Abstract: In a flexible printed wiring board (1), a first electrical conduction pattern (4) prepared on the first surface (3a) on which a bare chip (2) is mounted is prepared only inside a mounting region (3c) of the bare chip. Preferably, the first electrical conduction patterns (4) are prepared so as to avoid positions opposite to test electrodes (2b) which the bare chip comprises. Thereby, in the flexible printed wiring board used for mounting the bare chip, occurrence of malfunction resulting from electrical connection with a part other than a bump of the bare chip can be certainly prevented, and reliability of various devices using the bare chip can be improved.

Abstract: In a flexible printed wiring board (1), a first electrical conduction pattern (4) prepared on the first surface (3a) on which a bare chip (2) is mounted is prepared only inside a mounting region (3c) of the bare chip. Preferably, the first electrical conduction patterns (4) are prepared so as to avoid positions opposite to test electrodes (2b) which the bare chip comprises. Thereby, in the flexible printed wiring board used for mounting the bare chip, occurrence of malfunction resulting from electrical connection with a part other than a bump of the bare chip can be certainly prevented, and reliability of various devices using the bare chip can be improved.

Abstract: The present invention makes it possible to, even when a stainless steel is adopted in a diaphragm: prevent the diaphragm and a strain sensor from exfoliating from each other; be hardly susceptible to the influence of temperature in an operating environment; not allow the sensitivity of a pressure sensor to be dominated only by the mechanical characteristic of a material constituting the diaphragm; and increase the degree of freedom in design of members constituting the pressure sensor.

Abstract: A flow rate control valve capable of eliminating an extra operation of a diaphragm spacer after a valve has become a closed state and shortening a response time is provided. It has an annular valve seat 115, a diaphragm 116 including a thin plate-shaped elastic body an outer peripheral part of which has been fixed, and a diaphragm spacer 117 located on the opposite side of the valve seat 115 with the diaphragm 116 interposed therebetween, and the annular valve seat 115, the diaphragm 116 and the diaphragm spacer 117 are coaxially disposed. And, it is structured that the annular valve seat 115 has, on its top, an inclined surface 123 inclined to the inner peripheral side, and the diaphragm 116 is displaced in a direction of the valve seat 115 and the inclined surface 123 on the top of the valve seat 115 and the diaphragm 116 abut against with no gap by pressing force of the diaphragm spacer 117.

Abstract: The present invention makes it possible to, even when a stainless steel is adopted in a diaphragm: prevent the diaphragm and a strain sensor from exfoliating from each other; be hardly susceptible to the influence of temperature in an operating environment; not allow the sensitivity of a pressure sensor to be dominated only by the mechanical characteristic of a material constituting the diaphragm; and increase the degree of freedom in design of members constituting the pressure sensor.

Abstract: A bandpass filter comprising two or more resonators arranged between two input/output terminals in a laminate substrate comprising pluralities of dielectric layers; each resonator being constituted by a resonance line and a resonance capacitance connected to one end of the resonance line; capacitance electrodes forming said resonance capacitances and said resonance lines being arranged on different dielectric layers, via a planar ground electrode covering the entire structural portion of the bandpass filter when viewed in a lamination direction; and in each of the resonators connected to said two input/output terminals, the junctions of said input/output terminals to said paths between said resonance lines and said resonance capacitances being closer to said resonance capacitances than said resonance lines in a lamination direction.

Abstract: A flow rate control valve capable of eliminating an extra operation of a diaphragm spacer after a valve has become a closed state and shortening a response time is provided. It has an annular valve seat 115, a diaphragm 116 including a thin plate-shaped elastic body an outer peripheral part of which has been fixed, and a diaphragm spacer 117 located on the opposite side of the valve seat 115 with the diaphragm 116 interposed therebetween, and the annular valve seat 115, the diaphragm 116 and the diaphragm spacer 117 are coaxially disposed. And, it is structured that the annular valve seat 115 has, on its top, an inclined surface 123 inclined to the inner peripheral side, and the diaphragm 116 is displaced in a direction of the valve seat 115 and the inclined surface 123 on the top of the valve seat 115 and the diaphragm 116 abut against with no gap by pressing force of the diaphragm spacer 117.

Abstract: A bandpass filter comprising two or more resonators arranged between two input/output terminals in a laminate substrate comprising pluralities of dielectric layers; each resonator being constituted by a resonance line and a resonance capacitance connected to one end of the resonance line; capacitance electrodes forming said resonance capacitances and said resonance lines being arranged on different dielectric layers, via a planar ground electrode covering the entire structural portion of the bandpass filter when viewed in a lamination direction; and in each of the resonators connected to said two input/output terminals, the junctions of said input/output terminals to said paths between said resonance lines and said resonance capacitances being closer to said resonance capacitances than said resonance lines in a lamination direction.

Abstract: In a semiconductor device comprising a ceramic substrate, a surface mount component, and sealing resin and obtained by division into pieces, the ceramic substrate is composed of a multiple piece substrate provided with dividing grooves for the division into pieces on both front and rear surfaces in advance, a plurality of the surface mount components are mounted on the multiple piece substrate and sealed collectively by the sealing resin, and the substrate is divided along the dividing grooves. Further, when the shortest distance from an end on the front surface of the ceramic substrate to an end of the surface mount component is set to “a” ?m, a thickness of the ceramic substrate is set to “b” ?m, and sum of depths of the dividing grooves on the front and rear surfaces of the ceramic substrate is set to “c” ?m, a relationship of a?269×c/b+151 is established.

Abstract: In a semiconductor device comprising a ceramic substrate, a surface mount component, and sealing resin and obtained by division into pieces, the ceramic substrate is composed of a multiple piece substrate provided with dividing grooves for the division into pieces on both front and rear surfaces in advance, a plurality of the surface mount components are mounted on the multiple piece substrate and sealed collectively by the sealing resin, and the substrate is divided along the dividing grooves. Further, when the shortest distance from an end on the front surface of the ceramic substrate to an end of the surface mount component is set to “a” ?m, a thickness of the ceramic substrate is set to “b” ?m, and sum of depths of the dividing grooves on the front and rear surfaces of the ceramic substrate is set to “c” ?m, a relationship of a?269×c/b+151 is established.