Patents by Inventor Takahisa Oonami

Takahisa Oonami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate and a method for polishing a substrate
    Patent number: 7553768
    Abstract: A substrate having flatness of less than 230 nmPV and surface roughness at RMS of less than 0.20 nm. is obtained by a method comprising: a process of polishing an object to be polished with a polishing pad comprising at least one layer having compressibility of 5% or below in a base layer of the polishing pad.
    Type: Grant
    Filed: April 6, 2006
    Date of Patent: June 30, 2009
    Assignee: Ohara Inc.
    Inventors: Kazuyoshi Nakamura, Toshihide Nakajima, Kousuke Nakajima, Takahisa Oonami
  • Substrate and a method for polishing a substrate
    Publication number: 20060226124
    Abstract: A substrate having flatness of less than 230 nmPV and surface roughness at RMS of less than 0.20 nm. is obtained by a method comprising: a process of polishing an object to be polished with a polishing pad comprising at least one layer having compressibility of 5% or below in a base layer of the polishing pad.
    Type: Application
    Filed: April 6, 2006
    Publication date: October 12, 2006
    Applicant: OHARA INC.
    Inventors: Kazuyoshi Nakamura, Toshihide Nakajima, Kousuke Nakajima, Takahisa Oonami