Abstract: An outer rotor electric motor is provided in which a rotor having a rotor case and a plurality of permanent magnets fixed to an inner periphery of the rotor case is disposed so as to cover a stator, and an end part of a rotating shaft is fastened to the end wall by a fastening member having part thereof exposed to an exterior from an upper face of the end wall of the rotor case, wherein a plurality of cooling blades are provided with the end wall so as to extend radially while projecting downward from of the end wall, radially extending grooves for discharging water are formed in the end wall so as to individually correspond to the cooling blades, and a plurality of cooling air discharge holes that discharge air from the cooling blade are formed in the side wall of the rotor case.

Abstract: An outer rotor type electric motor is provided in which a ring-shaped yoke made of a magnetic metal is secured to an inner periphery of a plate-shaped rotor case, and includes a rotor in which a resin bonded permanent magnet is mold bonded to an inner peripheral face of the yoke, wherein an engagement portion (25a) that bites into and engages with the rotor case (23A) is formed integrally with and connected to the resin bonded permanent magnet (25). This can reliably prevent relative rotation of a resin bonded permanent magnet with respect to a rotor case when a rotor is rotating.

Abstract: An outer rotor electric motor is provided in which a rotor having a rotor case and a plurality of permanent magnets fixed to an inner periphery of the rotor case is disposed so as to cover a stator, and an end part of a rotating shaft is fastened to the end wall by a fastening member having part thereof exposed to an exterior from an upper face of the end wall of the rotor case, wherein a plurality of cooling blades are provided with the end wall so as to extend radially while projecting downward from of the end wall, radially extending grooves for discharging water are formed in the end wall so as to individually correspond to the cooling blades, and a plurality of cooling air discharge holes that discharge air from the cooling blade are formed in the side wall of the rotor case.

Abstract: According to one embodiment, electronic device includes first board, second board, first component, and second component. The first board includes first and second faces and to which opening and cutout portion is provided. The opening penetrates through the first board. The cutout portion extends to side separating from center of the opening at edge of the opening. The second board includes third and fourth faces. The second board overlaps the first board and is electrically connected to the first board in state in which the fourth face and the first face face each other. The second board covers the opening. The first electronic component is provided to the third face, and electrically connected to the second board. The second component is provided to the fourth face and electrically connected to the second board in state in which at least portion of the second component is held in the opening.

Abstract: According to one exemplary embodiment, an endoscope apparatus includes: an insertion unit that is an object to be disinfected by boiling; an operation unit connected to the insertion part; a main unit connected to the operation unit; a first circuit board embedded in the main unit; a first electronic component electrically connected to the first circuit board via a first solder; a second circuit board embedded in at least any one of the insertion unit and the operation unit; a second electronic component electrically connected to the second circuit board via a second solder having higher stress resistance than that of the first solder; and a bonding member bonded to the second electronic component and the second circuit board, the bonding member having a glass transition point higher than that of the second circuit board.

Abstract: According to one embodiment, electronic device includes first board, second board, first component, and second component. The first board includes first and second faces and to which opening and cutout portion is provided. The opening penetrates through the first board. The cutout portion extends to side separating from center of the opening at edge of the opening. The second board includes third and fourth faces. The second board overlaps the first board and is electrically connected to the first board in state in which the fourth face and the first face face each other. The second board covers the opening. The first electronic component is provided to the third face, and electrically connected to the second board. The second component is provided to the fourth face and electrically connected to the second board in state in which at least portion of the second component is held in the opening.

Abstract: According to one embodiment, an electronic apparatus includes a housing having electric insulation properties, and a circuit element installed in the housing and including a plurality of connection terminals, wherein the housing includes an inner surface including a mounting region on which the circuit element is mounted, a plurality of adhesive filled portions in the mounting region, which are separated by a division wall in order to correspond to the connection terminals of the circuit element, and through which the connection terminals are inserted, and a plurality of traces provided on the inner surface of the housing, one ends of the traces running through the adhesive filled portions, wherein the adhesive filled portions of the housing are filled with conductive adhesive which fix the circuit element to the mounting region, and wherein the connection terminals are electrically connected to the traces by the conductive adhesive.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a wiring pattern, a recess, a pad portion, and an electronic component. The wiring pattern is formed on an inner surface of the housing from an electrically conductive adhesive. The recess is in the inner surface of the housing. The pad portion is formed in the recess from the conductive adhesive and connected to an end portion of the wiring pattern. The electronic component includes a terminal which contacts the pad portion.

Abstract: According to one exemplary embodiment, an endoscope apparatus includes: an insertion unit that is an object to be disinfected by boiling; an operation unit connected to the inertion part; a main unit connected to the operation unit; a first circuit board embedded in the main unit; a first electronic component electrically connected to the first circuit board via a first solder; a second circuit board embedded in at least any one of the insertion unit and the operation unit; a second electronic component electrically connected to the second circuit board via a second solder having higher stress resistance than that of the first solder; and a bonding member bonded to the second electronic component and the second circuit board, the bonding member having a glass transition point higher than that of the second circuit board.

