Abstract: A semiconductor device 10a includes a normal circuit 11 and a voltage fluctuation detection circuit 12a connected to a power supply 100 in common with the normal circuit 11. The voltage fluctuation detection circuit 12a includes an inverting amplifier 13a, a switching element 14, which is connected between input and output terminals of the inverting amplifier 13a, and a capacitance element 15 connected to the input terminal of the inverting amplifier 13a. After the normal circuit 11 and the switching element 14 are set to an operating state and ON state, respectively, when the switching element 14 is set to OFF state at an arbitrary time, charge corresponding to a power supply voltage Vc0 at that time accumulates in the capacitance element 15.

Abstract: A semiconductor device 10a includes a normal circuit 11 and a voltage fluctuation detection circuit 12a connected to a power supply 100 in common with the normal circuit 11. The voltage fluctuation detection circuit 12a includes an inverting amplifier 13a, a switching element 14, which is connected between input and output terminals of the inverting amplifier 13a, and a capacitance element 15 connected to the input terminal of the inverting amplifier 13a. After the normal circuit 11 and the switching element 14 are set to an operating state and ON state, respectively, when the switching element 14 is set to OFF state at an arbitrary time, charge corresponding to a power supply voltage Vc0 at that time accumulates in the capacitance element 15.

Abstract: A semiconductor integrated circuit includes a wiring capable of connecting a plurality of chips on a wafer and has a configuration which is capable of cutting the wiring electrically and which allows all the chips to be tested at one time. Specifically, an exclusive test circuit region capable of being shared for testing the plurality of chips is formed on the wafer, and a test circuit is removed from each chip. Terminals of the chips and a terminal of the test circuit are connected through a wiring on the wafer or a device outside the wafer to enable a general test to be performed in burn-in.

Abstract: An improved compressor that is designed to minimize shock and vibration during start-up includes a plurality of pistons, each of which is positioned for movement within a cylinder in order to compress a gas, and conventional motive structure for driving the pistons. Advantageously, the compressor includes a sensor for sensing, from a condition that exists within the compressor, when the compressor is in a start-up phase. The sensor is designed to be operative regardless of the position of the pistons during start-up. Pressure relief structure, responsive to said sensor, is provided for relieving pressure in at least one of the cylinders when the sensor indicates that the compressor is in the start-up phase. This minimizes shock and vibration during the start-up.