Abstract: An indoor unit of an air conditioner includes a covering member that is movable between a covering position where the covering member covers at least a portion of the wire passing portion and an opening position where the wire passing portion is opened, a sliding member that is movable along a sliding direction between a restricting position and a releasing position, and a first support member that has a head that supports the sliding member in the restricting position from a bottom side and a shoulder portion with a diameter that is smaller than the head, wherein the covering member has a first locking portion in which a first insertion hole that passes the shoulder portion through is formed, the first locking portion is positioned in a top side more than the sliding member, and La1>Ta1+Tb1 is satisfied.

Abstract: In a method for producing a wiring circuit board, a conductive pattern is formed using a plating resist formed by photolithography for sequentially moving one photomask in a first direction with respect to a dry film resist to be exposed a plurality of times. The conductive pattern has a conductive intermediate portion which is inclined. The one photomask has a third photo pattern. The third photo pattern includes a first photoline pattern and a second photo line pattern. A first portion of the first photoline pattern coincides with a second portion of the second photoline pattern when projected in the first direction.

Abstract: A wiring circuit board includes an insulating layer, a wire embedded in the insulating layer, and an alignment mark electrically independent from the wire and disposed in the insulating layer so as to allow a one-side surface in a thickness direction of the alignment mark to be exposed from the insulating layer. A peripheral portion of the alignment mark consists of only the insulating layer and has a thickness of 30 ?m or less.

Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.

Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.

Abstract: An imaging element mounting board for mounting an imaging element has a wire region including a first insulating layer, a metal wire disposed at one side in a thickness direction of the first insulating layer, and a second insulating layer disposed at one side in the thickness direction of the metal wire. An equivalent elastic modulus of the wire region is 5 GPa or more and 55 GPa or less.

Abstract: A wiring circuit board includes an insulating layer, a wire embedded in the insulating layer, and an alignment mark electrically independent from the wire and disposed in the insulating layer so as to allow a one-side surface in a thickness direction of the alignment mark to be exposed from the insulating layer. A peripheral portion of the alignment mark consists of only the insulating layer and has a thickness of 30 ?m or less.

Abstract: In a step of forming a conductive pattern, a photoresist is exposed a plurality of times while a fourth mask including a fourth light shielding mark and a fifth mask including a sixth light shielding mark are sequentially arranged in a longitudinal direction, and the photoresist is developed to form a plating resist, and the plating is carried out using this. In a step of exposing the plating resist, in the photoresist, an opposing portion of the fourth mask at the time of the first exposure is overlapped with the fifth mask at the time of the second exposure. A first conductive mark is formed by the first exposure of the photoresist through the fourth light shielding mark and by plating using the plating resist. A third conductive mark is formed by the second exposure of the photoresist through the fifth mask and by plating using the plating resist.

Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.

Abstract: In a method for producing a wiring circuit board, a conductive pattern is formed using a plating resist formed by photolithography for sequentially moving one photomask in a first direction with respect to a dry film resist to be exposed a plurality of times. The conductive pattern has a conductive intermediate portion which is inclined. The one photomask has a third photo pattern. The third photo pattern includes a first photoline pattern and a second photo line pattern. A first portion of the first photoline pattern coincides with a second portion of the second photoline pattern when projected in the first direction.

Abstract: A pressure-sensitive adhesive sheet-including wiring circuit board includes a wiring circuit board including a base insulating layer, a conductive layer disposed on a one-side surface in a thickness direction of the base insulating layer, and a cover insulating layer disposed on the one-side surface in the thickness direction of the base insulating layer so as to cover the conductive layer, and a pressure-sensitive adhesive sheet disposed on the surface of either one side or the other side in the thickness direction of the wiring circuit board.

