Patents by Inventor Takahiro Mukai

Takahiro Mukai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11870925
    Abstract: An accommodation device with an air blowing function includes: an accommodation portion that is formed with an opening portion on an upper surface and accommodates a portable electronic device; a support portion, arranged so as to protrude from a side surface of the accommodation portion into the accommodation portion, the support portion configured to contact with side surfaces or upper and lower surfaces of the portable electronic device accommodated in the accommodation portion and hold the portable electronic device so as to pinch the portable electronic device; and a blower unit that blows air into the accommodation portion. The support portion has an air outlet for guiding the air sent out by the blower unit to the accommodation portion.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: January 9, 2024
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Makoto Sato, Takahiro Mukai, Hiroshi Sobue
  • Patent number: 11605978
    Abstract: A wireless charging unit to be attached to a back surface of a side wall of a case in which an electronic device including internally a wireless power receiving coil is placed upright. The wireless charging unit includes a power supplying coil provided at a position facing the back surface of the side wall of the case to wirelessly supply power, circuit board connected to the power supplying coil to feed a current to the power supplying coil, and a housing that houses the circuit board. The center of the power supplying coil is located above the center of the housing in an in-plane direction of the power supplying coil.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: March 14, 2023
    Assignee: TOYODA GOSEI CO., LTD.
    Inventors: Takahiro Mukai, Yuhki Ichikawa, Minoru Shibata
  • Publication number: 20220256023
    Abstract: An accommodation device with an air blowing function includes: an accommodation portion that is formed with an opening portion on an upper surface and accommodates a portable electronic device; a support portion, arranged so as to protrude from a side surface of the accommodation portion into the accommodation portion, the support portion configured to contact with side surfaces or upper and lower surfaces of the portable electronic device accommodated in the accommodation portion and hold the portable electronic device so as to pinch the portable electronic device; and a blower unit that blows air into the accommodation portion. The support portion has an air outlet for guiding the air sent out by the blower unit to the accommodation portion.
    Type: Application
    Filed: January 31, 2022
    Publication date: August 11, 2022
    Inventors: Makoto SATO, Takahiro MUKAI, Hiroshi SOBUE
  • Publication number: 20220124909
    Abstract: An electronic device is an electronic device on which an option replaceable by a user is mounted. The electronic device includes a main board and a flexible printed circuit board connected to the main board. The flexible printed circuit board has a coupling connector connected to an option board on which the option is mounted.
    Type: Application
    Filed: December 27, 2021
    Publication date: April 21, 2022
    Inventors: Masato TOBINAGA, Takahiro MUKAI, Shigehito MORITA, Masaru FURUJIKU, Ryusuke TERAMOTO
  • Publication number: 20210175746
    Abstract: A wireless charging unit to be attached to a back surface of a side wall of a case in which an electronic device including internally a wireless power receiving coil is placed upright. The wireless charging unit includes a power supplying coil provided at a position facing the back surface of the side wall of the case to wirelessly supply power, circuit board connected to the power supplying coil to feed a current to the power supplying coil, and a housing that houses the circuit board. The center of the power supplying coil is located above the center of the housing in an in-plane direction of the power supplying coil.
    Type: Application
    Filed: November 13, 2020
    Publication date: June 10, 2021
    Inventors: Takahiro MUKAI, Yuhki ICHIKAWA, Minoru SHIBATA
  • Patent number: 9028797
    Abstract: The invention provides an antigen or drug delivery complex containing a complex of an antigen or drug and a cationic molecule, and an anionic molecule encapsulating the same. The antigen or drug delivery complex can be used as a main component of a drug delivery system that delivers various antigens and drugs to a particular cell or organ.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: May 12, 2015
    Assignees: Nagasaki University, Kyusyu University Corporation, National University Corporation Hamamatsu University School of Medicine
    Inventors: Hitoshi Sasaki, Tomoaki Kurosaki, Takashi Kitahara, Hideto To, Katsuyuki Yui, Kenji Hirayama, Kouichi Morita, Takahiro Mukai, Yasuhiro Magata, Mikako Ogawa, Kohei Sano
  • Publication number: 20140216586
    Abstract: A processing space is provided in a reaction container. One gas inlet port is provided at the lower end of the reaction container. A distribution plate is attached to the one gas inlet port. Another gas inlet port is provided at a lower side surface of the reaction container. Powder that is an object to be processed is stored on the distribution plate in the reaction container. The distribution plate is configured to let a gas pass and not let the powder pass. A nitrogen gas is introduced into the processing space through the distribution plate from the one gas inlet port, and a processing gas is introduced into the processing space from the other gas inlet port without passing through the distribution plate.
