Abstract: Provided are a measurement device and a measurement method that enable calibration in the event of error variations. A measurement device configured to measure an amount of moisture contained in a medium, the measurement device including: a first probe in which a first cable electrically connectable to a first connection cable is embedded; a second probe in which a second cable electrically connectable to a second connection cable is embedded; and a standard that is fixed at a predetermined positional relationship with the first probe and the second probe even during the measurement, is electrically connectable to the first connection cable and the second connection cable when the measurement is not conducted, and is used for calibration of the measurement.

Abstract: In a device measuring an amount of moisture in a medium, the performance of the device is improved. The sensor device includes a transmission probe, a reception probe, and a measurement circuit. The transmission probe includes a plurality of transmission antennas, and the reception probe includes a plurality of reception antennas. In this sensor device, the measurement circuit performs time-divisional control in which control of selecting one transmission antenna among the plurality of transmission antennas each time and radiating electromagnetic waves is repeatedly performed until performance of radiation ends in all the antennas set in advance.

Abstract: A sensor device is disclosed for measuring an amount of moisture in a medium that includes: a transmission antenna; a reception antenna to receive electromagnetic waves transmitted from the transmission antenna and through a medium; a measurement unit to measure the electromagnetic waves propagating to the reception antenna; and a sensor casing and further includes a transmission substrate including a plurality of wiring layers and a reception substrate including a plurality of wiring layers, and a measurement unit substrate including a plurality of wiring layers and includes the measurement unit or a first coating layer that, in a part of the transmission substrate, coats an outer circumference of the substrate and is formed from an electromagnetic wave absorbent material and a second coating layer that, in a part of the reception substrate, coats an outer circumference of the substrate and is formed from an electromagnetic wave absorbent material.

Abstract: A device for measuring the amount of moisture in a medium that includes a transmission antenna that sends a signal as an electromagnetic wave, a reception antenna that receives the electromagnetic wave sent from the transmission antenna and transmitted through a medium, a measurement section that measures the electromagnetic wave propagated to the reception antenna, and a sensor casing. The sensor device further includes a transmission substrate that includes a plurality of wiring layers and a reception substrate that includes a plurality of wiring layers, or a first covering layer that partially covers an outer periphery of the transmission substrate and a second covering layer that partially covers an outer periphery of the reception substrate The coverings are formed of an electromagnetic wave absorption material. The sensor casing includes a transmission probe casing that accommodates the transmission substrate and a reception probe casing that accommodates the reception substrate.

Abstract: In a device that measures an amount of moisture in a medium, performance of the device is improved. A sensor device includes a transmitter, a receiver, and a sensor control unit. In this sensor device, a transmitter supplies a transmission signal to a transmission antenna. In addition, in the sensor device, a receiver receives a reception signal corresponding to the transmission signal through a reception antenna. In the sensor device, before measuring a predetermined parameter on the basis of the reception signal, the sensor control unit adjusts electric power of the transmission signal on the basis the reception signal.

Abstract: Measurement accuracy of the amount of moisture is improved by a device that measures the amount of moisture in a medium. The sensor device includes a pair of antennas, a measurement circuit, a transmission path, and a radio wave absorption section. In the sensor device which includes the pair of antennas, the measurement circuit, the transmission path, and the radio wave absorption section, the measurement circuit measures the amount of moisture in a medium between the pair of antennas. Also, the transmission path connects the pair of antennas to the measurement circuit in the sensor device. The radio wave absorption section is formed in the surroundings of the transmission path in the sensor device.

Abstract: A vapor phase film deposition apparatus comprises a susceptor where a plurality of substrates is placed thereon; and an opposing face member disposed opposite to the susceptor. The opposing face member includes a plurality of raised portions which protrude toward the susceptor to define at least one flow channel. A reaction gas flows through the flow channel and deposits on the plurality of substrates. At least one of the plurality of raised portions includes a heat insulation structure. The vapor phase film deposition apparatus further comprising a heating element disposed on one side of the susceptor, which is opposite to the opposing face member.

Abstract: A vapor phase film deposition apparatus comprises a susceptor where a plurality of substrates is placed thereon; and an opposing face member disposed opposite to the susceptor. The opposing face member includes a plurality of raised portions which protrude toward the susceptor to define at least one flow channel. A reaction gas flows through the flow channel and deposits on the plurality of substrates. At least one of the plurality of raised portions includes a heat insulation structure. The vapor phase film deposition apparatus further comprising a heating element disposed on one side of the susceptor, which is opposite to the opposing face member.

Abstract: The present invention provides a film forming apparatus capable of enabling source gases to isotropically flow and reducing the size of its chamber. When a susceptor with substrate holders containing substrates moves downward, the substrate holders are combined with a clutch mechanism. When a driving motor runs, a rotating shaft conformably rotates. The rotation is transmitted to a central gear through the clutch mechanism so as to rotate the central gear. Thus, the substrate holder whose peripheral surface is engaged with the center gear accordingly rotates so as to rotate the substrates. When the driving motor runs, a revolving shaft conformably rotates. The rotation is transmitted to the susceptor through a revolving clutch mechanism so as to rotate the susceptor and revolve the substrates. Process gases are fed via an inlet so that expected films are formed on the substrates when the substrates are at rotation and revolution statuses.

Abstract: A chemical vapor deposition apparatus comprises a ballast gas source and a mass flow controller, wherein the ballast gas source is arranged at an upstream side of a separating device, and the pressure in a reaction chamber is controlled by a flow rate of the ballast gas. Since the space between the reaction chamber and the node connected with the ballast gas source is small, a pressure response of the reaction chamber can be speeded up.

