Abstract: Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass or less of the rosin, 1% by mass or more and 10% by mass or less of the organic acid, 0.2% by mass or more and 10% by mass or less of the benzimidazole-based compound, and 20% by mass or more and 60% by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.

Abstract: Provided is flux that can achieve a low residue so as to make it possible to ensure solder wettability, ensure holding properties of a solder ball, and suppress the amount of residue after soldering and enable application for use without washing. The flux includes 1-15% by weight of an organic acid mixture comprising an organic acid with 10 or more carbon atoms, 50-90% by weight of isobornyl cyclohexanol, and 5-45% by weight of a different solvent. The proportion of the isobornyl cyclohexanol is 50-95% by weight, where 100% by weight is the total of the isobornyl cyclohexanol and the different solvent. The organic acid mixture comprising the organic acid with 10 or more carbon atoms comprises 2-methylnonanedioic acid, 4-(methoxycarbonyl)-2,4-dimethylundecanedioic acid, 4,6-bis(methoxycarbonyl)-2,4,6-trimethyldecanedioic acid, and 8,9-bis(methoxycarbonyl)-8,9-dimethylhexadecanedioic acid.

Abstract: Provided is a flux which is rosin-free and contains 50% by mass or more and 90% by mass or less of 2,4-diethyl-1,5-pentanediol, more than 0% by mass and less than 50% by mass of a solvent, 1% by mass or more and 15% by mass or less of an organic acid, wherein the total amount of the 2,4-diethyl-1,5-pentanediol and the solvent is 83% by mass or more and 99% by mass or less. This flux does not require washing with an organic detergent when transferred to solder balls is provided.

Abstract: Provided is flux that can be discharged using an inkjet method and that is capable of bonding to an adherend after application. This flux includes 5-50 mass % of a solid solvent having a melting point of 60° C. or less, 50-80 mass % of a solvent, 5-10 mass % of an organic acid, 10-30 mass % of an amine, and 0-5 mass % of a halide, the flux forming a liquid having a high viscosity of 5 Pa·s or higher at 25° C., and forming a liquid having a low viscosity of 50 mPa·s or less at 100° C.

Abstract: The present invention provides a method for manufacturing an electronic device including a base material that has an exposed metal portion on a surface of the base material and an electronic component that is provided on the base material. The method includes a flux treatment step of treating the exposed metal portion with a flux by bringing the exposed metal portion into contact with the flux and an introduction step of introducing a resin composition such that the resin composition comes into contact with a surface of the exposed metal portion treated with the flux. The flux contains a rosin, an activator, and a solvent. The content of the rosin is equal to or greater than 1 part by mass and equal to or smaller than 18 parts by mass with respect to 100 parts by mass of the flux. The percent change in mass of the flux before and after a heating treatment is equal to or lower than 21% by mass. The resin composition contains an epoxy resin and a phenolic resin curing agent.

Abstract: Provided is a flux capable of obtaining predetermined rheological characteristics both at room temperature and under a thermal history that is assumed for soldering and capable of suppressing the amount of a residue after soldering to realize a low residue. The flux contains a first alcohol compound that has two or more OH groups and has a melting point of lower than 25° C. and a second alcohol compound that has two or more OH groups and has a melting point of higher than 25° C., the first alcohol compound is glycerin, the second alcohol compound is 2,5-dimethylhexane-2,5-diol, the flux has a viscosity of 10 Pa·s or more and 50 Pa·s or less at 25° C. and has a viscosity of more than 0 Pa·s and 1 Pa·s or less at 100° C., and, in a case where 10 mg of the flux is heated up to 25° C. to 250° C. under a N2 atmosphere at a temperature rise rate of 10° C./min, the weight of the flux after heating is 15% or less of the weight of the flux before heating.

Abstract: The present invention provides a method for manufacturing an electronic device including a base material that has an exposed metal portion on a surface of the base material and an electronic component that is provided on the base material. The method includes a flux treatment step of treating the exposed metal portion with a flux by bringing the exposed metal portion into contact with the flux and an introduction step of introducing a resin composition such that the resin composition comes into contact with a surface of the exposed metal portion treated with the flux. The flux contains a rosin, an activator, and a solvent. The content of the rosin is equal to or greater than 1 part by mass and equal to or smaller than 18 parts by mass with respect to 100 parts by mass of the flux. The percent change in mass of the flux before and after a heating treatment is equal to or lower than 21% by mass. The resin composition contains an epoxy resin and a phenolic resin curing agent.

Abstract: Provided is a flux capable of obtaining predetermined rheological characteristics both at room temperature and under a thermal history that is assumed for soldering and capable of suppressing the amount of a residue after soldering to realize a low residue. The flux contains a first alcohol compound that has two or more OH groups and has a melting point of lower than 25° C. and a second alcohol compound that has two or more OH groups and has a melting point of higher than 25° C., the first alcohol compound is glycerin, the second alcohol compound is 2,5-dimethylhexane-2,5-diol, the flux has a viscosity of 10 Pa·s or more and 50 Pa·s or less at 25° C. and has a viscosity of more than 0 Pa·s and 1 Pa·s or less at 100° C., and, in a case where 10 mg of the flux is heated up to 25° C. to 250° C. under a N2 atmosphere at a temperature rise rate of 10° C./min, the weight of the flux after heating is 15% or less of the weight of the flux before heating.