    Type: Application
    Filed: September 11, 2012
    Publication date: August 7, 2014
    Applicant: TOYO TANSO CO., LTD.
    Inventors: Noriyuki Tanaka, Jiro Hiraiwa, Takahiro Mukai
  • Publication number: 20130052127
    Abstract: The invention provides an antigen or drug delivery complex containing a complex of an antigen or drug and a cationic molecule, and an anionic molecule encapsulating the same. The antigen or drug delivery complex can be used as a main component of a drug delivery system that delivers various antigens and drugs to a particular cell or organ.
    Type: Application
    Filed: February 24, 2011
    Publication date: February 28, 2013
    Applicants: NAGASAKI UNIVERSITY, National University Corporation Hamamatsu University School of Medicine, KYUSYU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION
    Inventors: Hitoshi Sasaki, Tomoaki Kurosaki, Takashi Kitahara, Hideto To, Katsuyuki Yui, Kenji Hirayama, Kouichi Morita, Takahiro Mukai, Yasuhiro Magata, Mikako Ogawa, Kohei Sano
  • Publication number: 20110068889
    Abstract: A thermal fuse includes a first insulating film to which a pair of metal terminals are attached, a fusible alloy located above the first insulating film and connected between the leading end portions of the pair of metal terminals, and a second insulating film located above the fusible alloy and attached to the first insulating film so as to define a space with the first insulating film. The fusible alloy includes an Sn—Bi—In—Zn alloy containing 0.5 to 15 weight % of Bi, 45 to 55 weight % of In and 0.5 to 5 weight % of Zn with the balance being Sn.
    Type: Application
    Filed: November 24, 2010
    Publication date: March 24, 2011
    Inventors: KENJI SENDA, Takahiro Mukai, Masatoshi Izaki
  • Publication number: 20070024407
    Abstract: A thermal fuse comprises: a first insulating film to which a pair of metal terminals are attached; a fusible alloy located above the first insulating film and connected between the leading end portions of the pair of metal terminals; and a second insulating film located above the fusible alloy and attached to the first insulating film so as to define a space with the first insulating film. The fusible alloy includes an Sn—Bi—In—Zn alloy containing 0.5 to 15 weight % of Bi, 45 to 55 weight % of In and 0.5 to 5 weight % of Zn with the balance being Sn.
    Type: Application
    Filed: May 27, 2004
    Publication date: February 1, 2007
    Inventors: Kenji Senda, Takahiro Mukai, Masatoshi Izaki
  • Patent number: 7106165
    Abstract: A fuse has a pair of lead terminals disposed on a substrate, an intermediate layers for welding formed on the surface of at least one of the lead terminals, and a fuse element. The fuse element is welded to the pair of lead terminals through the intermediate layer so as to span the same. Further, the intermediate layer is formed on at least one of the lead terminals except a face thereof opposing each other. Owing to this configuration, after the fuse has melted down, the melted fuse element is prevented from being spread out into the space between the opposing faces of the lead terminals and insulation therebetween is secured.
    Type: Grant
    Filed: June 29, 2004
    Date of Patent: September 12, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takahiro Mukai, Masatoshi Izaki, Yoshio Sakamoto, Kenji Senda
  • Publication number: 20050083166
    Abstract: A thermal fuse includes a first insulation film having a pair of metal terminals mounted thereto, a fusible alloy located over the first insulation film and connected between respective ends of the metal terminals, a second insulation film provided over the fusible alloy and bonded to the first insulation film as to provide a space between the first and second insulation films. The fusible alloy includes an Sn—Bi—In alloy containing 20 to 39.5 wt. % of tin, 11.5 to 31 wt. % of bismuth, and 49 to 68.5 wt. % of indium. The fusible alloy does not release lead or cadmium even after being disposed of since it contains no lead and no cadmium.
    Type: Application
    Filed: October 6, 2003
    Publication date: April 21, 2005
    Inventors: Kenji Senda, Takahiro Mukai, Masatoshi Izaki
  • Publication number: 20050007234
    Abstract: The thermal fuse of the present invention contains a fuse element 1 that is formed of a fusible alloy having a composition of 43.5-50 wt % Sn, 0.1-5 wt % In, and balance being Bi and inevitable impurities, or a fusible alloy having a composition of 5-33 wt % In, 4.7-15.5 wt % Zn, and balance being Sn and inevitable impurities; a pair of electric terminals 2, 3 connected to the fuse element; and case 8 for accommodating at least the fuse element 1. The opening end of case 8 has a predetermined shape. By employing the structure above, a thermal fuse having an operating temperature as high as 130-190° C. can be easily obtained.
