Abstract: The present invention relates to a susceptor including a substrate including a carbon material and having one main surface on which a silicon water is to be placed, and another main surface facing the one main surface, in which an entire surface of the substrate is covered with a thin film including silicon carbide, the one main surface has an emissivity variation of 3% or less, and a ratio of an average emissivity between the one main surface and the another main surface facing the one main surface is from 1:1 to 1:0.8.

Abstract: A method of joining a silicon carbide body and a silicon carbide-silicon composite, including a step of applying an adhesive paste 3 consisting of silicon carbide powder and a binder component to either or both of a porous silicon carbide body 1 and a silicon carbide-silicon composite 2 formed by impregnating a silicon carbide body with silicon such that said porous silicon carbide body and said silicon carbide-silicon composite are caused to adhere to each other, a step of causing a volatile constituent to evaporate from said adhesive paste 3 such that a porous silicon carbide adhesion layer 3 is formed between said porous silicon carbide body and said silicon carbide-silicon composite, and a step of causing the silicon in said silicon carbide-silicon composite to permeate said adhesion layer 3 through a heat treatment after the previous step such that said adhesion layer 3 is densified.