Abstract: [Problem] Provided are a lens drive module, an imaging module, an electronic device, and a lens unit that have a simple configuration and are advantageous in reducing power consumption. [Solution to Problem] The lens drive module includes: a lens unit that includes a plurality of lenses and a spacer that includes a ferromagnetic material provided between two adjacent lenses among the plurality of lenses; and a lens actuator that causes an electromagnetic force to act on the lens unit in response to energization.

Abstract: Provided is a surface-treated copper foil excellent in laser processability. The surface-treated copper foil includes a roughened surface formed by subjecting a surface to a roughening treatment, in which when measured using a three-dimensional roughness meter, the roughened surface has a surface skewness Ssk within a range of from ?0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nm?1 to less than 0.0300 nm?1.

Abstract: Provided is a surface-treated copper foil excellent in laser processability. The surface-treated copper foil includes a roughened surface formed by subjecting a surface to a roughening treatment, in which when measured using a three-dimensional roughness meter, the roughened surface has a surface skewness Ssk within a range of from ?0.300 to less than 0 and an arithmetic mean summit curvature Ssc within a range of from 0.0220 nm?1 to less than 0.0300 nm?1.

Abstract: A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 ?m or more and 0.30 ?m or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.

Abstract: A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 ?m or more and 0.30 ?m or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.

Abstract: The invention relates to an electrolytic copper alloy foil having large mechanical strength in an ordinary state and showing resistant to heat deterioration even when it is heated to 300° C. or more. That electrolytic copper alloy foil, which contains tungsten copper, preferably incorporates tungsten into copper foil as a copper alloy, has a tensile strength at ordinary temperature of 650 MPa, has a tensile strength after heat treatment at 300° C. for 1 hour of 450 MPa or more, and has a conductivity of 80% or more. Further preferably, the electrolytic copper foil has an elongation at ordinary temperature of 2.5% or more and an elongation after treatment at 300° C. for 1 hour of 3.5% or more. The electrolytic copper foil is produced by adding a thiourea compound, tungsten salt, and chloride ions to a sulfuric acid-copper sulfate electrolyte and performing electrolytic deposition.

Abstract: The invention relates to an electrolytic copper alloy foil having large mechanical strength in an ordinary state and showing resistant to heat deterioration even when it is heated to 300° C. or more. That electrolytic copper alloy foil, which contains tungsten copper, preferably incorporates tungsten into copper foil as a copper alloy, has a tensile strength at ordinary temperature of 650 MPa, has a tensile strength after heat treatment at 300° C. for 1 hour of 450 MPa or more, and has a conductivity of 80% or more. Further preferably, the electrolytic copper foil has an elongation at ordinary temperature of 2.5% or more and an elongation after treatment at 300° C. for 1 hour of 3.5% or more. The electrolytic copper foil is produced by adding a thiourea compound, tungsten salt, and chloride ions to a sulfuric acid-copper sulfate electrolyte and performing electrolytic deposition.

Abstract: Disclosed is a surface-treated copper foil, which exhibits excellent weldability when copper foils or a copper foil and an other metal are welded with each other by ultrasonic welding. Specifically disclosed is a surface-treated copper foil which is characterized in that an organic antirust coating film is formed on at least one surface of the copper foil and the reciprocal of the electric double layer capacity representing the thickness of one surface (1/C) is 0.3-0.8 cm2/?F. The organic antirust coating film is formed from a triazole compound, a dicarboxylic acid and an amine, or alternatively formed from a tetrazole compound, a dicarboxylic acid and an amine.