Patents by Inventor Takahiro MASUNAGA
Takahiro MASUNAGA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10840213Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.Type: GrantFiled: July 7, 2017Date of Patent: November 17, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Masataka Matsunaga, Takahiro Masunaga, Yasutaka Soma, Takashi Koga, Shogo Hara, Masaaki Umitsuki, Kazutoshi Ishimaru, Fumio Sakata
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Patent number: 10424502Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.Type: GrantFiled: July 7, 2017Date of Patent: September 24, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Masataka Matsunaga, Takahiro Masunaga, Takashi Koga, Yasuharu Iwashita, Shingo Katsuki, Masaaki Umitsuki, Kazutoshi Ishimaru, Fumio Sakata
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Patent number: 10340248Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.Type: GrantFiled: July 7, 2017Date of Patent: July 2, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Masataka Matsunaga, Takashi Koga, Takeshi Tamura, Takahiro Masunaga, Yuji Mimura, Masaru Honda, Toshifumi Inamasu, Satoshi Nishimura
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Publication number: 20180019153Abstract: A substrate transfer device for transferring a first substrate and a second substrate to a bonding apparatus configured to bond the first substrate and the second substrate, includes a first holding part configured to hold the first substrate from an upper surface side, a lower surface of the first substrate serving as a bonding surface, and a second holding part provided below the first holding part and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate, a upper surface of the second substrate serving as a bonding surface to be bonded to the lower surface of the first substrate.Type: ApplicationFiled: July 7, 2017Publication date: January 18, 2018Inventors: Masataka MATSUNAGA, Takahiro MASUNAGA, Takashi KOGA, Yasuharu IWASHITA, Shingo KATSUKI, Masaaki UMITSUKI, Kazutoshi ISHIMARU, Fumio SAKATA
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Publication number: 20180019225Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate in a normal pressure atmosphere, a surface modifying apparatus configured to modify surfaces of the first substrate and the second substrate to be bonded with each other in a depressurized atmosphere, a load lock chamber in which the first substrate and the second substrate are delivered between the substrate transfer device and the surface modifying apparatus and in which an internal atmosphere of the load lock chamber is switchable between an atmospheric pressure atmosphere and the depressurized atmosphere, a surface hydrophilizing apparatus configured to hydrophilize the modified surfaces of the first substrate and the second substrate, and a bonding apparatus configured to bond the hydrophilized surfaces of the first substrate and the second substrate by an intermolecular force.Type: ApplicationFiled: July 7, 2017Publication date: January 18, 2018Inventors: Masataka MATSUNAGA, Takashi KOGA, Takeshi TAMURA, Takahiro MASUNAGA, Yuji MIMURA, Masaru HONDA, Toshifumi INAMASU, Satoshi NISHIMURA
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Publication number: 20180019226Abstract: A bonding system includes a substrate transfer device configured to transfer a first substrate and a second substrate to a bonding apparatus, a first holding plate configured to hold the first substrate from an upper surface side, and a second holding plate disposed below the first holding plate and configured to hold the second substrate from a lower surface side so that the second substrate faces the first substrate. The substrate transfer device includes a first holding part capable of holding the first substrate from the upper surface side, and a second holding part disposed below the first holding part and capable of holding the second substrate from the lower surface side. The first holding part and the second holding part are configured to receive and hold the first substrate and the second substrate at the same time from the first holding plate and the second holding plate.Type: ApplicationFiled: July 7, 2017Publication date: January 18, 2018Inventors: Masataka MATSUNAGA, Takahiro MASUNAGA, Yasutaka SOMA, Takashi KOGA, Shogo HARA, Masaaki UMITSUKI, Kazutoshi ISHIMARU, Fumio SAKATA
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Patent number: 9741595Abstract: There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.Type: GrantFiled: November 24, 2015Date of Patent: August 22, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Kenji Sugakawa, Yuji Mimura, Shuhei Matsumoto, Takahiro Masunaga, Makoto Tsukishima
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Patent number: 9401291Abstract: A coating apparatus includes: a slit nozzle including a retention chamber that retains the coating material; a moving mechanism that moves the slit nozzle; a pressure regulation unit that regulates a pressure inside the retention chamber; and a control unit that controls the moving mechanism and the pressure regulation unit to relatively move the slit nozzle with respect to the substrate while changing the pressure inside the retention chamber toward an atmospheric pressure from a negative pressure, wherein the control unit is configured to control the pressure regulation unit so that a change in the pressure inside the retention chamber in a start zone including a coating start position and an end zone including a coating end position becomes slower than a change in the pressure inside the retention chamber in a middle zone except the start zone and the end zone.Type: GrantFiled: October 28, 2014Date of Patent: July 26, 2016Assignee: Tokyo Electron LimitedInventors: Yuji Mimura, Tetsuya Maki, Shigeto Tsuruta, Tatsumi Oonishi, Daisuke Ikemoto, Takahiro Masunaga
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Publication number: 20160155721Abstract: There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.Type: ApplicationFiled: November 24, 2015Publication date: June 2, 2016Inventors: Kenji SUGAKAWA, Yuji MIMURA, Shuhei MATSUMOTO, Takahiro MASUNAGA, Makoto TSUKISHIMA
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Publication number: 20150128858Abstract: A coating apparatus includes: a slit nozzle including a retention chamber that retains the coating material; a moving mechanism that moves the slit nozzle; a pressure regulation unit that regulates a pressure inside the retention chamber; and a control unit that controls the moving mechanism and the pressure regulation unit to relatively move the slit nozzle with respect to the substrate while changing the pressure inside the retention chamber toward an atmospheric pressure from a negative pressure, wherein the control unit is configured to control the pressure regulation unit so that a change in the pressure inside the retention chamber in a start zone including a coating start position and an end zone including a coating end position becomes slower than a change in the pressure inside the retention chamber in a middle zone except the start zone and the end zone.Type: ApplicationFiled: October 28, 2014Publication date: May 14, 2015Inventors: Yuji MIMURA, Tetsuya MAKI, Shigeto TSURUTA, Tatsumi OONISHI, Daisuke IKEMOTO, Takahiro MASUNAGA