Abstract: A liquid discharging nozzle of the present invention includes (i) a liquid reservoir for reserving a discharging liquid and (ii) a discharging tube connected to a bottom part of the liquid reservoir. A water-repellent layer is provided on an inner surface of the discharging tube, on an inner surface of the discharging tube, and on an inner surface of the liquid reservoir, and is a fluorinated water-repellent layer. An aluminum oxide layer and a silicon oxide layer are used as foundation layers of the fluorinated water-repellent layer. The aluminum oxide layer, the silicon oxide layer, and the fluorinated water-repellent layer, which are stacked together, have a combined thickness of not more than 25 nm. The fluorinated water-repellent layer alone has a thickness of 1 nm to 4 nm.

Abstract: In order to realize a device and a method each capable of forming a lens with high accuracy and low costs, a lens forming device of the present invention includes a metal mold, an insulating substrate, a stage, a power source, a switch, and a UV radiating device. Dielectric resin is supplied onto the insulating substrate and a transfer surface of the metal mold is pressed to the dielectric resin so as to transfer a lens shape to the dielectric resin. At that time, the power source applies a voltage on the metal mold to generate an electric field between the metal mold and the insulating substrate so that an electrostatic attraction causes the dielectric resin to be attracted toward the transfer surface of the metal mold while the top of the dielectric resin has a sharp cuspate shape. Consequently, bubbles are less likely to be invade between the transfer surface and the dielectric resin, allowing transferring a highly accurate lens shape to the dielectric resin.

Abstract: An optical element according to the present invention includes: an optical surface at a center portion thereof; a spacer section having a predetermined thickness on an outer circumference side of the optical surface; a support plate including one or a plurality of through holes penetrating the optical surface, inside a transparent resin material; and a penetrating portion and/or a concave portion for releasing the resin material when forming resin, in a further outer peripheral portion of the support plate.

Abstract: In a camera module (1) of the present invention, a lens member (20) is attached to a semiconductor package (10). The semiconductor package (10) includes: an image sensor (11) mounted on a wiring board (13); and a wire 15 through which the wiring board (13) is electrically connected to the image sensor (11). The image sensor (11) and the wire 15 are sealed with mold resin (14). A step (18) is formed around the perimeter of the surface of the mold resin (14), and the semiconductor package (10) and the lens member (20) are joined by fitting the step (18) and a projection (23) of a lens holder (22). With this arrangement, it is possible to realize a small semiconductor module that allows for highly precise alignment between the semiconductor package and a mounting component to which the semiconductor package is joined.