Abstract: The present invention relates to a semiconductor device and an electronic device that facilitate calibration and can obtain favorable characteristics. The semiconductor device includes a substrate, a millimeter wave antenna provided on the substrate, and an image sensor provided on the substrate, in which an antenna surface of the millimeter wave antenna and a light receiving surface of the image sensor are disposed at spatially partitioned positions. The present technology can be applied to a sensor module.

Abstract: A combination of a first unit and a second unit are to be rotatably interconnected through a pin. The first unit includes a first unit body provided with a first pin hole, a first contact member, and a fastening member. The first contact member has a first contact surface. The second unit includes a second unit body provided with a second pin hole, and a second contact surface. The second contact surface is contactable with the first contact surface. The fastening member fastens the first contact member to the first unit body so as to allow the relative position of the first contact member to the first unit body to be adjusted.

Abstract: A ceramic wiring board that includes a ceramic insulator and a via-conductor. The ceramic insulator includes a crystalline constituent and an amorphous constituent. The via-conductor includes a metal and an oxide. The crystalline constituent and the oxide include at least one metal element in common. A tubular region having a thickness of 5 ?m adjoins and surrounds the via-conductor and has a higher concentration of the metal element than the ceramic insulator.

Abstract: A ceramic electronic component that includes a ceramic insulator and a terminal electrode on a surface of the ceramic insulator. The ceramic insulator contains a crystalline material and an amorphous material. The terminal electrode contains a metal and an oxide. The crystalline material and the oxide contain, in common, at least one type of a metal element. An adjacent region in the ceramic insulator which surrounds the terminal electrode and has a thickness of 5 ?m is higher in concentration of the metal element than a remote region which is distant from the terminal electrode by 100 ?m and has a thickness of 5 ?m.

Abstract: Provided is a construction machine capable of suppressing deformation of a boom in a simple configuration and at low costs. The construction machine includes a pair of backstops having respective hydraulic cylinders; a supply device which supplies the hydraulic cylinders with hydraulic fluid; a deformation sensing device which senses deformation of the boom; and a control device which controls the supply device so as to make a thrust of the hydraulic cylinder of one backstop having a larger pressing force, out of the pair of backstops, be larger than a thrust of the hydraulic cylinder of the other backstop, the pressing force being applied due to the deformation of the boom.

Abstract: A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1>X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

Abstract: A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1>X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

Abstract: A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1>X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

Abstract: An electronic device that includes an electronic component mounted on a multilayer ceramic substrate. The electronic component includes a connection terminal on the mounting surface side thereof, the connection terminal having an end with a rounded convex shape when viewed in cross section. The multilayer ceramic substrate includes a recessed portion at a position corresponding to the connection terminal, the recessed portion having a rounded concave shape when viewed in cross section, and a surface electrode disposed on at least part of the recessed portion and electrically connected to the connection terminal.

Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

Abstract: A multilayer ceramic substrate according to the present invention includes a plurality of base layers that are laminated containing a low-temperature co-fired ceramic material, a plurality of first constraint layers which contain a metal oxide not completely sintered at the sintering temperature of the low-temperature co-fired ceramic material and which are located between the base layers, and a protective layer which contains the metal oxide and which is in contact with an outermost base layer of the plurality of base layers in the lamination direction, and wherein X1>X2, where X1 is a content of the metal oxide in a surface section of the protective layer and X2 is a content of the metal oxide in a boundary section of the protective layer that is in contact with the outermost base layer.

Abstract: A ceramic electronic component that includes a ceramic insulator and a terminal electrode on a surface of the ceramic insulator. The ceramic insulator contains a crystalline material and an amorphous material. The terminal electrode contains a metal and an oxide. The crystalline material and the oxide contain, in common, at least one type of a metal element. An adjacent region in the ceramic insulator which surrounds the terminal electrode and has a thickness of 5 ?m is higher in concentration of the metal element than a remote region which is distant from the terminal electrode by 100 ?m and has a thickness of 5 ?m.

Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

Abstract: Provided is a construction machine capable of suppressing deformation of a boom in a simple configuration and at low costs. The construction machine includes a pair of backstops having respective hydraulic cylinders; a supply device which supplies the hydraulic cylinders with hydraulic fluid; a deformation sensing device which senses deformation of the boom; and a control device which controls the supply device so as to make a thrust of the hydraulic cylinder of one backstop having a larger pressing force, out of the pair of backstops, be larger than a thrust of the hydraulic cylinder of the other backstop, the pressing force being applied due to the deformation of the boom.

Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

Abstract: A ceramic wiring board that includes a ceramic insulator and a via-conductor. The ceramic insulator includes a crystalline constituent and an amorphous constituent. The via-conductor includes a metal and an oxide. The crystalline constituent and the oxide include at least one metal element in common. A tubular region having a thickness of 5 ?m adjoins and surrounds the via-conductor and has a higher concentration of the metal element than the ceramic insulator.

Abstract: A compound represented by Formula [I]: or pharmaceutically acceptable salt thereof, wherein each symbol is as defined in the description.

Abstract: Provided are an insulating ceramic paste, a ceramic electronic component, and a method for producing the ceramic electronic component that allow prevention of solder shorts between narrow-pitch terminal electrodes and suppression of generation of cracks in an insulator covering a portion of terminal electrodes during a firing step. The ceramic electronic component includes a ceramic multilayer substrate, terminal electrodes formed on a surface of the ceramic multilayer substrate, and an insulating ceramic film formed on the surface of the ceramic multilayer substrate so as to cover a portion of the terminal electrodes. An exposed surface portion (celsian-crystal-rich layer) of the insulating ceramic film has a thermal expansion coefficient that is lower than the thermal expansion coefficient of the ceramic multilayer substrate.

Abstract: Compounds of formula [I]: wherein each symbol is as defined in the description, or a pharmaceutically acceptable salts or solvates thereof.

Abstract: A method of forming a dielectric film having Si—C bonds and/or Si—N bonds on a semiconductor substrate by cyclic deposition, includes: (i) conducting one or more cycles of cyclic deposition in a reaction space wherein a semiconductor substrate is placed, using a Si-containing precursor and a reactant gas; and (ii) before or after step (i), applying a pulse of RF power to the reaction space while supplying a rare gas and a treatment gas without supplying a Si-containing precursor, whereby a dielectric film having Si—C bonds and/or Si—N bonds is formed on the semiconductor substrate.