Patents by Inventor Takahiro Shiozawa
Takahiro Shiozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11848189Abstract: A substrate processing method includes supplying a developing liquid configured to form a resist pattern onto a surface of a substrate on which a resist film is formed; performing multiple cycles of a cleaning processing of supplying a modifying liquid containing a modifying agent having a hydrophilic group onto the surface of the substrate on which the resist pattern is formed and supplying a rinse liquid configured to remove the modifying liquid onto the surface of the substrate; and drying the surface of the substrate after performing the multiple cycles of the cleaning processing.Type: GrantFiled: September 2, 2020Date of Patent: December 19, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Takahiro Shiozawa, Hiroki Tadatomo, Akiko Kai, Hiroshi Ichinomiya
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Patent number: 11594424Abstract: A substrate processing method is a method of processing a substrate on which a metal-containing liquid for a film below a resist is applied, wherein prior to a heating process of performing a heat treatment on the substrate applied with the metal-containing liquid, the substrate processing method includes: a deprotection promoting process of promoting deprotection of functional groups in a material for the film included in the substrate on which the metal-containing liquid has been applied; a solvent removing process of removing a solvent included in the metal-containing liquid on the substrate; and a moisture absorbing process of bringing a surface of the substrate into contact with moisture.Type: GrantFiled: August 23, 2019Date of Patent: February 28, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Takahiro Shiozawa, Masashi Enomoto
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Publication number: 20210249277Abstract: A substrate processing method is a method of processing a substrate on which a metal-containing liquid for a film below a resist is applied, wherein prior to a heating process of performing a heat treatment on the substrate applied with the metal-containing liquid, the substrate processing method includes: a deprotection promoting process of promoting deprotection of functional groups in a material for the film included in the substrate on which the metal-containing liquid has been applied; a solvent removing process of removing a solvent included in the metal-containing liquid on the substrate; and a moisture absorbing process of bringing a surface of the substrate into contact with moisture.Type: ApplicationFiled: August 23, 2019Publication date: August 12, 2021Inventors: Takahiro SHIOZAWA, Masashi ENOMOTO
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Publication number: 20210066097Abstract: A substrate processing method includes supplying a developing liquid configured to form a resist pattern onto a surface of a substrate on which a resist film is formed; performing multiple cycles of a cleaning processing of supplying a modifying liquid containing a modifying agent having a hydrophilic group onto the surface of the substrate on which the resist pattern is formed and supplying a rinse liquid configured to remove the modifying liquid onto the surface of the substrate; and drying the surface of the substrate after performing the multiple cycles of the cleaning processing.Type: ApplicationFiled: September 2, 2020Publication date: March 4, 2021Inventors: Takahiro Shiozawa, Hiroki Tadatomo, Akiko Kai, Hiroshi Ichinomiya
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Patent number: 10656526Abstract: A thermal treatment apparatus performs a thermal treatment on a metal-containing film formed on a substrate. The thermal treatment apparatus includes a treatment chamber that houses the substrate; a thermal treatment plate that is provided inside the treatment chamber and mounts the substrate thereon; and a moisture supply unit that supplies moisture to the metal-containing film. At the time of the thermal treatment, moisture is supplied to the metal-containing film of the substrate on the thermal treatment plate and an atmosphere in the treatment chamber is exhausted from a central portion of the treatment chamber.Type: GrantFiled: November 28, 2017Date of Patent: May 19, 2020Assignee: Tokyo Electron LimitedInventors: Yohei Sano, Shinichiro Kawakami, Masashi Enomoto, Takahiro Shiozawa, Keisuke Yoshida, Tomoya Onitsuka
