Abstract: A substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate to adsorb a substrate by electrostatic force. The electrostatic chuck includes: an adsorption layer that is formed of ceramic and that contacts the substrate to adsorb and hold the substrate; a first heating layer that is formed on the adsorption layer and that includes a first electrode; a second heating layer that is formed on the first heating layer and that includes a second electrode; and a via that is provided between the first electrode and the second electrode to electrically connect the first electrode and the second electrode to each other. The via includes a body portion, and an end portion that is connected to the body portion. A diameter of the end portion is larger than that of the body portion.

Abstract: A substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate to adsorb a substrate by electrostatic force. The electrostatic chuck includes: an adsorption layer that is formed of ceramic and that contacts the substrate to adsorb and hold the substrate; a first heating layer that is formed on the adsorption layer and that includes a first electrode; a second heating layer that is formed on the first heating layer and that includes a second electrode; and a via that is provided between the first electrode and the second electrode to electrically connect the first electrode and the second electrode to each other. The via includes a body portion, and an end portion that is connected to the body portion. A diameter of the end portion is larger than that of the body portion.

Abstract: A wiring board includes: an insulating layer; a pad including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the side surface and the lower surface of the pad are embedded in the insulating layer; and a metal post formed on the upper surface of the pad and including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein a narrowed portion is formed in the side surface of the metal post.

Abstract: A wiring board includes: an insulating layer; a pad including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the side surface and the lower surface of the pad are embedded in the insulating layer; and a metal post formed on the upper surface of the pad and including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein a narrowed portion is formed in the side surface of the metal post.

Abstract: A wiring substrate includes a wiring layer. Metal posts are arranged on the wiring layer. The metal posts are used to mount an electronic component. A protective layer covers a surface of the wiring layer on which the metal posts are arranged. The wiring layer includes a seed layer and a metal plating layer. The metal plating layer has a size that is the same as that of the seed layer in a plan view. The metal posts each include an upper end, which projects from the protective layer, and a lower end, which has a width that is the same as that of the upper end or greater. The protective layer includes a fillet for each metal post. The fillet extends toward an upper end surface of the corresponding metal post and contacts a side surface of the corresponding metal posts.

Abstract: A wiring substrate includes a first metal layer formed on a wiring layer; a solder resist layer that covers the wiring layer and the first metal layer, and is provided with an open portion that exposes a part of an upper surface of the first metal layer; a second metal layer formed on the upper surface of the first metal layer that is exposed within the open portion; and a third metal layer formed on the second metal layer, wherein the solder resist layer covers an outer peripheral portion of the upper surface of the first metal layer to expose the part of the upper surface of the first metal layer within the open portion, and wherein an upper surface of the second metal layer is flush with an upper surface of the solder resist layer or projects from the upper surface of the solder resist layer.

Abstract: A wiring substrate includes a wiring layer. Metal posts are arranged on the wiring layer. The metal posts are used to mount an electronic component. A protective layer covers a surface of the wiring layer on which the metal posts are arranged. The wiring layer includes a seed layer and a metal plating layer. The metal plating layer has a size that is the same as that of the seed layer in a plan view. The metal posts each include an upper end, which projects from the protective layer, and a lower end, which has a width that is the same as that of the upper end or greater. The protective layer includes a fillet for each metal post. The fillet extends toward an upper end surface of the corresponding metal post and contacts a side surface of the corresponding metal posts.

Abstract: A wiring board includes a core layer, a through-hole penetrating through the core layer in its thickness direction, a first wiring layer formed on a first surface of the core layer, a through-hole wiring formed in the through-hole and electrically connected to the first wiring layer, and a curved first chamfered portion formed in a boundary portion between an inner side surface of the through-hole and the first surface of the core layer. The first wiring layer includes a first metal layer formed outside the first chamfered portion on the first surface of the core layer and a second metal layer formed on the first chamfered portion and the first metal layer.

Abstract: A wiring substrate includes a first metal layer formed on a wiring layer; a solder resist layer that covers the wiring layer and the first metal layer, and is provided with an open portion that exposes a part of an upper surface of the first metal layer; a second metal layer formed on the upper surface of the first metal layer that is exposed within the open portion; and a third metal layer formed on the second metal layer, wherein the solder resist layer covers an outer peripheral portion of the upper surface of the first metal layer to expose the part of the upper surface of the first metal layer within the open portion, and wherein an upper surface of the second metal layer is flush with an upper surface of the solder resist layer or projects from the upper surface of the solder resist layer.

Abstract: A wiring board includes a core layer, a through-hole penetrating through the core layer in its thickness direction, a first wiring layer formed on a first surface of the core layer, a through-hole wiring formed in the through-hole and electrically connected to the first wiring layer, and a curved first chamfered portion formed in a boundary portion between an inner side surface of the through-hole and the first surface of the core layer. The first wiring layer includes a first metal layer formed outside the first chamfered portion on the first surface of the core layer and a second metal layer formed on the first chamfered portion and the first metal layer.

Abstract: A substrate transfer apparatus has pluralities of pairs of substrate support mechanisms. The substrate support mechanism includes a first roller provided on a first rotary shaft and a second roller provided on a second rotary shaft, the substrate support mechanism transfers a substrate in a transfer direction while supporting the substrate between the first and second rollers in a thickness direction of the substrate. The pair of the substrate support mechanisms are disposed so as to oppose to each other in a width direction of the substrate and the pairs of the substrate support mechanisms are arranged along with the transfer direction. Further, a substrate position regulating member that regulates a position of the substrate by contacting with a side surface which is parallel to the transfer direction is provided on either of the first and second rotary shafts.

Abstract: A substrate transfer apparatus has pluralities of pairs of substrate support mechanisms. The substrate support mechanism includes a first roller provided on a first rotary shaft and a second roller provided on a second rotary shaft, the substrate support mechanism transfers a substrate in a transfer direction while supporting the substrate between the first and second rollers in a thickness direction of the substrate. The pair of the substrate support mechanisms are disposed so as to oppose to each other in a width direction of the substrate and the pairs of the substrate support mechanisms are arranged along with the transfer direction. Further, a substrate position regulating member that regulates a position of the substrate by contacting with a side surface which is parallel to the transfer direction is provided on either of the first and second rotary shafts.