Abstract: A through-hole electrode substrate including substrate having a first and second surface on an opposite side of first surface and through-hole passing through from first surface to second surface, inner wall of through-hole divided into first inner wall, second inner wall and third inner wall from first surface side, size of a first open end of through-hole in first surface side is smaller than a size of a second open end of the through-hole in the second surface side, an incline angle with respect to first and second surface of the third inner wall is smaller than an incline angle with respect to the first surface and the second surface of the second inner wall and the third inner wall, and a through-hole electrode arranged on the interior of the through-hole and electrically connecting wiring arranged on the first surface side and wiring arranged on the second surface side.