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Publication number: 20180164689Abstract: A thermal treatment apparatus that performs a thermal treatment on a metal-containing film formed on a substrate, includes: a treatment chamber that houses the substrate; a thermal treatment plate that is provided inside the treatment chamber and mounts the substrate thereon; and a moisture supply unit that supplies moisture to the metal-containing film, wherein at the time of the thermal treatment, moisture is supplied to the metal-containing film of the substrate on the thermal treatment plate and an atmosphere in the treatment chamber is exhausted from a central portion of the treatment chamber.Type: ApplicationFiled: November 28, 2017Publication date: June 14, 2018Inventors: Yohei SANO, Shinichiro KAWAKAMI, Masashi ENOMOTO, Takahiro SHIOZAWA, Keisuke YOSHIDA, Tomoya ONITSUKA
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Patent number: 9558960Abstract: A substrate processing method includes a coating step that applies a coating liquid to a substrate having a front surface on which a pattern is formed, thereby forming a coating film on the substrate, a film removing step that heats the substrate to gasify components of the coating film thereby to reduce a thickness of the film, and a film curing step that is performed after or simultaneously with the film removing step and that heats the substrate to cure the coating film through crosslinking reaction. The film removing step is performed under conditions ensuring that an average thickness of the cured coating film is not greater than 80% of an average thickness of the coating film before being subjected to the film removing step.Type: GrantFiled: December 24, 2015Date of Patent: January 31, 2017Assignee: Tokyo Electron LimitedInventors: Takahiro Shiozawa, Kenichi Ueda
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Patent number: 9552987Abstract: A substrate processing method is performed to improve surface roughness of a pattern mask formed on a substrate by being exposed and developed. The method includes supplying a first solvent in a gaseous state to a surface of the substrate to dissolve the pattern mask, and supplying a second solvent to the surface of the substrate, which is supplied with the first solvent, to dissolve the pattern mask, wherein a permeability of the second solvent is lower than a permeability of the first solvent.Type: GrantFiled: June 6, 2014Date of Patent: January 24, 2017Assignee: TOKYO ELECTRON LIMITEDInventors: Yuichiro Miyata, Keiichi Tanaka, Kenichi Ueda, Takahiro Shiozawa
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Publication number: 20160189974Abstract: A substrate processing method includes a coating step that applies a coating liquid to a substrate having a front surface on which a pattern is formed, thereby forming a coating film on the substrate, a film removing step that heats the substrate to gasify components of the coating film thereby to reduce a thickness of the film, and a film curing step that is performed after or simultaneously with the film removing step and that heats the substrate to cure the coating film through crosslinking reaction. The film removing step is performed under conditions ensuring that an average thickness of the cured coating film is not greater than 80% of an average thickness of the coating film before being subjected to the film removing step.Type: ApplicationFiled: December 24, 2015Publication date: June 30, 2016Inventors: Takahiro Shiozawa, Kenichi Ueda
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Patent number: 9272349Abstract: A numerical control device for a wire electric discharge machining apparatus generates a wire-breakage sign signal, outputs a machining-condition re-setting instruction and wire-breakage threshold re-setting instruction from the wire-breakage sign signal and wire-breakage threshold, sets the wire-breakage threshold according to the wire-breakage threshold re-setting instruction and a wire-breakage signal, calculates a machining energy from a discharge pulse count, measures a machining speed from position information, calculates a board thickness of the workpiece from the machining energy and machining speed, outputs, according to a predetermined algorithm, a machining-condition switching instruction from the board thickness, the machining-condition re-setting instruction, and the wire-breakage signal, sends an oscillation instruction to a oscillator and sends a shaft feed instruction to a servo amplifier so that the machining condition is set to one determined by the machining-condition switching instruction,Type: GrantFiled: January 22, 2010Date of Patent: March 1, 2016Assignee: Mitsubishi Electric CorporationInventors: Yasuo Onodera, Takahiro Shiozawa, Seiji Satou, Yoshikazu Ukai, Hiroatsu Kobayashi
