Abstract: Provided is a double-sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board superior in adhesive power after bonding under low pressure and also in repelling resistance after processing in high-temperature steps. The double sided pressure-sensitive adhesive tape for fixing a flexible printed circuit board according to the present invention has a 180° peel adhesion, as determined by bonding the adhesive tape onto a stainless steel plate under pressure by one reciprocation of a 10-g roller, leaving it still for 5 minutes and measuring it at a tensile speed of 300 mm/minute, of 6.5 N/20 mm or more and a terminal separation distance after reflow of 2.5 mm or less.

Abstract: Disclosed is a double-sided pressure-sensitive adhesive sheet for fixing a flexible printed circuit board, which has silicone release liners, but is less polluting and excels in workability. The double-sided pressure-sensitive adhesive sheet for fixing a flexible printed circuit board includes at least a pressure-sensitive adhesive unit including a substrate and pressure-sensitive adhesive layers present on or above both sides of the substrate; and silicone release liners present on or above both surfaces of the pressure-sensitive adhesive unit, in which the pressure-sensitive adhesive layers each include an acrylic polymer based on, as an essential monomer component, an alkyl (meth)acrylate whose alkyl moiety being a linear or branched-chain alkyl group having 1 to 14 carbon atoms, the pressure-sensitive adhesive unit has a thickness of 60 ?m or less, and the adhesive sheet evolves siloxane gas, if any, in an amount of 1 ng/cm2 or less when heated at 120° C. for 10 minutes.

Abstract: The present invention has an object to provide an electroconductive pressure-sensitive adhesive tape that achieves excellent tackiness and high electrical conductivity even when it is used in a finer shape (in particular, a narrow shape) and that has a small change in resistance value over time and achieves stable electrical conductivity even when it is used for a long time or in a harsh environment. The electroconductive pressure-sensitive adhesive tape of the present invention is an adhesive tape including a metal foil and a pressure-sensitive adhesive layer having an electroconductive filler on at least one side of the metal foil. The electroconductive pressure-sensitive adhesive tape has a surface exposure ratio of the electroconductive filler on a surface of the pressure-sensitive adhesive layer of 2 to 5%.

Abstract: The present invention provides an optical-use pressure-sensitive adhesive sheet, which includes a pressure-sensitive adhesive layer containing a polymer formed of one or more monomer ingredients containing, as an indispensable monomer ingredient, a monomer of which homopolymer has a glass transition temperature of not lower than ?10° C., said sheet having a moisture content of at least 0.65% by weight after stored in an environment at 60° C. and 95% RH for 120 hours. The pressure-sensitive adhesive layer is preferably an acrylic pressure-sensitive adhesive layer.

Abstract: The present invention provides an optical-use pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer having, as measured through dynamic viscoelastometry, a storage elastic modulus at 80° C. of at least 2.0×104 Pa and a loss elastic modulus at 80° C. of at least 1.0×104 Pa, in which the pressure-sensitive adhesive sheet has a peel force, as measured in the L-shape peel test, of at least 0.16 MPa, and has a peel distance, as measured in the constant-load peel test (under a load of 100 gf for 3 hours), of at most 50 mm.

Abstract: The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which comprises a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer and a chain transfer substance, in which the pressure-sensitive adhesive layer has characteristics that a gel fraction in the initial stage is from 40 to 70% by weight, and a difference between a gel fraction (% by weight) of the pressure-sensitive adhesive layer after the following solder reflow step and the gel fraction (% by weight) of the pressure-sensitive adhesive layer in the initial stage is 10 or less. The solder reflow step satisfies the following heat treatment conditions. Surface temperature of the double-sided pressure-sensitive adhesive tape or sheet reaches 175±10° C. within 130 to 180 seconds, the surface temperature reaches 230±10° C. within 200 to 250 seconds, the surface temperature reaches 255±15° C.

Abstract: A double-sided pressure-sensitive adhesive tape includes a nonwoven fabric substrate and pressure-sensitive adhesive layers present on both sides of the substrate, in which the nonwoven fabric substrate contains at least Manila hemp, has a thickness of 18 ?m or less, and has a tensile strength in a machine direction of 4 N/15 mm or more. The double-sided pressure-sensitive adhesive tape is thin and is effective for the reduction in size and thickness of products to be fixed through the tape. The tape has a high strength in the machine direction and does not break during production and processing processes. In addition, the tape has a nonwoven fabric substrate and thereby excels also in punching quality. The tape is therefore particularly useful as a double-sided pressure-sensitive adhesive tape for fixing a wiring circuit board.

