of patterns and exposing the plurality of divided patterns in a connective manner, by forming marks for adjusting arrangement of the patterns to be connected with each other on the semiconductor substrate before exposing patterns of a semiconductor element and connectively exposing the patterns of the semiconductor element in coincidence with the marks for adjusting arrangement.

Abstract: A method of manufacturing a semiconductor device answerable to refinement of circuits by correctly connecting adjacent small patterns with each other with excellent reproducibility in connective exposure and a semiconductor device manufactured by this method are proposed. According to this method of manufacturing a semiconductor device, connective exposure is performed by dividing a pattern formed on a semiconductor substrate into a plurality of patterns and exposing the plurality of divided patterns in a connective manner, by forming marks for adjusting arrangement of the patterns to be connected with each other on the semiconductor substrate before exposing patterns of a semiconductor element and connectively exposing the patterns of the semiconductor element in coincidence with the marks for adjusting arrangement.

Abstract: A fly-back transformer for generating a focus voltage to be applied to a cathode-ray tube, includes an iron core, a primary coil, a D.C. voltage generating circuit, and a superimposing circuit. The primary coil is wound on the iron core for receiving a pulse voltage generated during a fly-back period of a horizontal sweep signal for the cathode-ray tube. The D.C. voltage generating circuit includes at least one secondary coil wound on the iron core, for generating, in response to the pulse voltage, a D.C. voltage. The superimposing circuit generates a parabolic-wave voltage from a voltage taken out from one of the at least one secondary coil, and superimposes the parabolic-wave voltage on the D.C. voltage to generate the focus voltage. Alternatively, the superimposing circuit generates a parabolic-wave voltage from a voltage taken out by a third coil wound on the iron core, which has one end connected to an end of the at least one secondary coil.