Abstract: There is provided a mounting apparatus capable of forming dicing tapes in the process of feeding-out a strip material, and sticking the dicing tape to a ring frame to fix a semiconductor wafer. The mounting apparatus 10 sticks the dicing tape to the ring frame RF to fix the semiconductor wafer to the ring frame in a state that the ring frame RF and the semiconductor wafer W are disposed on a table 11. The mounting apparatus 10 includes a pre-cut means 13 for forming a cut L in a state of half cut in a film FL of a strip material A to form a dicing tape T in the process of feeding out the strip material A and a sticking means 34 for peeling off the dicing tape from a base sheet S to stick the dicing tape to the ring frame RF.

Abstract: A sheet peeling apparatus 10 includes: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a tape sticking means 14 for sticking a peeling tape T to the adhesive sheet S; a pulling means 13 for pulling the peeling tape T; a peeling assisting means 15 including an endless member 45 which is positioned on the adhesive sheet S, and wound on a guide member 41; and a sandwiching means 16 for sandwiching the adhesive sheet S between the endless member 45 and the sandwiching means 16. In the sheet peeling apparatus 10, the adhesive sheet S is peeled off due to the relative movement of the pulling means 13 and the supporting means 11 in a state that the adhesive sheet S is sandwiched between the peeling assisting means 15 and the sandwiching means 16.

Abstract: A sheet peeling apparatus 10 includes: a holding means 11 for holding a wafer W on which an adhesive sheet S is stuck; a sticking means 16 for sticking a peeling tape PT on the adhesion sheet S; and a peeling means 15 for peeling off the adhesive sheet S from the wafer W through the peeling tape PT. The peeling means 15 has first and second rollers 31, 32 between which the peeling tape PT and the adhesive sheet S may be pinched. The first roller 31 is provided such that a peeled section of the adhesive sheet S and an unpeeled section of the adhesive sheet S are bendable so as to be opposed to each other. The first roller 31 is displaced in a direction toward and away from the wafer W through a displacing means 30, and provided such that the peeling angle ? between the peeling tape PT and/or the adhesive sheet S and the wafer W may be adjusted.

Abstract: A sheet peeling apparatus 10 includes: a supporting means 11 for supporting a semiconductor wafer W stuck with an adhesive sheet S; a tape sticking means 14 for sticking a peeling tape T to the adhesive sheet S; a pulling means 13 for pulling the peeling tape T; a peeling assisting means 15 including an endless member 45 which is positioned on the adhesive sheet S, and wound on a guide member 41; and a sandwiching means 16 for sandwiching the adhesive sheet S between the endless member 45 and the sandwiching means 16. In the sheet peeling apparatus 10, the adhesive sheet S is peeled off due to the relative movement of the pulling means 13 and the supporting means 11 in a state that the adhesive sheet S is sandwiched between the peeling assisting means 15 and the sandwiching means 16.

Abstract: A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit provided with a supporting face for the semiconductor wafer W, and a multi joint robot 12 for transferring the supporting unit 11. The supporting face includes an adhesive sheet S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1 through T3 can be performed through sticking and peeling operation between the adhesive sheet S and the semiconductor wafer.

Abstract: A tape sticking apparatus includes a feed-out device for feeding out a raw sheet in which a strip-shaped tape base material is temporarily stuck on one surface of a strip-shaped release liner. A cutting device is configured to form a closed-loop-shaped cut-line on the tape base material to form a sticking tape. The apparatus further includes a peeling device for peeling the sticking tape from the release liner, and a sticking device for sticking the sticking tape to a workpiece. A collecting device collects the raw sheet after being peeled off the sticking tape by the peeling device.

Abstract: A peeling apparatus 10 includes a peeling table 11 supporting a wafer W on which a sheet S is stuck and a sheet peeling unit 12 disposed above the peeling table 11, in which sheet S can be peeled off with relative movement of the sheet peeling unit 12 and the peeling table 11. The peeling apparatus 10 includes a support roll 20 of peeling tape PT, first and second rolls 30, 31 bonding the peeling tape PT to the sheet S surface, and a winding roll 21 of the peeling tape PT. Peeling-off is performed in a state of forming an initial peeling angle a1 such that a peeling tape PT is folded in an aperture C formed between the second roll 31 and the sheet S, and afterwards the sheet S is peeled off at subsequent peeling angle a2 corresponding to a diameter of the second roll 31.

