Patents by Inventor Takahisa Iida

Takahisa Iida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070025064
    Abstract: The present invention provides a solid electrolytic capacitor with low leakage current. In the solid electrolytic capacitor, an anode has an anode lead made of tantalum, a surface layer made of niobium formed on the anode lead, and a rectangular block shaped base body having a porous sintered body made from niobium particles, and the anode lead is partially embedded in the base body. Onto the anode, an oxide layer made of niobium oxide, an electrically conductive polymer layer, and a cathode laminated with a first electrically conductive layer and a second electrically conductive layer are sequentially laminated. Onto the top surface of an area surrounding the cathode, a cathode terminal is formed through an electrically conductive adhesive layer. Also, an anode terminal is connected onto an edge of the anode lead.
    Type: Application
    Filed: July 10, 2006
    Publication date: February 1, 2007
    Inventors: Takahisa Iida, Mutsumi Yano, Mamoru Kimoto
  • Publication number: 20060268492
    Abstract: An anode includes a base body of a sintered porous material of niobium particles, a surface layer made of crystalline niobium oxide formed on the base body, and an anode lead having partly buried in base body 1a. A dielectric layer containing amorphous niobium oxide is formed by anodic oxidation on the cathode. An electrolyte layer made of polypyrrole is formed on the dielectric layer and a cathode is formed on the electrolyte layer. A conductive adhesive layer and cathode terminal are formed on an upper surface of the cathode. The anode lead exposed from the base body is connected to an anode terminal by welding. In addition, a mold resin is formed to cover the second conductive layer, the cathode terminal and the anode terminal so as to expose cathode terminal and an end of anode terminal.
    Type: Application
    Filed: April 4, 2006
    Publication date: November 30, 2006
    Applicant: Sanyo Electric Co., Ltd
    Inventors: Mutsumi Yano, Koichi Nishimura, Takahisa Iida, Mamoru Kimoto
  • Patent number: 7126813
    Abstract: A solid electrolytic capacitor comprising: an anode of niobium or niobium alloy; and a dielectric layer formed by anodizing the anode; wherein the anode comprises a surface layer of niobium silicide formed at an interface between the dielectric layer and itself, and silicon is contained in the dielectric layer.
    Type: Grant
    Filed: March 13, 2006
    Date of Patent: October 24, 2006
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Takahisa Iida, Mutsumi Yano, Mamoru Kimoto
  • Publication number: 20060221549
    Abstract: In this solid electrolytic capacitor, a plate-shaped anode having a porous sintered body, a dielectric layer and an electrolyte layer of polypyrrole are formed in this order for covering one part of an anode lead. An intermediate layer of aminopropyltriethoxysilane (APTES) is formed for covering the electrolyte layer. A cathode having a first conductive layer containing graphite particles and a second conductive layer containing silver particles is formed for covering the intermediate layer. The cathode and a cathode terminal are connected by a conductive adhesive layer. The anode lead and the anode terminal are connected by welding. Further, a mold outer resin is formed to allow one end of the cathode terminal and one end of the anode terminal to project therefrom.
    Type: Application
    Filed: January 23, 2006
    Publication date: October 5, 2006
    Applicant: SANYO Electric Co., Ltd.
    Inventors: Takahisa Iida, Mutsumi Yano, Mamoru Kimoto
  • Publication number: 20060221554
    Abstract: In this solid electrolytic capacitor, a plate-shaped anode having a porous sintered body is formed covering one part of an anode lead. A dielectric layer is formed covering the anode. An electrolyte layer of tantalum carbide is formed covering the dielectric layer. A cathode is formed covering the electrolyte layer. A conductive adhesive layer is formed on the upper surface of the cathode, and the cathode and a cathode terminal are connected by the conductive adhesive layer. An anode terminal is connected by welding the anode terminal on the anode lead projecting from the anode. Further, a mold outer resin is formed around the second conductive layer, the cathode terminal and the anode terminal.
    Type: Application
    Filed: February 1, 2006
    Publication date: October 5, 2006
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Kazuhiro Takatani, Takahisa Iida, Mamoru Kimoto
  • Publication number: 20060215353
    Abstract: A solid electrolytic capacitor comprising: an anode of niobium or niobium alloy; and a dielectric layer formed by anodizing the anode; wherein the anode comprises a surface layer of niobium silicide formed at an interface between the dielectric layer and itself, and silicon is contained in the dielectric layer.
    Type: Application
    Filed: March 13, 2006
    Publication date: September 28, 2006
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Takahisa Iida, Mutsumi Yano, Mamoru Kimoto
  • Publication number: 20060209496
    Abstract: A solid electrolytic capacitor comprising: an anode of valve metals or of an alloy of which main component is valve metals; a dielectric layer formed by anodizing said anode; an electrolyte layer formed on said dielectric layer; and a cathode formed on said electrolyte layer; wherein said cathode comprises a silver layer using silver and sulfur and/or sulfur compound is contained in said silver layer.
    Type: Application
    Filed: March 9, 2006
    Publication date: September 21, 2006
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Kazuhiro Takatani, Takahisa Iida, Mamoru Kimoto
  • Publication number: 20060187618
    Abstract: A solid electrolytic capacitor comprising: an anode of valve metals or alloy of which main component is valve metals; a dielectric layer formed by anodizing the anode; and a cathode formed on the dielectric layer, wherein the dielectric layer comprises a first dielectric layer located on the anode side and a second dielectric layer formed on the first dielectric layer, and oxygen concentration of the second dielectric layer is decreased from the first dielectric layer side toward the cathode side.
    Type: Application
    Filed: February 17, 2006
    Publication date: August 24, 2006
    Applicant: SANYO ELECTRIC CO., LTD.
    Inventors: Takahisa IIda, Mutsumi Yano, Mamoru Kimoto, Yasumi Kobayashi, Hiroshi Nonoue
  • Publication number: 20020185221
    Abstract: A method for manufacturing a laminated board having high quality with high productivity is disclosed. In this manufacturing method, a prepreg 2 that has been supplied from a prepreg supply section 1 is fed vertically using feed rolls. Further, metal foils 4 are supplied from a metal foil supply section 3 using feed rolls. The prepreg 2 and the metal foil 4 are heated at a heating section 7, and then they pass through between the rolls 5 so that the metal foils are bonded to the prepreg. Thus obtained laminated board is fed to a rolling section 6 using feed rolls, and the laminated is continuously rolled up at the rolling section 6, thereby continuously manufacturing the laminated board.
    Type: Application
    Filed: May 24, 2002
    Publication date: December 12, 2002
    Applicant: Sumitomo Bakelite Company Limited
    Inventor: Takahisa Iida
  • Patent number: 6124220
    Abstract: A laminated board comprising an intermediate layer and two surface layers formed thereon, in which board the intermediate layer comprises a central layer made of a nonwoven glass fiber fabric impregnated with a resin composition containing a thermosetting resin and an inorganic filler and upper and lower layers formed on the central layer, each being made of said resin composition containing a thermosetting resin and an inorganic filler, and the two surface layers formed on the intermediate layer are made of a thermosetting resin-impregnated fiber substrate; and a process for production of the laminated board.
    Type: Grant
    Filed: September 17, 1996
    Date of Patent: September 26, 2000
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Takahiro Nakata, Takahisa Iida, Takashi Yamaguchi, Toshihide Kanazawa