Abstract: In an embodiment, a vapor phase film-forming apparatus 10 includes a susceptor 12 for holding a film forming substrate 14. A flow channel 40 is formed horizontally by the opposite surface 20 facing the susceptor 12. In the flow channel 40, a material gas introduction port 42 and material gas and a purge gas exhaust port 48 are provided. On the opposite surface 20, many purge gas nozzles 36 are provided and divided into a plurality of purge areas PE1-PE 3. Mass flow controllers (MFCs) 52A-52C and 62A-62C for adjusting the flow rate for each purge area are provided in each purge area. Then, the mass flow rate of the purge gas is controlled by the MFCs 52A-52C and 62A-62C for each purge area.

Abstract: A chemical vapor deposition apparatus comprises a ballast gas source and a mass flow controller, wherein the ballast gas source is arranged at an upstream side of a separating device, and the pressure in a reaction chamber is controlled by a flow rate of the ballast gas. Since the space between the reaction chamber and the node connected with the ballast gas source is small, a pressure response of the reaction chamber can be speeded up.

Abstract: The invention provides a gas distribution apparatus or injector in a reaction chamber comprising multiple diffusion plates arranged substantially parallel and at least one bump with slopes and substantially flat top/bottom surface to introduce at least two different reaction gases horizontally and separately into the reaction chamber while preventing condensation of adduct formed due to mixture of the reaction gases at a low temperature by avoiding back diffusion. Meanwhile any turbulence or vortex of the reaction gases is not caused because slope shape is formed at the bump.

Abstract: An electronic device includes the memory card connector including a loading opening for the memory card in the side face thereof and has a first sidewall and a second sidewall facing each other, the printed wire board on which a ground is formed, and a resin case having an opening portion, through which the memory card is inserted and formed in the sidewall of the loading opening. On the second main face of the printed wire board, there are formed a first electrode and a second electrode that are connected with the ground, that are disposed on the respective ends thereof at the loading opening side, and that are independent from each other, and the first electrode is disposed below the first sidewall of the memory card connector and the second electrode is disposed below the second sidewall of the memory card connector.

Abstract: A wireless charging coil PCB structure includes a first coil disposed on a first layer of PCB, where a center or peripheral of the first coil is a first non-coil region; a second coil disposed on a second layer of PCB, where a center or peripheral of the second coil is a second non-coil region; first conductive wires on the first non-coil region; and second conductive wires on the second non-coil region. Electric contacts are arranged between the first conductor and the second coil, and electrically connected in parallel to the first conductive wires and the portion of the second coil. Electric contacts are arranged between the second conductor and the first coil, and electrically connected in parallel to the second conductive wires and the portion of the first coil. The amount of charge is increased in the coil and resistance is reduced to overcome proximity effect.

Abstract: A wafer holder includes a holder main body, a supporting member, and a limiting member. The holder main body has a through hole region. The supporting member has a supporting main body and supporting legs. The supporting main body is disposed on an inner surface of the through hole region, and the supporting legs are attached to an inner surface of the supporting main body and configured to support a wafer. The limiting member is attached to the supporting main body and disposed between two adjacent supporting legs and opposite to a flat side of the wafer.

Abstract: A wireless charging (WLC) (A4WP) and near field communication (NFC) dual coils PCB structure comprising at least one WLC (A4WP) coil wire having spiral shape and disposed on a printed circuit board (PCB), and a NFC coil wire having spiral shape and disposed on the PCB. At least a portion of the coil wire of the spiral WLC (A4WP) coil is located on a region between two adjacent coil wires of the spiral NFC coil. Therefore, the present invention makes use of spaces of WLC (A4WP) coil such as A4WP or other relevant standards combined with the NFC coil, so that the dual coil of the present invention can reduce the area of the PCB occupied by the electronic device.

Abstract: A wireless charging coil PCB structure with slit includes at least one coil is disposed on a printed circuit board (PCB), wherein a slit defined on a portion of the conductive wire of the coil. The slit is located at the center of the coil wires and extending parallel to the conductive wire of the coil to increase the distance between the coil turns of the wire winding, and to overcome the proximity effect between the coil wires, and to reduce the coil impedance as well as enhance the heat dissipation effect.

Abstract: A wireless charging coil PCB structure includes a first coil disposed on a first layer of PCB, where a center or peripheral of the first coil is a first non-coil region; a second coil disposed on a second layer of PCB, where a center or peripheral of the second coil is a second non-coil region; first conductive wires on the first non-coil region; and second conductive wires on the second non-coil region. Electric contacts are arranged between the first conductor and the second coil, and electrically connected in parallel to the first conductive wires and the portion of the second coil. Electric contacts are arranged between the second conductor and the first coil, and electrically connected in parallel to the second conductive wires and the portion of the first coil. The amount of charge is increased in the coil and resistance is reduced to overcome proximity effect.

Abstract: An electronic device includes the memory card connector including a loading opening for the memory card in the side face thereof and has a first sidewall and a second sidewall facing each other, the printed wire board on which a ground is formed, and a resin case having an opening portion, through which the memory card is inserted and formed in the sidewall of the loading opening. On the second main face of the printed wire board, there are formed a first electrode and a second electrode that are connected with the ground, that are disposed on the respective ends thereof at the loading opening side, and that are independent from each other, and the first electrode is disposed below the first sidewall of the memory card connector and the second electrode is disposed below the second sidewall of the memory card connector.