Patents by Inventor Takahisa Ohtsuji

Takahisa Ohtsuji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8848387
    Abstract: The present invention provides a shield case having electrical conductivity and being mountable on a circuit board. The shield case includes a first surface adapted to be placed on the circuit board and a second surface provided continuously with the first surface and extending at an angle or at a right angle with respect to the first surface. A first recess of generally U-shape is provided in a boundary area of the first surface with the second surface and including first and second end portions. A pair of second recesses is provided in a boundary area of the second surface with the first surface and communicating with the first and second end portions of the first recess. The shield case also includes a pad, being defined by the first and second recesses and connectable by soldering to an electrode of the circuit board.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: September 30, 2014
    Assignee: Hosiden Corporation
    Inventors: Takayuki Nagata, Takahisa Ohtsuji
  • Patent number: 8503191
    Abstract: The invention provides a shield cover adapted to cover at least a first electronic component mounted on a first surface of a circuit board. The first electronic component has a metal shell or has a ground/earth terminal on a lateral surface thereof. The shield cover has a contact portion being elastically contactable with a lateral surface of the metal shell or the ground/earth terminal of the first electronic component.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: August 6, 2013
    Assignee: Hosiden Corporation
    Inventors: Takayuki Nagata, Takahisa Ohtsuji
  • Patent number: 8241063
    Abstract: The invention provides a connector including: a shield case having first and second slots; first and second bodies, inserted into the case and combined in an insertion direction; first and second contacts embedded in the first body at spaced intervals in a width direction; and third and fourth contacts embedded in the second body at spaced intervals in the width direction and at a different height from that of the first and second contacts. The first and third contacts are partly received in the first slot. The second and fourth contacts are partly received in the second slot. The case has a partition to partition an internal space thereof into the first and second slots, and a lock piece provided at a rear portion of the case. The first and second bodies are sandwiched between the partition and the lock piece.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: August 14, 2012
    Assignee: Hosiden Corporation
    Inventors: Takayuki Nagata, Takahisa Ohtsuji
  • Patent number: 8241064
    Abstract: The invention provide a connector including a body having an insulating property, a contact provided in the body, a tuboid shield case adapted to receive the body, and a reinforcing member. The shield case includes a bent portion being a portion of the shield case bent inward and extending in an insertion direction of the body, and a depression being provided on a backside of the bent portion and extending in the insertion direction. The reinforcing member is configured to fit in at least a part of the depression.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: August 14, 2012
    Assignee: Hosiden Corporation
    Inventors: Takahisa Ohtsuji, Takayuki Nagata
  • Patent number: 8174847
    Abstract: A shield case of the present invention include a first case; and a second case, combinable with the first case. The first and second cases are provided with a plurality of abutting parts. The abutting parts abut on all respective surfaces of the component mounting board and hold the component mounting board in suspension in a state where the first and second cases are combined.
    Type: Grant
    Filed: February 20, 2009
    Date of Patent: May 8, 2012
    Assignee: Hosiden Corporation
    Inventors: Takahisa Ohtsuji, Takayuki Nagata
  • Publication number: 20110237127
    Abstract: The invention provide a connector including a body having an insulating property, a contact provided in the body, a tuboid shield case adapted to receive the body, and a reinforcing member. The shield case includes a bent portion being a portion of the shield case bent inward and extending in an insertion direction of the body, and a depression being provided on a backside of the bent portion and extending in the insertion direction. The reinforcing member is configured to fit in at least a part of the depression.
    Type: Application
    Filed: March 9, 2011
    Publication date: September 29, 2011
    Applicant: HOSIDEN CORPORATION
    Inventors: Takahisa OHTSUJI, Takayuki NAGATA
  • Publication number: 20110235293
    Abstract: The present invention provides a shield case having electrical conductivity and being mountable on a circuit board. The shield case includes a first surface adapted to be placed on the circuit board and a second surface provided continuously with the first surface and extending at an angle or at a right angle with respect to the first surface. A first recess of generally U-shape is provided in a boundary area of the first surface with the second surface and including first and second end portions. A pair of second recesses is provided in a boundary area of the second surface with the first surface and communicating with the first and second end portions of the first recess. The shield case also includes a pad, being defined by the first and second recesses and connectable by soldering to an electrode of the circuit board.