Abstract: A wafer W is supported on the rear surface side thereof by a ring frame R by means of a dicing tape T, and a protection tape H is stuck on the front surface side the wafer W. A suction unit 12 includes a table 16 having a suction face 15 in the upper face. The suction face 15 sucks the dicing tape T to hold the wafer W through performing a predetermined suction. At least in a partial area along the periphery of the suction face 15, a groove 24 is formed. By sucking through the suction face 15, the inside of the groove 24 becomes negative pressure and the dicing tape T is sunk therein.

Abstract: A sheet S is stuck on the front surface of a wafer W, and the wafer W is supported on a table 20. A peeling tape T is stuck onto a peripheral portion of the sheet S and the peeling tape T is held by a peeling head 13. The peeling head 13 and the table 20 perform a relative movement along guide rails 25, the table 20 rotates a predetermined angle in clockwise and counterclockwise directions alternately via a swing mechanism 21 thereby peeling off the sheet S from the wafer W accompanying a zigzag movement.

Abstract: A sticking apparatus includes a sticking table 21 for supporting a semiconductor wafer W and a sticking unit 24 that peels off an adhesive sheet S1 from a release liner PS and sticks the adhesive sheet to the semiconductor wafer W. The sticking unit 24 has a detector 60. The detector 60 is disposed above a feed-out path of a raw strip sheet L for detecting a displacement amount S of the adhesive sheet S1 in the lateral direction perpendicular to the feed-out direction thereof. When the displacement amount S is detected, a displacement correction device 51 is activated and the sticking table 21 is moved by a distance corresponding to the displacement amount S, thereby the adhesive sheet S1 can be stuck onto the semiconductor wafer W in accordance with the outer shape thereof. The adhesive sheet S1 is stuck onto the wafer W by a sticking roll 61, which is brought into a contact with the release liner PS to impart a pressing force thereto.

Abstract: There is provided a sheet peeling apparatus and a peeling method using a plurality of peeling units. A sheet peeling apparatus for peeling off a sheet stuck on the surface of a semiconductor wafer by using an adhesive tape of a width narrower than that of the sheet, which is equipped with a peeling head for peeling off the sheet by pulling the adhesive tape in an obtuse angled direction in a state stuck to the end portion of the sheet; and first and second rollers for peeling off the sheet by pulling the adhesive tape in the substantially right angle or acute angle direction in a state stuck with the adhesive tape in the direction across the sheet. Either of the peeling units are selectively used in accordance with the type of the sheet.

Abstract: A sticking apparatus 10 includes a sticking table 11 supporting a semiconductor wafer W and a sticking unit 12 sticking a heat sensitive adhesive sheet S to the semiconductor wafer W. The sticking unit 12 includes a peeling section that, when paying out a raw sheet L having adhesive sheet S laminated to one side face of a release liner PS, peels off the release liner PS and the adhesive sheet S and a sheet preliminary peeling unit 40 provided at an upstream side of the peeling section in a pay-out direction of the raw sheet. The sheet preliminary peeling unit 40 includes a moving member 50 that moves to and from in a state of being pinched between the release liner PS and the adhesive sheet S. The preliminarily peeled-off release liner PS and adhesive sheet S are temporarily re-bonded by a temporary re-bonding unit 41, enabling to stick the adhesive sheet S on the wafer W.

Abstract: A raw sheet L, in which a strip-shaped tape base material TB having a die bonding sheet portion DS with a size of substantially corresponding to the shape of a semiconductor wafer W is temporarily stuck to a strip-shaped release liner S, is fed out, and a cut-line detecting device 14 detects whether any cut-line C is already formed on the outer circumference side of the die bonding sheet portion DS, on the pathway of the feeding out. According to the result of detection, the die cutting device 13 lets the raw sheet L pass straight through without forming any cut-line C when the cut-line C is judged to be already formed thereon. On the other hand, the die cutting device 13 forms a cut-line C to form a sticking tape DDT when no cut-line C is detected. The sticking tape DDT is peeled by a peeling device 15 to be stuck to the ring frame RF in the position that the die bonding sheet portion DS is to be corresponding to the semiconductor wafer W.