    Type: Application
    Filed: June 22, 2004
    Publication date: January 13, 2005
    Inventors: Tatsuya Wada, Shinichi Otsuka, Takahiro Mukai, Masatoshi Izaki
  • Publication number: 20050001710
    Abstract: A fuse has a pair of lead terminals disposed on a substrate, an intermediate layers for welding formed on the surface of at least one of the lead terminals, and a fuse element. The fuse element is welded to the pair of lead terminals through the intermediate layer so as to span the same. Further, the intermediate layer is formed on at least one of the lead terminals except a face thereof opposing each other. Owing to this configuration, after the fuse has melted down, the melted fuse element is prevented from being spread out into the space between the opposing faces of the lead terminals and insulation therebetween is secured.
    Type: Application
    Filed: June 29, 2004
    Publication date: January 6, 2005
    Inventors: Takahiro Mukai, Masatoshi Izaki, Yoshio Sakamoto, Kenji Senda
  • Patent number: 6838971
    Abstract: Quantity of flux coated on fusible alloy of a thermal fuse disclosed can be inspected accurately by an image processing method. The thermal fuse comprises: (a) first insulation film 11 coupled with a pair of metal terminals 12; (b) fusible alloy 13 coupled between ends of the metal terminals 12, being placed above first insulation film 11; (c) flux 14 coated on fusible alloy 13; and (d) second insulation film 15 disposed on first insulation film 11 so that an internal space is formed, being placed above fusible alloy 13, wherein at least either of first insulation film 11 or second insulation film 15 is transparent or translucent, and flux 14 has the Gardner color scale from 4 to 16.
    Type: Grant
    Filed: May 21, 2002
    Date of Patent: January 4, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Senda, Takahiro Mukai
  • Publication number: 20030156007
    Abstract: Quantity of flux coated on fusible alloy of a thermal fuse disclosed can be inspected accurately by an image processing method.
    Type: Application
    Filed: March 5, 2003
    Publication date: August 21, 2003
    Inventors: Kenji Senda, Takahiro Mukai
  • Patent number: 6556122
    Abstract: A thermal fuse reduced in size and thickness can be obtained. Further, the thermal fuse will not be degraded in characteristics, productivity, reliability, quality, etc. even after reduction in size and thickness. The thermal fuse includes a fuse main body including a substrate, a fusible metal and a cover, and paired terminals disposed protruding from the fuse main body. The other end of the first terminal has a first fusible metal connection, and the other end of the second terminal has a second fusible metal connection. The fusible metal is disposed between the first terminal and the second terminal, and one end of the fusible metal is connected to the first fusible metal connection, and the other end of the fusible metal is connected to the second fusible metal connection. The cover is disposed so as to cover the fusible metal, the first fusible metal connection, and the second fusible metal connection.
    Type: Grant
    Filed: July 20, 2001
    Date of Patent: April 29, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masatoshi Izaki, Takahiro Mukai, Shinichi Ohtsuka, Kenzo Isozaki
  • Publication number: 20020113685
    Abstract: A thermal fuse reduced in size and thickness can be obtained. Further, the thermal fuse will not be degraded in characteristics, productivity, reliability, quality, etc. even after reduction in size and thickness. The thermal fuse includes a fuse main body including a substrate, a fusible metal and a cover, and paired terminals disposed protruding from the fuse main body. The other end of the first terminal has a first fusible metal connection, and the other end of the second terminal has a second fusible metal connection. The fusible metal is disposed between the first terminal and the second terminal, and one end of the fusible metal is connected to the first fusible metal connection, and the other end of the fusible metal is connected to the second fusible metal connection. The cover is disposed so as to cover the fusible metal, the first fusible metal connection, and the second fusible metal connection.
    Type: Application
    Filed: July 20, 2001
    Publication date: August 22, 2002
    Inventors: Masatoshi Izaki, Takahiro Mukai, Shinichi Ohtsuka, Kenzo Isozaki
  • Patent number: D482004
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: November 11, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masatoshi Izaki, Takahiro Mukai, Shinichi Ohtsuka, Kenzo Isozaki
  • Patent number: D492261
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: June 29, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masatoshi Izaki, Takahiro Mukai, Shinichi Ohtsuka, Kenzo Isozaki