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Patent number: 9168603Abstract: A wire electric discharge machining apparatus that performs an electric discharge machining by applying a pulse voltage between a wire electrode (1) and a workpiece (2), the wire electric discharge machining apparatus including, a machining speed detection unit (14) that detects relative machining speed of the workpiece (2) and the wire electrode (1); a machining energy calculation unit (13) that calculates machining energy of a discharge pulse; a board thickness calculation unit (12) that calculates a board thickness of the workpiece (4) based on the machining speed detected by the machining speed detection unit (14) and the machining energy calculated by the machining energy calculation unit (13); a stationary state determination unit (16) that determines whether the machining is in a stationary state from a machining state during the machining, after the machining condition is switched in accordance with a board thickness of the workpiece (4) calculated by the board thickness calculation unit (12); and a mType: GrantFiled: July 7, 2009Date of Patent: October 27, 2015Assignee: Mitsubishi Electric CorporationInventors: Yasuo Onodera, Takahiro Shiozawa, Tatsushi Sato
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Publication number: 20140363976Abstract: A substrate processing method is performed to improve surface roughness of a pattern mask formed on a substrate by being exposed and developed. The method includes supplying a first solvent in a gaseous state to a surface of the substrate to dissolve the pattern mask, and supplying a second solvent to the surface of the substrate, which is supplied with the first solvent, to dissolve the pattern mask, wherein a permeability of the second solvent is lower than a permeability of the first solvent.Type: ApplicationFiled: June 6, 2014Publication date: December 11, 2014Inventors: Yuichiro MIYATA, Keiichi TANAKA, Kenichi UEDA, Takahiro SHIOZAWA
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Publication number: 20130024020Abstract: In order to obtain wire-breakage thresholds and machining conditions for respective board thicknesses in a trial machining, a numerical control device for a wire electric discharge machining apparatus according to the present invention includes a wire-breakage-sign-signal generation means that generates a wire-breakage sign signal from machining state quantities, a wire-breakage sign detection means that outputs a machining-condition re-setting instruction and a wire-breakage threshold re-setting instruction from the wire-breakage sign signal and a wire-breakage threshold, a wire-breakage threshold setting means that sets the wire-breakage threshold according to the wire-breakage threshold re-setting instruction and a wire-breakage signal, a machining energy calculation means that calculates a machining energy from a discharge pulse count, a machining speed measurement means that measures a machining speed from position information, a board thickness calculation means that calculates a board thickness of theType: ApplicationFiled: January 22, 2010Publication date: January 24, 2013Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Yasuo Onodera, Takahiro Shiozawa, Seiji Satou, Yoshikazu Ukai, Hiroatsu Kobayashi
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Publication number: 20120103943Abstract: A wire electric discharge machining apparatus that performs an electric discharge machining by applying a pulse voltage between a wire electrode (1) and a workpiece (2), the wire electric discharge machining apparatus including, a machining speed detection unit (14) that detects relative machining speed of the workpiece (2) and the wire electrode (1); a machining energy calculation unit (13) that calculates machining energy of a discharge pulse; a board thickness calculation unit (12) that calculates a board thickness of the workpiece (4) based on the machining speed detected by the machining speed detection unit (14) and the machining energy calculated by the machining energy calculation unit (13); a stationary state determination unit (16) that determines whether the machining is in a stationary state from a machining state during the machining, after the machining condition is switched in accordance with a board thickness of the workpiece (4) calculated by the board thickness calculation unit (12); and a mType: ApplicationFiled: July 7, 2009Publication date: May 3, 2012Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Yasuo Onodera, Takahiro Shiozawa, Tatsushi Sato
