Abstract: A composite including: (I) a fiber-reinforced composite material; and (II) a metal member joined and fixed to the fiber-reinforced composite material by welding. The fiber-reinforced composite material is composed of reinforcing fibers and a resin composition. The resin composition contains (A) a polypropylene-based resin and (B) a modified polyolefin-based resin. The polypropylene-based resin has a tensile modulus of not less than 1 GPa. The modified polyolefin-based resin is a modified polyolefin resin modified with at least one kind of monomer which is selected from carboxylic acid group-containing vinyl monomers and epoxy group-containing vinyl monomers. A weight ratio between (A) and (B) in the resin composition is 90:10 to 40:60.

Abstract: A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 ?m to 10 ?m, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under the conditions of a temperature range of ?50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.

Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

Abstract: A molded resin body for surface-mounted light-emitting device has cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 ?m to 10 ?m, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMS) under the conditions of a temperature range of ?50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.

Abstract: A polyether ether ketone that is superior in mold flow performance, mechanical physical properties, and thermal stability is provided. A polyether ether ketone having a repeating unit represented by the formula: —Ar—C(?O)—Ar—O—Ar?—O— (wherein, Ar and Ar? represent a substituted or unsubstituted phenylene group), the polyether ether ketone including: (A) a polymerization component having a molecular weight of not lower than 5,000 and lower than 2,000,000; and (B) a polymerization component having a molecular weight of not lower than 1,000 and lower than 5,000, wherein: the weight ratio of (A):(B) is 60:40 to 97:3; the content of (C) a polymerization component having a molecular weight of not lower than 100 and lower than 1,000 is from 0 and less than 0.

Abstract: The present invention aims to provide a curable resin composition which gives a cured product having a low linear expansion coefficient. The curable resin composition of the present invention contains, as essential components, (A) an organic compound having at least two carbon-carbon double bonds reactive with SiH groups per molecule, (B) a compound containing at least two SiH groups per molecule, (C) a hydrosilylation catalyst, (D) a silicone compound having at least one carbon-carbon double bond reactive with a SiH group per molecule, and (E) an inorganic filler.

Abstract: The invention provides a carbon fiber-reinforced composite material including reinforcing fibers which are continuous carbon fibers in the form of a unidirectional (UD) material, a woven fabric, or a knitted fabric, and a matrix resin including a modified polyolefin resin, thereby achieving better adhesion and mechanical strength. The matrix resin forms a polyphase structure having a sea-island structure which has an average island (independent phase) diameter of not greater than 0.5 ?m. The composite material includes as a matrix resin a modified polyolefin resin obtained by, for example, graft-modifying a polyolefin resin with a monomer that contains an ethylenic double bond and a polar group in the same molecule; and includes as reinforcing fibers continuous carbon fibers.

Abstract: A polyether ether ketone that is superior in mold flow performance, mechanical physical properties, and thermal stability is provided. A polyether ether ketone having a repeating unit represented by the formula: —Ar—C(?O)—Ar—O—Ar?—O— (wherein, Ar and Ar? represent a substituted or unsubstituted phenylene group), the polyether ether ketone including: (A) a polymerization component having a molecular weight of not lower than 5,000 and lower than 2,000,000; and (B) a polymerization component having a molecular weight of not lower than 1,000 and lower than 5,000, wherein: the weight ratio of (A):(B) is 60:40 to 97:3; the content of (C) a polymerization component having a molecular weight of not lower than 100 and lower than 1,000 is from 0 and less than 0.

Abstract: A silicon-containing polymer comprising a structural unit of the formula (1): ##STR1## wherein R.sup.1 and R.sup.2 are the same or different and represent a monovalent organic group having 1 to 20 carbon atoms, and the benzene ring may have a substituent, which has good heat resistance.

Abstract: A curable composition providing a cured product having a silicon type interpenetrating polymer network, which comprises (A) a silsesquioxane ladder polymer, (B) a silicon compound having at least two SiH groups per molecule, (C) a silicon compound having at least two vinylsilyl groups per molecule and (D) a neutral platinum catalyst; and a process for producing a molded article comprising heating the curable composition under a controlled temperature for synchronously causing hydrolysis and condensation of the alkoxysilyl group and/or silanol group and hydrosilylation.

Abstract: An organic polymer having at least two hydrosilyl groups in a molecule is mixed with an organic polymer having at least one alkenyl group in a molecule and a hydrosilylation catalyst to give a composition. Such composition is rapidly curable, has good depth curability and gives a cured material having good mechanical properties.

Abstract: A curable composition which comprises(C) a non-polymeric organic curing agent having at least two hydrosilyl groups in a molecule,(D) an organic polymer having at least one alkenyl group in a molecule, and(E) a hydrosilylation catalysthas rapid curability and good depth curability, and gives a homogeneous cured material having good mechanical properties.

Abstract: A curable composition containing (A) a compound having at least two Si--H bonds, (B) a silicon compound having at least two substituents bonded to the silicon atom thereof, wherein the substituents each have an olefin bond, (C) a neutral platinum catalyst, (D) a silicon compound having at least two alkoxy groups bonded to the silicon atom thereof, and (E) a catalyst for silanol condensation.

Abstract: A curable composition which comprises (C) a non-polymeric organic curing agent having at least two hydrosilyl groups in a molecule, (D) an organic polymer having at least one alkenyl group in a molecule, and (E) a hydrosilylation catalyst has rapid curability and good depth curability, and gives a homogeneous cured material having good mechanical properties.

Abstract: A condensed bicyclic disilanylene-acetylene compound having the following formula: ##STR1## wherein R and R' are independently a univalent hydrocarbon group having 1 to 20 carbon atoms. The compound has a high degree of .sigma.-.pi. electron delocalization.

Abstract: 1,2-Dichlorodisilanes are reacted with organometallic derivatives of 1,2-diethynyldisilane to yield the copolymer:--C.tbd.C--SiR.sub.2 SiR.sub.2 --C.tbd.C--SiR'.sub.2 SiR'.sub.2 --.sub.nwhere R and R' are alkyl or aryl groups having carbon atoms numbering less than ten.

Abstract: An isobutylene polymer having at least one silicon-containing group cross-linkable by the formation of a siloxane bond. The isobutylene polymer is a novel polymer curable at ordinary temperature and has not only excellent weatherability, water-resistance and heat-resistance but also excellent electric isolation and gas impermeability.

Abstract: 1,2-dichlorodisilanes are reacted with the diGrignard reagents of 1,2-diethynyldisilane to yield the eight-membered ring disilanylene acetylenes of the formula: ##STR1## where R=an alkyl group, and R'=an alkyl group or an aromatic group.