Patents by Inventor Takahiro Umezawa

Takahiro Umezawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088058
    Abstract: A field effect transistor comprising: a non-doped diamond layer which has a hydrogen-terminated surface; first and second p+diamond layers which are formed on the non-doped diamond layer and sandwich a hydrogen-terminated region; a source electrode which is formed on the first p+diamond layer and is made of metal; a drain electrode which is formed on the second p+diamond layer and is made of metal; an insulating layer which is formed on the hydrogen-terminated region of the non-doped diamond layer; and a gate electrode which is formed on the insulating layer, a mutual conductance being equal to or higher than 0.5 mS/mm at room temperatures, after an X-ray is applied for an amount of 5 Mgy.
    Type: Application
    Filed: December 28, 2021
    Publication date: March 14, 2024
    Applicant: OOKUMA DIAMOND DEVICE Inc.
    Inventors: Junichi KANEKO, Hitoshi KOIZUMI, Takahiro YAMAGUCHI, Naohisa HOSHIKAWA, Hitoshi UMEZAWA, Hideaki YAMADA, Shinya OHMAGARI
  • Publication number: 20120200482
    Abstract: A liquid crystal display panel 100 has: a first substrate 11, having an active region AA having pixel electrodes and TFTs, and a gate driver region GDR provided on the outside of the active region AA; and a second substrate 21, disposed opposing the first substrate 11 with a liquid crystal layer 30 interposed therebetween, and having an opposite electrode 23. The opposite electrode 23 opposes the gate driver region GDR with the liquid crystal layer 30 interposed therebetween, and an insulating resin layer 26 is formed on the region of the opposite electrode 23 so that the insulating resin layer 26 opposes the gate driver region GDR. Thus, short-circuit failure between the driver region of the TFT substrate and the opposite electrode is eliminated.
    Type: Application
    Filed: September 30, 2010
    Publication date: August 9, 2012
    Applicant: SHARP KABUSHIKI KAISHA
    Inventors: Tetsuo Fukaya, Yuhichi Saitoh, Hiroyuki Moriwaki, Yasuhiro Nakatake, Yukio kurozumi, Masato Kakuta, Masahiko Nakamizo, Takahiro Umezawa
  • Publication number: 20110234956
    Abstract: A display panel substrate in which a short circuit between electrode terminals is prevented, and a display panel. The display panel substrate includes an electrode terminal (121) for connecting an external circuit board, a drawing line (122) electrically continuous to the electrode terminal (121), an interlayer insulating film (209) covering the drawing line (122), a conductive material film (210) superimposed on the electrode terminal (121) and electrically continuous to the electrode terminal (211), and a conductive material film (211) superimposed on the drawing line 122 while interposing the interlayer insulating film (209) and electrically continuous to the drawing line (122). The conductive material film (210) superimposed on the electrode terminal (121) and the conductive material film (211) superimposed on the drawing line 122 while interposing the interlayer insulating film (209) are separate in a peripheral portion of the interlayer insulating film (209).
    Type: Application
    Filed: November 13, 2009
    Publication date: September 29, 2011
    Applicant: SHARP KABUSHIKI KAISHA
    Inventor: Takahiro Umezawa
  • Publication number: 20110222001
    Abstract: Provided are a display panel substrate and a display panel which are capable of preventing short-circuiting between wiring electrode terminals. The substrate includes wiring electrode terminals (121) for connecting an external wiring substrate; lead wires (122) electrically connected to the wiring electrode terminals (121); an interlayer insulating film (209) covering the lead wires (122); conductive material films (210) formed to overlap the wiring electrode terminals (121) and electrically connected to the wiring electrode terminals (121); and conductive material films (211) formed to overlap the lead wires (122) through the interlayer insulating film (209) and electrically connected to the lead wires (122).
    Type: Application
    Filed: November 13, 2009
    Publication date: September 15, 2011
    Applicant: Sharp Kabushiki Kaisha
    Inventor: Takahiro Umezawa