Abstract: A flux is provided which maintains activity by suppressing formation of an ester due to a reaction between an organic acid and a hydroxy group of an alcohol contained in a solvent and improves solderability. The flux includes: 40 mass % to 90 mass % of water; 2 mass % to 15 mass % of an organic acid; and greater than 0 mass % and less than or equal to 48 mass % of a solvent having a hydroxy group, in which when a molar mass % of all organic acid carboxyl group unit contained in the organic acid is regarded as 100 unit mol %, the content ratio of all carboxylic acid ester unit esterified by the organic acid and the hydroxy group which is contained in the solvent is 0 unit mol % to 50 unit mol %.

Abstract: Provided are a flux having improved wetting and spreading properties and capable of suppressing the occurrence of dewetting and a solder paste using this flux. The flux includes a total amount of 0.

Abstract: An object of the present invention is to provide a flux which does not precipitate a crystal and can improve solder wettability. A flux comprising 0.4 to 10.0 mass % of ditolylguanidine and 1.0 to 10.0 mass % of an organic acid, and not comprising diphenylguanidine as an amine compound.

Abstract: Provided is flux that can achieve a low residue so as to make it possible to ensure solder wettability, ensure holding properties of a solder ball, and suppress the amount of residue after soldering and enable application for use without washing. The flux includes 1-15% by weight of an organic acid mixture comprising an organic acid with 10 or more carbon atoms, 50-90% by weight of isobornyl cyclohexanol, and 5-45% by weight of a different solvent. The proportion of the isobornyl cyclohexanol is 50-95% by weight, where 100% by weight is the total of the isobornyl cyclohexanol and the different solvent. The organic acid mixture comprising the organic acid with 10 or more carbon atoms comprises 2-methylnonanedioic acid, 4-(methoxycarbonyl)-2,4-dimethylundecanedioic acid, 4,6-bis(methoxycarbonyl)-2,4,6-trimethyldecanedioic acid, and 8,9-bis(methoxycarbonyl)-8,9-dimethylhexadecanedioic acid.

Abstract: Provided are a flux having improved wetting and spreading properties and capable of suppressing the occurrence of dewetting and a solder paste using this flux. The flux includes a total amount of 0.

Abstract: A solder ball according to the present invention contains 0.2 to 2.2% by mass of Zn, and a balance of Sn, and has a spherical diameter of 0.1 to 120 ?m and a yellowness (b*) in an L*a*b* color system of 2.70 or more and 9.52 or less. An oxide film is formed by performing aging treatment. By producing a solder ball having a yellowness of 2.70 or more and 9.52 or less, it is possible to suppress the growth of a Cu3Sn layer and/or a Cu—Zn(—Sn) layer during joining.

Abstract: Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass or less of the rosin, 1% by mass or more and 10% by mass or less of the organic acid, 0.2% by mass or more and 10% by mass or less of the benzimidazole-based compound, and 20% by mass or more and 60% by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.

Abstract: An object of the present invention is to provide a flux which does not precipitate a crystal and can improve solder wettability. A flux comprising 0.4 to 10.0 mass % of ditolylguanidine and 1.0 to 10.0 mass % of an organic acid, and not comprising diphenylguanidine as an amine compound.

Abstract: A solder ball according to the present invention contains 0.2 to 2.2% by mass of Zn, and a balance of Sn, and has a spherical diameter of 0.1 to 120 ?m and a yellowness (b*) in an L*a*b* color system of 2.70 or more and 9.52 or less. An oxide film is formed by performing aging treatment. By producing a solder ball having a yellowness of 2.70 or more and 9.52 or less, it is possible to suppress the growth of a Cu3Sn layer and/or a Cu—Zn(—Sn) layer during joining.

Abstract: Provided is a flux that allows soldering to be performed without requiring a step of removing a Cu-OSP film even with a Cu-OSP processed substrate. This flux containing rosin, an organic acid, a benzimidazole-based compound, and a solvent is characterized in that 30% by mass or more and 70% by mass or less of the rosin, 1% by mass or more and 10% by mass or less of the organic acid, 0.2% by mass or more and 10% by mass or less of the benzimidazole-based compound, and 20% by mass or more and 60% by mass or less of the solvent, wherein the benzimidazole-based compound is composed of at least one of 2-alkylbenzimidazole and a salt of 2-alkylbenzimidazole hydrohalide.

Abstract: Provided is a flux which is rosin-free and contains 50% by mass or more and 90% by mass or less of 2,4-diethyl-1,5-pentanediol, more than 0% by mass and less than 50% by mass of a solvent, 1% by mass or more and 15% by mass or less of an organic acid, wherein the total amount of the 2,4-diethyl-1,5-pentanediol and the solvent is 83% by mass or more and 99% by mass or less. This flux does not require washing with an organic detergent when transferred to solder balls is provided.