Abstract: The present invention provides a pressure-sensitive adhesive tape for optical member, which has a toluene emission amount of at most 10 ?g/g and a formaldehyde emission amount of at most 3 ?g/g. The pressure-sensitive adhesive tape may include an acrylic pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape of the invention is favorable for use for in-vehicle installation, and for use for members near to users such as lenses, panels, etc.

Abstract: The present invention provides a double-sided pressure-sensitive adhesive sheet, including at least one pressure-sensitive adhesive layer which has a gel fraction of 10 to 70%, has a storage modulus at 23° C. of 1×105 Pa or less, and has a residual stress after 180 seconds of 3.5 N/cm2 or less, the storage modulus at 23° C. being measured in accordance with a dynamic viscoelasticity measurement and the residual stress after 180 seconds being measured in accordance with a tensile stress relaxation test under conditions of a temperature of 23° C. and a strain of 300%.

Abstract: Disclosed is a double-coated pressure-sensitive adhesive sheet which includes at least a pressure-sensitive adhesive unit including a plastic base film and, present on or above both surfaces thereof, pressure-sensitive adhesive layers; and non-silicone release liners present on both surfaces of the pressure-sensitive adhesive unit. The pressure-sensitive adhesive layers are each formed from an acrylic polymer containing, as essential monomer components, an alkyl (meth)acrylate whose alkyl moiety being a linear or branched-chain alkyl group having 2 to 14 carbon atoms and a polar-group-containing monomer. The pressure-sensitive adhesive unit has a thickness of 60 to 160 ?m, and each of the two pressure-sensitive adhesive layers of the pressure-sensitive adhesive unit has a thickness of 20 ?m or more. The adhesive sheet excels in processability and fittability around bumps and is usable for fixing a flexible printed circuit board or for fixing a hard disk drive component.

Abstract: Disclosed is a double-coated pressure-sensitive adhesive sheet for fixing a flexible printed circuit board, which includes at least a pressure-sensitive adhesive unit including a plastic base film having a thickness of 13 ?m or less, and pressure-sensitive adhesive layers on both sides of the plastic base film. The pressure-sensitive adhesive layers are formed from an acrylic polymer containing, as essential monomer components, a polar-group-containing monomer and an alkyl (meth)acrylate whose alkyl moiety being a linear or branched-chain alkyl group having 2 to 14 carbon atoms. The pressure-sensitive adhesive unit has a thickness of 60 ?m or less, the double-coated pressure-sensitive adhesive sheet shows an outgassing of 1 ?g/cm2 or less when heated at 120° C. for 10 minutes, and shows a split distance (lifting) of 1.5 mm or less.

Abstract: Disclosed is a double-coated pressure-sensitive adhesive sheet adopted to fix a hard disk drive component, which includes a pressure-sensitive adhesive unit including a plastic film base having a thickness of 20 ?m or less and pressure-sensitive adhesive layers arranged on or above both sides of the plastic film base; and non-silicone release liners arranged on both surfaces of the pressure-sensitive adhesive unit. The pressure-sensitive adhesive unit has a thickness of 60 ?m or less, and the double-coated pressure-sensitive adhesive sheet shows an outgassing of 1 ?g/cm2 or less when the double-coated pressure-sensitive adhesive sheet is heated at a temperature of 120° C. for 10 minutes. The double-coated pressure-sensitive adhesive sheet is free from silicone, thereby causes less contamination, evolves less outgas, and is superior in workability. It has further improved followability to difference in level by controlling the thickness of the plastic film base to 13 ?m or less.

