Abstract: A method for producing an electronic apparatus casing including: a step of forming a copper layer by way of non-electrolytic plating onto a casing body made from a magnesium or magnesium alloy material shaped into a predetermined configuration; a step of forming a nickel layer on the copper layer by way of non-electrolytic plating; a step of carrying out a surface grinding and a honing to the nickel layer; a step of forming a hard transparent glass layer by using a colloid solution containing SiO.sub.2 and Na.sub.2 O; and a step of forming a silica layer on the hard glass layer by using a partially hydrolyzed solution of an organic silicate ester.

Abstract: An electronic apparatus casing that includes a casing body made from a magnesium or magnesium alloy material is provided. The external surface of this casing body is protected by a plurality of film layers. Specifically, a first layer of copper is formed on the casing body. Then, a second layer of nickel is formed on the first layer of copper. A third layer of a transparent glass is then formed on the second layer of nickel. Lastly, a fourth layer of silica is formed on the third layer of transparent glass. The combination of these layers functions to exhibit a corrosion resistance, an abrasion resistance as well as an external metallic feeling.