Patents by Inventor Takahisa HIRASWA

Takahisa HIRASWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MOTOR COIL SUBSTRATE, MOTOR, AND METHOD FOR MANUFACTURING MOTOR COIL SUBSTRATE
    Publication number: 20200083769
    Abstract: A coil substrate for a motor includes a flexible substrate, and multiple coils formed on a surface of the flexible substrate. Each of the coils has a wiring having first wiring portions and second wiring portions extending from the first wirings respectively and is formed such that the first wiring portions extend parallel with respect to each other and that the second wiring portions extend not parallel to the first wirings, and the flexible substrate is formed to be formed around a magnet of a motor such that the first wiring portions form an angle that is substantially perpendicular to a rotation direction of the motor.
    Type: Application
    Filed: September 11, 2019
    Publication date: March 12, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASWA, Tetsuya MURAKI, Takayuki FURUNO