Abstract: The present invention provides a thermosetting adhesive or pressure-sensitive adhesive tape or sheet including: a thermosetting adhesive or pressure-sensitive adhesive layer formed of a thermosetting adhesive or pressure-sensitive adhesive composition containing an acrylic polymer (X) constituted of, as essential monomer components, an alkyl (meth)acrylate (a) in which the alkyl moiety thereof has from 2 to 14 carbon atoms and a cyano group-containing monomer (b), and a phenol resin (Y); and provided on at least one surface of the thermosetting adhesive or pressure-sensitive adhesive layer, a release liner including a plastic film substrate and a release layer provided on at least one side of the plastic film substrate, the release layer containing low density polyethylene as a major component and having a thickness of 5 ?m or more and less than 20 ?m.

Abstract: The release liner includes a release layer constituted of at least one polyolefin resin, wherein the release layer has surface irregularities. The surface irregularities of the release layer may be constituted of recesses and protrusions which are irregularly different in shape and have been disposed in irregular arrangement. The release layer preferably has a surface roughness Ra of 1-3 ?m. As the polyolefin resin constituting the release layer can be used at least one polyolefin resin selected from the group consisting of polyethylenes, polypropylene, polybutenes, poly(4-methyl-1-pentene), and copolymers of ethylene with one or more ?-olefins having 3-10 carbon atoms.

Abstract: The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition contains an acrylic polymer as a main component and further contains an electrically conductive filler in a proportion of 5 to 100 parts by weight with respect to 100 parts by weight of a total solid in the pressure-sensitive adhesive composition except the electrically conductive filler. The double-sided pressure-sensitive adhesive tape or sheet is excellent in adhesiveness, electrically conducting property and anti-repulsion property, and thus can be advantageously used for wiring circuit board.

Abstract: The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for use in wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer as a main component, in which the double-sided pressure-sensitive adhesive tape or sheet has an amount of total outgas of 250 ?g/g or less and a diffusion amount of toluene of 10 ?g/g or less. The double-sided pressure-sensitive adhesive tape or sheet has a small generating amount of VOC as well as excellent punching processing property and anti-repulsion property.

Abstract: The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for use in a wiring circuit board, which includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition comprising an acrylic polymer and a tackifier resin containing a phenolic hydroxyl group; and a release liner comprising a releasing treatment layer formed of a silicone release agent. The double-sided pressure-sensitive adhesive tape or sheet of the invention has a good adhesiveness and, even after a high-temperature step, it is capable of exerting an excellent anti-repulsion property. Further, since the release liner can be easily peeled off even after the high-temperature step, the workability is excellent and the productivity is improved.

Abstract: The thermosetting adhesive or pressure-sensitive adhesive tape or sheet has a structure in which a thermosetting adhesive or pressure-sensitive adhesive layer made of a thermosetting adhesive or pressure-sensitive adhesive composition containing an acrylic polymer (X) containing at least an alkyl(meth)acrylate (a) in which the alkyl moiety thereof has from 2 to 14 carbon atoms and a cyano group-containing monomer (b) as monomer components and a phenol resin (Y) is protected by a release liner which does not substantially contain a silicone component. The acrylic polymer (X) may further contain a carboxyl group-containing monomer (c) as a monomer component. A release liner having a release layer made of polyethylene is suitable as the release liner which does not substantially contain a silicone component.

Abstract: The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which comprises a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer and a chain transfer substance, in which the pressure-sensitive adhesive layer has characteristics that a gel fraction in the initial stage is from 40 to 70% by weight, and a difference between a gel fraction (% by weight) of the pressure-sensitive adhesive layer after the following solder reflow step and the gel fraction (% by weight) of the pressure-sensitive adhesive layer in the initial stage is 10 or less. The solder reflow step satisfies the following heat treatment conditions. Surface temperature of the double-sided pressure-sensitive adhesive tape or sheet reaches 175±10° C. within 130 to 180 seconds, the surface temperature reaches 230±10° C. within 200 to 250 seconds, the surface temperature reaches 255±15° C.

Abstract: A pressure-sensitive adhesive label has a base having an information indication portion on its one surface thereof, and a pressure-sensitive adhesive layer formed on another surface of the base. After peeling a release liner, the label is stuck on an outer surface of a housing of the hard disk drive to reduce noise generated when the hard disk drive is driven. The release liner for coating the pressure-sensitive adhesive layer has an antistatic function and a cut line. The adhesive force of the adhesive layer is reduced by heating. The label has a surface density of not lower than 0.