Abstract: An endoscope device includes: a circuit board including a mounting surface; an electronic component including a bottom surface facing the mounting surface and a lateral portion; a first electrode mounted across a corner portion of the bottom surface and the lateral portion; a second electrode adjacent to the first electrode and mounted across the bottom surface and the lateral portion; a third electrode mounted on the mounting surface to face the first electrode, including an edge portion following the lateral portion and located outside of a first area of the mounting surface covered by the electronic component, and having a wider area than that of the first electrode and soldered to the first electrode; and a fourth electrode mounted on the mounting surface to face the second electrode, including an edge portion following the lateral portion and located outside of the first area, and soldered to the second electrode.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a signal wiring and an electronic component. The signal wiring is provided on a first surface which is an inner surface of the housing. The electronic component is accommodated in the housing and includes a conductive member for electrical continuity with the signal wiring. The conductive member is formed on a surface of the electronic component facing the first surface of the housing. The electronic component is fixed to the first surface of the housing by a conductive adhesive agent having conductivity so that the conductive member has electrically continuity with the signal wiring. The electronic component is fixed to the first surface of the housing by a reinforcing adhesive agent having adhesive strength higher than the conductive adhesive agent.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a printed wiring board accommodated in the housing, and a circuit component electrically connected to the printed wiring board, the circuit component including an outer peripheral surface. The printed wiring board includes an outer peripheral edge, at least a pair of edge portions extending in mutually crossing directions, the pair of edge portions being opposed to the outer peripheral surface of the circuit component and being located inside the outer peripheral edge, and a projection portion located between the pair of edge portions and projecting toward the circuit component.

Abstract: According to one embodiment, a wiring design support apparatus comprises a display, a drawing module, and a data creation module. The display is configured to display a three-dimensional object. The drawing module is configured to draw a line connecting two points on a surface of the three-dimensional object displayed by the display. The data creation module is configured to create first three-dimensional data indicating a wiring based on the line drawn by the drawing module.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a wiring pattern, a recess, a pad portion, and an electronic component. The wiring pattern is formed on an inner surface of the housing from an electrically conductive adhesive. The recess is in the inner surface of the housing. The pad portion is formed in the recess from the conductive adhesive and connected to an end portion of the wiring pattern. The electronic component includes a terminal which contacts the pad portion.

Abstract: According to one embodiment, there is provided an electronic apparatus, including: an electrically-insulative housing having a first part and a second part attachable to and detachable from the first part; a circuit board housed in the housing; a signal wire formed on an inner face of the second part; and a connector formed to electrically connect the signal wire and a terminal part of the circuit board.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a signal wiring and an electronic component. The signal wiring is provided on a first surface which is an inner surface of the housing. The electronic component is accommodated in the housing and includes a conductive member for electrical continuity with the signal wiring. The conductive member is formed on a surface of the electronic component facing the first surface of the housing. The electronic component is fixed to the first surface of the housing by a conductive adhesive agent having conductivity so that the conductive member has electrically continuity with the signal wiring. The electronic component is fixed to the first surface of the housing by a reinforcing adhesive agent having adhesive strength higher than the conductive adhesive agent.

Abstract: An electronic device includes: an insulting casing having a first wall part and a second wall part that extends in a direction intersecting the first wall part; a contained component contained in the casing and provided at the first wall part at a position in the vicinity of the second wall part; and a conductive adhesive provided at the first wall part and comprising a first end portion electrically connected to the contained component and a second end portion provided at a position different from that of the first end portion.

Abstract: According to one embodiment, an electronic apparatus includes a housing having electric insulation properties, a substrate installed in the housing, a trace provided on an inner surface of the housing, and a connector including a connector body formed of an elastic body and compressed between the inner surface of the housing and the substrate, and a conductor buried in the connector body so as to penetrate the connector body, the connector electrically connecting the trace and a terminal of the substrate by the conductor. The housing includes a holder integrally formed therewith, the holder defining an attachment position of the connector. The holder protrudes from the inner surface of the housing in such a manner as to support the substrate and controls a degree of compression of the connector body.

Abstract: According to one embodiment, an electronic apparatus includes a housing having electric insulation properties, and a circuit element installed in the housing and including a plurality of connection terminals, wherein the housing includes an inner surface including a mounting region on which the circuit element is mounted, a plurality of adhesive filled portions in the mounting region, which are separated by a division wall in order to correspond to the connection terminals of the circuit element, and through which the connection terminals are inserted, and a plurality of traces provided on the inner surface of the housing, one ends of the traces running through the adhesive filled portions, wherein the adhesive filled portions of the housing are filled with conductive adhesive which fix the circuit element to the mounting region, and wherein the connection terminals are electrically connected to the traces by the conductive adhesive.

Abstract: According to an aspect of the present invention, there is provided a printed circuit board including: a semiconductor package including a parallelepiped body, and solder balls provided on a face of the parallelepiped body; a printed wiring board including a mounting face, the mounting face configured to mount the plurality of solder balls; a first bonding member including a first glass transition temperature, the first bonding member disposed around the parallelepiped body and configured to bond the semiconductor package and the printed wiring board; an electronic component mounted on the mounting face on an opposite side to the semiconductor package with respect to the first bonding member; and a second bonding member including a second glass transition temperature that is higher than the first glass transition temperature, the second bonding member disposed onto the mounting face to cover the electronic component.