Abstract: Provided is a polyamide resin composition capable of yielding highly abrasion-resistant molded article, while keeping high mechanical strength, and, a molded article using the polyamide resin composition. The polyamide resin composition contains (A) polyamide resin, (B) polyolefin wax, and (C) at least one metal salt selected from alkali metal salt and alkali earth metal salt, and the (A) polyamide resin contains (a-1) semiaromatic polyamide resin.

Abstract: An elongated wired circuit board including a plurality of wires arranged in parallel, wherein the plurality of wires each includes a first linear portion extending in a first linear direction, a second linear portion extending in a second linear direction, and a connection portion, the connection portion includes a first side, a second side, a third side, and a fourth side, length y1 and length S satisfy 0<y1<S, length y1 extending from the first corner portion reaching the first widthwise other end edge of the first linear portion, and length S extending from the first widthwise other end edge of the first linear portion of one wire, and the predetermined angle ? satisfies 0<?<1 deg.

Abstract: Provided is a resin molding that uses a resin composition capable of achieving high platability, while being imparted flame retardant by the halogen-containing flame retarder, a method for manufacturing a plated resin molding, and a method for manufacturing an antenna-equipped portable electronic device part. The resin composition comprises 100 parts by weight of a thermoplastic resin; 5 to 100 parts by weight of a halogen-containing flame retarder; and, 1 to 30 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive contains antimony, and; a content of an antimony-containing flame retarder auxiliary is 0.5 parts by weight or less per 100 parts by weight of the thermoplastic resin.

Abstract: The present invention provides compositions and methods for treating chronic pain.

Abstract: Provided is resin molded articles having large elastic modulus, and good appearance. A thermoplastic resin composition contains 80 to 120 parts by weight of a carbon fiber and 0.1 to 3.0 parts by weight of a black colorant, per 100 parts by weight of a (A) crystallizable thermoplastic resin which shows a semicrystallization time (ST (P)) of 20 to 500 seconds, wherein the semicrystallization time is measured by depolarization photometry, under conditions that a sample melting temperature is 20 to 40° C. higher than a melting point of the crystallizable thermoplastic resin, a sample melting time is 3 minutes, and an oil bath temperature for crystallization is 140° C.

Abstract: An imaging element mounting board for mounting an imaging element has a wire region including a first insulating layer, a metal wire disposed at one side in a thickness direction of the first insulating layer, and a second insulating layer disposed at one side in the thickness direction of the metal wire. An equivalent elastic modulus of the wire region is 5 GPa or more and 55 GPa or less.

Abstract: Provided is a polyamide resin composition capable of yielding highly abrasion-resistant molded article, while keeping high mechanical strength, and, a molded article using the polyamide resin composition. The polyamide resin composition contains (A) polyamide resin, (B) polyolef in wax, and (C) at least one metal salt selected from alkali metal salt and alkali earth metal salt, and the (A) polyamide resin contains (a-1) semiaromatic polyamide resin.

Abstract: Provided is a thermoplastic resin composition that allows a plated layer to be successfully formed on a surface of resin molded article obtained therefrom under a wide range of laser irradiation condition. A thermoplastic resin composition comprising a thermoplastic resin, and 1 to 30 parts by weight of a laser direct structuring additive and 0.1 to 10 parts by weight of a laser marking additive per 100 parts by weight of the thermoplastic resin, wherein the laser direct structuring additive comprises 70% by weight or more of a tin oxide.

Abstract: Provided is a resin molding that uses a resin composition capable of achieving high platability, while being imparted flame retardant by the halogen-containing flame retarder, a method for manufacturing a plated resin molding, and a method for manufacturing an antenna-equipped portable electronic device part. The resin composition comprises 100 parts by weight of a thermoplastic resin; 5 to 100 parts by weight of a halogen-containing flame retarder; and, 1 to 30 parts by weight of a laser direct structuring additive, wherein the laser direct structuring additive contains antimony, and; a content of an antimony-containing flame retarder auxiliary is 0.5 parts by weight or less per 100 parts by weight of the thermoplastic resin.