Patents by Inventor Takahiro Setaka

Takahiro Setaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding method and bonding apparatus
    Patent number: 9962915
    Abstract: A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: May 8, 2018
    Assignee: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Atsushi Miyanari, Yoshihiro Inao, Shigeru Kato, Takahiro Setaka, Shingo Ishida
  • BONDING METHOD AND BONDING APPARATUS
    Publication number: 20140374017
    Abstract: A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.
    Type: Application
    Filed: January 23, 2013
    Publication date: December 25, 2014
    Inventors: Atsushi Miyanari, Yoshihiro Inao, Shigeru Kato, Takahiro Setaka, Shingo Ishida