Abstract: A state determination device includes: an extraction unit that extracts a face region representing a region corresponding to a face from each of a plurality of frames successively obtained by capturing images of a user's face, extracts face feature points representing parts of the face from the face region, calculates a face feature value extraction region as a region where a change occurs in the face region when the user is in an unawakened state based on the face feature points, and extracts a face feature value as a feature value from the face feature value extraction region; a state determination unit that determines whether the user is in the unawakened state or not based on the face feature value in each of the plurality of frames and previously generated determination information; and an output unit that outputs a determination result.

Abstract: A storage battery or a secondary battery is capable of improving the utilization of an active material and obtaining a high energy density, using raw materials having costs substantially equal to those of a conventional lead storage battery especially as a negative-electrode plate of the secondary battery. The negative-electrode active material for the secondary battery is a kneaded mixture including: a raw active material having a metal and an oxide of the metal; and carbon in such an amount that the total absorption number thereof is at least 4.7 ml per mol of the raw active material, in which the kneaded mixture contains no sulfates or sulfates in an amount of 7×10?2 mol or smaller per mol of the raw active material. The negative-electrode active material has a specific volume of 2.2×10?1 to 5×10?1 ml/g with subjected to no formation. The carbon is acetylene black or furnace carbon.

Abstract: A method for manufacturing a multi media card comprises the steps of: providing a substrate, mounting a first flash memory chip and a controller chip for controlling the flash memory chip over a front surface of the substrate, molding the first flash memory chip and the controller chip by a resin, providing a case having a main surface and a back surface, wherein the back surface of the case has a first recess and a second recess, and, covering the resin and the front surface of the substrate by the case. The depth of the first recess is deeper than the depth of the second recess. The resin is fitted in the first recess. An edge portion of the substrate is fitted in the second recess. The substrate warps so that a central portion of the substrate projects in a direction away from the case.

Abstract: A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.

Abstract: A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.

Abstract: A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.

Abstract: A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.

Abstract: In a memory card of the structure wherein a substrate is affixed to a cap, the memory card is formed to a predetermined thickness without projection of substrate edges from a back surface of the cap.

Abstract: An AAL1 processing method in a cell disassembly apparatus for performing pointer comparison processing on the assumption that a pointer is inserted in each ATM cell, in parallel with sequence number processing, to determine the validity of the result of the pointer comparison processing to control an output data stream. In this case, data associated with each connection required for each processing is read from a memory table based on connection information added to a received ATM cell each time the ATM cell is received, and set in corresponding processing units.