Abstract: A light emitting device includes a light emitting diode chip, and a first lead terminal in which a bottom portion including a mounting region for the light emitting diode chip is formed, and a side wall continuing to the bottom portion and having an inner surface serving as a reflecting surface for light emitted from the light emitting diode chip is continuously formed. Further, the light emitting device includes a second lead terminal provided to be spaced from the first lead terminal. Furthermore, the light emitting device includes a resin portion which supports the first lead terminal and the second lead terminal, and in which a cavity exposing a portion of the second lead terminal and the mounting region in the first lead terminal is formed.

Abstract: A semiconductor laser has a substrate, a laminate including at least an active layer, a ridge stripe portion on the laminate, a current blocking layer provided on lateral side surfaces of the ridge stripe portion and on an upper surface of the laminate on lateral sides of the ridge stripe portion, and a metal plating layer that covers an upper surface of the ridge stripe portion and the current blocking layer. The metal plating layer has a layer thickness that is larger on both lateral sides of the ridge stripe portion than above the ridge stripe portion by an amount approximately corresponding to a height of the ridge stripe portion so that the metal plating layer has a roughly flat upper surface.

Abstract: Rubber having a sheet shape is sandwiched between two metal plates. A mold and heat are utilized to integrally bond the rubber to the metal plates. Thus, a fixing bracket assembly is manufactured which is secured by a screw and a stepped screw to both sides of a magnetic disk unit. Thus, it is possible to construct a fixing bracket assembly which conserves space and has a high damping capacity for vibrations, and which reduces the strain on the magnetic disk unit when it is mounted.