    Type: Application
    Filed: March 9, 2011
    Publication date: September 29, 2011
    Applicant: HOSIDEN CORPORATION
    Inventors: Takayuki Nagata, Takahisa Ohtsuji
  • Publication number: 20110237107
    Abstract: The invention provides a connector including: a shield case having first and second slots; first and second bodies, inserted into the case and combined in an insertion direction; first and second contacts embedded in the first body at spaced intervals in a width direction; and third and fourth contacts embedded in the second body at spaced intervals in the width direction and at a different height from that of the first and second contacts. The first and third contacts are partly received in the first slot. The second and fourth contacts are partly received in the second slot. The case has a partition to partition an internal space thereof into the first and second slots, and a lock piece provided at a rear portion of the case. The first and second bodies are sandwiched between the partition and the lock piece.
    Type: Application
    Filed: March 9, 2011
    Publication date: September 29, 2011
    Applicant: HOSIDEN CORPORATION
    Inventors: Takayuki NAGATA, Takahisa OHTSUJI
  • Publication number: 20110085317
    Abstract: The invention provides a shield cover adapted to cover at least a first electronic component mounted on a first surface of a circuit board. The first electronic component has a metal shell or has a ground/earth terminal on a lateral surface thereof. The shield cover has a contact portion being elastically contactable with a lateral surface of the metal shell or the ground/earth terminal of the first electronic component.
    Type: Application
    Filed: August 23, 2010
    Publication date: April 14, 2011
    Applicant: HOSIDEN CORPORATION
    Inventors: Takayuki NAGATA, Takahisa Ohtsuji
  • Patent number: 7780458
    Abstract: A cable assembly includes a cable having a plurality of signal lines; a plug portion connectable to a connection target; a circuit board, a first end portion of the circuit board being provided with a plurality of connection portions that are respectively connectable by soldering to the signal lines of the cable, and a second end portion of the circuit board being connectable to the plug portion; and a holder for holding the circuit board. The holder is provided with a plurality of signal line guide grooves for positioning and fixing the signal lines with respect to the connection portions of the circuit board.
    Type: Grant
    Filed: May 23, 2008
    Date of Patent: August 24, 2010
    Assignee: Hosiden Corporation
    Inventors: Takayuki Nagata, Takahisa Ohtsuji
  • Publication number: 20090257213
    Abstract: A shield case of the present invention include a first case; and a second case, combinable with the first case. The first and second cases are provided with a plurality of abutting parts. The abutting parts abut on all respective surfaces of the component mounting board and hold the component mounting board in suspension in a state where the first and second cases are combined.
    Type: Application
    Filed: February 20, 2009
    Publication date: October 15, 2009
    Applicant: HOSIDEN CORPORATION
    Inventors: Takahisa OHTSUJI, Takayuki Nagata
  • Patent number: D613249
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: April 6, 2010
    Assignee: Hosiden Corporation
    Inventors: Takayuki Nagata, Takahisa Ohtsuji
  • Patent number: D628537
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: December 7, 2010
    Assignee: Hosiden Corporation
    Inventors: Takayuki Nagata, Takahisa Ohtsuji
  • Patent number: D635927
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: April 12, 2011
    Assignee: Hosiden Corporation
    Inventors: Takayuki Nagata, Takahisa Ohtsuji
  • Patent number: D635928
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: April 12, 2011
    Assignee: Hosiden Corporation
    Inventors: Takayuki Nagata, Takahisa Ohtsuji
  • Patent number: D638366
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: May 24, 2011
    Assignee: Hosiden Corporation
    Inventors: Takahisa Ohtsuji, Takayuki Nagata
  • Patent number: D654028
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: February 14, 2012
    Assignee: Hosiden Corporation
    Inventors: Takahisa Ohtsuji, Daisuke Sasaki
  • Patent number: D654877
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: February 28, 2012
    Assignee: Hosiden Corporation
    Inventor: Takahisa Ohtsuji
  • Patent number: D665357
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: August 14, 2012
    Assignee: Hosiden Corporation
    Inventor: Takahisa Ohtsuji
  • Patent number: D668616
    Type: Grant
    Filed: April 12, 2012
    Date of Patent: October 9, 2012
    Assignee: Hosiden Corporation
    Inventor: Takahisa Ohtsuji