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Patent number: 7269225Abstract: A serial digital signal transmission apparatus can transmit HDTV digital serial signals with little jitter while utilizing the SRTS method. In the apparatus, parallel clocks are counted by an N counter to be supplied to the latch circuit, which latches the output count of a p-bit counter, RTSs are supplied from the latch circuit, as the result of comparison gated by a gate circuit is supplied to a PLL circuit and multiplied by N, parallel clocks of 74.25 MHz or 74.25/1.001 MHz, which are inputs to the N counter are regenerated (N is 8, 15 or 16), and transmitted data undergo parallel-to-serial conversion by a PS converter with these parallel clocks.Type: GrantFiled: July 30, 2003Date of Patent: September 11, 2007Assignee: NEC CorporationInventors: Takahiro Shiozawa, Kurenai Murakami, Nobuto Kawataka
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Patent number: 6859579Abstract: To provide an optical switcher capable of sending incident light on one input port to any plurality of output ports. The optical switcher includes input ports disposed on extensions of m input optical paths (m being 2 or greater natural number), output ports disposed on extensions of n output optical paths (n being 2 or greater natural number), and movable translucent switch mirrors 311-3mn, disposed at intersections of the m input optical paths and the n output optical paths, for switching between the input optical paths and the output optical paths. A switch mirror 311-3mn located nearer the input ports has a higher transmittance.Type: GrantFiled: September 27, 2002Date of Patent: February 22, 2005Assignee: NEC CorporationInventors: Takahiro Shiozawa, Kenichirou Suzuki, Takashi Mizutani
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Publication number: 20040022330Abstract: A serial digital signal transmission apparatus can transmit HDTV digital serial signals with little jitter while utilizing the SRTS method. In the apparatus, parallel clocks are counted by an N counter to be supplied to the latch circuit, which latches the output count of a p-bit counter, RTSs are supplied from the latch circuit, as the result of comparison gated by a gate circuit is supplied to a PLL circuit and multiplied by N, parallel clocks of 74.25 MHz or {fraction (74.25/1.001)} MHz, which are inputs to the N counter are regenerated (N is 8, 15 or 16), and transmitted data undergo parallel-to-serial conversion by a PS converter with these parallel clocks.Type: ApplicationFiled: July 30, 2003Publication date: February 5, 2004Applicant: NEC CORPORATIONInventors: Takahiro Shiozawa, Kurenai Murakami, Nobuto Kawataka
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Publication number: 20030063841Abstract: To provide an optical switcher capable of sending incident light on one input port to any plurality of output ports. The optical switcher includes input ports disposed on extensions of m input optical paths (m being 2 or greater natural number), output ports disposed on extensions of n output optical paths (n being 2 or greater natural number), and movable translucent switch mirrors 311-3mn, disposed at intersections of the m input optical paths and the n output optical paths, for switching between the input optical paths and the output optical paths. A switch mirror 311-3mn located nearer the input ports has a higher transmittance.Type: ApplicationFiled: September 27, 2002Publication date: April 3, 2003Applicant: NEC CORPORATIONInventors: Takahiro Shiozawa, Kenichirou Suzuki, Takashi Mizutani
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Patent number: 6046525Abstract: This invention provides the easy and consistent displacement control of a piezo-electric actuator for driving the variable wavelength filter used for wavelength multiplexed optical communication, wherein the piezo-electric actuator is controlled once to the initial displacement condition and, thereafter, a driving voltage is applied to the piezo-electric actuator based on the displacement characteristic data stored in a memory circuit for obtaining a desired displacement.Type: GrantFiled: March 28, 1997Date of Patent: April 4, 2000Assignee: NEC CorporationInventor: Takahiro Shiozawa
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Patent number: 5471332Abstract: An apparatus and a method for performing hitless switching between optical transmission lines such as optical fiber circuits are provided. An optical switch or optical switching network having input terminals and output terminals for selecting optical signals inputted to the input terminals to the output terminals with a selection ratio which can be varied continuously is used. An optical signal converter for generating an optical signal of light which does not interfere with another optical signal is attached to the optical switch. Further, a signal loop interconnecting one of the output terminals of the switch and the input of the optical signal converter is provided.Type: GrantFiled: April 18, 1994Date of Patent: November 28, 1995Assignee: NEC CorporationInventors: Tatsuya Shiragaki, Takahiro Shiozawa, Syuji Suzuki, Masahiko Fujiwara