Abstract: A raw sheet L, in which a strip-shaped tape base material TB having a die bonding sheet portion DS with a size of substantially corresponding to the shape of a semiconductor wafer W is temporarily stuck to a strip-shaped release liner S, is fed out, and the position of the die bonding sheet portion DS is identified on the pathway of feeding out. Based on the identified result, a die cutting device 13 provides a closed-loop-shaped cut-line C to be encircling the die bonding sheet portion DS corresponding to the shape of the ring frame RF to form a sticking tape DDT. The sticking tape DDT is peeled by a peeling device 15 to be stuck to the ring frame RF in the position that the die bonding sheet portion DS is to be corresponding to the semiconductor wafer W.

Abstract: There is provided a sheet peeling apparatus and a peeling method using a plurality of peeling units capable of performing peeling off operation under optimum condition in accordance with the material, thickness or the like of a protective sheet. A sheet peeling apparatus 10 for peeling off a sheet S stuck on the surface of a semiconductor wafer W by using an adhesive tape T of a width narrower than that of the sheet S, which is equipped with a peeling head 15 (second peeling unit) for peeling off the sheet S by pulling the adhesive tape T in an obtuse angled direction in a state stuck to the end portion of the sheet; and first and second rollers 21, 22 (first peeling unit) for peeling off the sheet S by pulling the adhesive tape T in the substantially right angle or acute angle direction in a state stuck with the adhesive tape T in the direction across the sheet S. Either one of the peeling units are selectively used in accordance with the type of the sheet S.

Abstract: A transferring device 10 for transferring plate-like members such as a semiconductor wafer and the like among the first table T1, the second table T2 and the third table T3. The transferring device 10 includes a supporting unit provided with a supporting face for the semiconductor wafer W, and a multi joint robot 12 for transferring the supporting unit 11. The supporting face includes an adhesive sheet S in which an adhesive layer A is laminated on a sheet base material SB, and transferring among the table T1 through T3 can be performed through sticking and peeling operation between the adhesive sheet S and the semiconductor wafer.

Abstract: A sheet S is stuck on the front surface of a wafer W, and the wafer W is supported on a table 20. A peeling tape T is stuck onto a peripheral portion of the sheet S and the peeling tape T is held by a peeling head 13. The peeling head 13 and the table 20 perform a relative movement along guide rails 25, the table 20 rotates a predetermined angle in clockwise and counterclockwise directions alternately via a swing mechanism 21 thereby peeling off the sheet S from the wafer W accompanying a zigzag movement.

Abstract: A sheet peeling apparatus 50 which, after sticking a web material LS laminated with heat sensitive adhesive type adhesive sheet S on a release liner PS to a semiconductor wafer W, cuts the web material along the periphery of a semiconductor wafer and peels off a release liner PS portion positioned on the semiconductor wafer and a web material portion S1 positioned at the periphery side around the semiconductor wafer. The apparatus is equipped with a roll 135 capable of performing a relative movement with respect to the table 47 supporting the wafer W, and is arranged to stick a peeling tape ST to the web material LS with the roll, and then winds to peel off the tape; thus, only the adhesive sheet S is left on the wafer W.

Abstract: A sticking apparatus 10 includes a sticking table 11 supporting a semiconductor wafer W and a Sticking unit 12 sticking a heat sensitive adhesive sheet S to the semiconductor wafer W. The sticking unit 12 includes a peeling section that, when paying out a raw sheet L having adhesive sheet S laminated to one side face of a release liner PS, peels off the release liner PS and the adhesive sheet S and a sheet preliminary peeling unit 40 provided at an upstream side of the peeling section in a pay-out direction of the raw sheet. The sheet preliminary peeling unit 40 includes a moving member 50 that moves to and from in a state of being pinched between the release liner PS and the adhesive sheet S. The preliminarily peeled-off release liner PS and adhesive sheet S are temporarily re-bonded by a temporary re-bonding unit 41, enabling to stick the adhesive sheet S on the wafer W.

Abstract: A wafer W is supported on the rear surface side thereof by a ring frame R by means of a dicing tape T, and a protection tape H is stuck on the front surface side the wafer W. A suction unit 12 includes a table 16 having a suction face 15 in the upper face. The suction face 15 sucks the dicing tape T to hold the wafer W through performing a predetermined suction. At least in a partial area along the periphery of the suction face 15, a groove 24 is formed. By sucking through the suction face 15, the inside of the groove 24 becomes negative pressure and the dicing tape T is sunk therein.